Inventor · disambiguated record
Devarajan Balaraman
Also filed as: BALARAMAN DEVARAJAN
11 granted patents·15 pending applications·41 citations·filing 2006–2025
86Inventor score
Files withWOLFSPEED INC16AMKOR TECHNOLOGY INC4AMKOR TECH SINGAPORE HOLDING PTE LTD2INTEL CORP1LI YONGGANG1
Top patents by PatentIndex Score
26 records- 0193US12224218B2Semiconductor packages with increased power handlingWOLFSPEED INC·Filed 2022·Granted Feb 11, 2025·4 cites·33 claims
- 0292US7749900B2Method and core materials for semiconductor packagingINTEL CORP·Filed 2008·Granted Jul 6, 2010·26 cites·8 claims
- 0391US10304697B2Electronic device with top side pin array and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted May 28, 2019·6 cites·19 claims
- 0477US10832921B2Electronic device with top side pin array and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2019·Granted Nov 10, 2020·1 cites·20 claims
- 0575US2025167007A1Electronic device with top side pin array and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
- 0670US12205827B2Electronic device with top side pin array and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Jan 21, 2025·0 cites·20 claims
- 0766US8456016B2Method and core materials for semiconductor packagingLI YONGGANG·Filed 2010·Granted Jun 4, 2013·1 cites·11 claims
- 0861US12224233B2Packaged electronic devices having dielectric substrates with thermally conductive adhesive layersWOLFSPEED INC·Filed 2021·Granted Feb 11, 2025·0 cites·17 claims
- 0959US2025149432A1Packaged electronic devices having dielectric substrates with thermally conductive adhesive layersWOLFSPEED INC·Filed 2025·Application pending·0 cites
- 1057US8174017B2Integrating three-dimensional high capacitance density structuresPULUGURTHA MARKONDEYA RAJ·Filed 2006·Granted May 8, 2012·3 cites·15 claims
- 1155US10157872B2Semiconductor device and method of manufacturing thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted Dec 18, 2018·0 cites·20 claims
- 1254US2024243031A1Thermal Enhanced Power Semiconductor PackageWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 1354US2024421029A1Semiconductor PackageWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 1454US2025323130A1Wafer-Level Bond-Line ControlWOLFSPEED INC·Filed 2025·Application pending·0 cites
- 1552US2025122413A1Multifunctional Adhesion Promoter for Semiconductor Device PackagesWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 1652US2025105196A1Semiconductor Die BondingWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 1752US2025125231A1Direct Bonded Semiconductor Die PackageWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 1851US10037957B2Semiconductor device and method of manufacturing thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Jul 31, 2018·0 cites·32 claims
- 1949US2025372520A1Power discrete package having symmetric pinouts and process of implementing the sameWOLFSPEED INC·Filed 2024·Application pending·0 cites
- 2048US2025038055A1Submounts with Stud Protrusions for Semiconductor PackagesWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 2147US2024355738A1Power Semiconductor Devices Including Beryllium MetallizationWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 2246US2024258217A1Semiconductor device packages including multilayer stacks with improved adhesionWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 2346US2024274514A1Electroless Die-Attach Process for Semiconductor PackagingWOLFSPEED INC·Filed 2023·Application pending·0 cites
- 2445US2024182757A1Core-Shell Particle Die-Attach MaterialWOLFSPEED INC·Filed 2022·Application pending·0 cites
- 2538US2006269762A1Reactively formed integrated capacitors on organic substrates and fabrication methodsPULUGURTHA MARKONDEYA R·Filed 2006·Application pending·0 cites
- 2632USD1056862SSemiconductor packageWOLFSPEED INC·Filed 2022·Granted Jan 7, 2025·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →