Inventor · disambiguated record
Dexin Liang
Also filed as: LIANG DEXIN
17 granted patents·1 pending application·519 citations·filing 1992–2022
94Inventor score
Files withOLIN CORP5HUIZHOU ZHONGBANG ELECTRIC CO LTD3HUIZHOU ZHONGBANG ELECTRONICS CO LTD2LSI LOGIC CORP2TAIWAN SEMICONDUCTOR MFG2
Top patents by PatentIndex Score
18 records- 0187US5972734AInterposer for ball grid array (BGA) packageLSI LOGIC CORP·Filed 1997·Granted Oct 26, 1999·109 cites·20 claims
- 0286US5639696AMicroelectronic integrated circuit mounted on circuit board with solder column grid array interconnection, and method of fabricating the solder column grid arrayLSI LOGIC CORP·Filed 1996·Granted Jun 17, 1997·85 cites·10 claims
- 0382US5688606AAnodized aluminum substrate having increased breakdown voltageOLIN CORP·Filed 1996·Granted Nov 18, 1997·64 cites·7 claims
- 0478US6222260B1Integrated circuit device with integral decoupling capacitorVLSI TECHNOLOGY INC·Filed 1998·Granted Apr 24, 2001·62 cites·9 claims
- 0573US5455386AChamfered electronic package componentOLIN CORP·Filed 1994·Granted Oct 3, 1995·50 cites·17 claims
- 0672US5534356AAnodized aluminum substrate having increased breakdown voltageOLIN CORP·Filed 1995·Granted Jul 9, 1996·38 cites·5 claims
- 0770US5360942AMulti-chip electronic package module utilizing an adhesive sheetOLIN CORP·Filed 1993·Granted Nov 1, 1994·41 cites·23 claims
- 0863US6207476B1Methods of packaging an integrated circuit and methods of forming an integrated circuit packageVLSI TECHNOLOGY INC·Filed 1999·Granted Mar 27, 2001·21 cites·16 claims
- 0958US6630737B2Integrated circuit package, ball-grid array integrated circuit packageKONINKL PHILIPS ELECTRONICS NV·Filed 1999·Granted Oct 7, 2003·17 cites·4 claims
- 1056US5239131AElectronic package having controlled epoxy flowOLIN CORP·Filed 1992·Granted Aug 24, 1993·27 cites·20 claims
- 1155USRE42457EMethods of packaging an integrated circuit and methods of forming an integrated circuit packageTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted Jun 14, 2011·0 cites·38 claims
- 1255USRE42332EIntegrated circuit package, ball-grid array integrated circuit packageTAIWAN SEMICONDUCTOR MFG·Filed 2009·Granted May 10, 2011·0 cites·26 claims
- 1348US11469547B2Rotary coupling structure, power supply device and sofaHUIZHOU ZHONGBANG ELECTRONICS CO LTD·Filed 2020·Granted Oct 11, 2022·0 cites·10 claims
- 1447US12431674B2Power adaption deviceHUIZHOU ZHONGBANG ELECTRONICS CO LTD·Filed 2022·Granted Sep 30, 2025·0 cites·16 claims
- 1545US2020106064A1Detachable combined lithium battery power supplyHUIZHOU ZHONGBANG ELECTRIC CO LTD·Filed 2019·Application pending·0 cites
- 1640USD904300SPower adapterHUIZHOU ZHONGBANG ELECTRIC CO LTD·Filed 2019·Granted Dec 8, 2020·3 cites·1 claims
- 1736USD895548SPower adapterHUIZHOU ZHONGBANG ELECTRIC CO LTD·Filed 2019·Granted Sep 8, 2020·2 cites·1 claims
- 1835US10236715B2Switch power circuit with backup battery for power supplyLIANG DEXIN·Filed 2016·Granted Mar 19, 2019·0 cites·3 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →