Inventor · disambiguated record
Diana Xiaobing Ma
Also filed as: MA DIANA · MA DIANA X · MA DIANA XIAOBING
44 granted patents·7 pending applications·4,058 citations·filing 1994–2019
99Inventor score
Top patents by PatentIndex Score
51 records- 0198US6080529AMethod of etching patterned layers useful as masking during subsequent etching or for damascene structuresAPPLIED MATERIALS INC·Filed 1998·Granted Jun 27, 2000·551 cites·9 claims
- 0297US6547977B1Method for etching low k dielectricsAPPLIED MATERIALS INC·Filed 2000·Granted Apr 15, 2003·320 cites·32 claims
- 0397US6352611B1Ceramic composition for an apparatus and method for processing a substrateAPPLIED MATERIALS INC·Filed 2000·Granted Mar 5, 2002·97 cites·22 claims
- 0497US6123791ACeramic composition for an apparatus and method for processing a substrateAPPLIED MATERIALS INC·Filed 1998·Granted Sep 26, 2000·118 cites·52 claims
- 0596US6458516B1Method of etching dielectric layers using a removable hardmaskAPPLIED MATERIALS INC·Filed 2000·Granted Oct 1, 2002·113 cites·23 claims
- 0696US6352049B1Plasma assisted processing chamber with separate control of species densityAPPLIED MATERIALS INC·Filed 1998·Granted Mar 5, 2002·498 cites·24 claims
- 0796US6331380B1Method of pattern etching a low K dielectric layerAPPLIED MATERIALS INC·Filed 2000·Granted Dec 18, 2001·159 cites·44 claims
- 0896US6189484B1Plasma reactor having a helicon wave high density plasma sourceAPPLIED MATERIALS INC·Filed 1999·Granted Feb 20, 2001·116 cites·44 claims
- 0996US5756400AMethod and apparatus for cleaning by-products from plasma chamber surfacesAPPLIED MATERIALS INC·Filed 1995·Granted May 26, 1998·407 cites·13 claims
- 1095US6143476AMethod for high temperature etching of patterned layers using an organic mask stackAPPLIED MATERIALS INC·Filed 1997·Granted Nov 7, 2000·186 cites·37 claims
- 1194US6829056B1Monitoring dimensions of features at different locations in the processing of substratesFiled 2003·Granted Dec 7, 2004·107 cites·19 claims
- 1294US5710486AInductively and multi-capacitively coupled plasma reactorAPPLIED MATERIALS INC·Filed 1995·Granted Jan 20, 1998·139 cites·31 claims
- 1393US9222193B2Non-permeable substrate carrier for electroplatingSUNPOWER CORP·Filed 2012·Granted Dec 29, 2015·21 cites·8 claims
- 1493US8317987B2Non-permeable substrate carrier for electroplatingABAS EMMANUEL CHUA·Filed 2010·Granted Nov 27, 2012·28 cites·15 claims
- 1593US6949203B2System level in-situ integrated dielectric etch process particularly useful for copper dual damasceneAPPLIED MATERIALS INC·Filed 2003·Granted Sep 27, 2005·69 cites·46 claims
- 1693US6270687B1RF plasma methodAPPLIED MATERIALS INC·Filed 2000·Granted Aug 7, 2001·42 cites·28 claims
- 1792US8221601B2Maintainable substrate carrier for electroplatingCHEN CHEN-AN·Filed 2010·Granted Jul 17, 2012·29 cites·20 claims
- 1892US6592707B2Corrosion-resistant protective coating for an apparatus and method for processing a substrateAPPLIED MATERIALS INC·Filed 2001·Granted Jul 15, 2003·63 cites·31 claims
- 1992US6071372ARF plasma etch reactor with internal inductive coil antenna and electrically conductive chamber wallsAPPLIED MATERIALS INC·Filed 1997·Granted Jun 6, 2000·69 cites·49 claims
- 2088US5968847AProcess for copper etch backAPPLIED MATERIALS INC·Filed 1998·Granted Oct 19, 1999·94 cites·23 claims
- 2187US6641697B2Substrate processing using a member comprising an oxide of a group IIIB metalAPPLIED MATERIALS INC·Filed 2001·Granted Nov 4, 2003·53 cites·19 claims
- 2287US5817534ARF plasma reactor with cleaning electrode for cleaning during processing of semiconductor wafersAPPLIED MATERIALS INC·Filed 1995·Granted Oct 6, 1998·94 cites·23 claims
- 2383US6372633B1Method and apparatus for forming metal interconnectsAPPLIED MATERIALS INC·Filed 1998·Granted Apr 16, 2002·58 cites·10 claims
- 2483US5777289ARF plasma reactor with hybrid conductor and multi-radius dome ceilingAPPLIED MATERIALS INC·Filed 1996·Granted Jul 7, 1998·35 cites·13 claims
- 2582US6569775B1Method for enhancing plasma processing performanceAPPLIED MATERIALS INC·Filed 2000·Granted May 27, 2003·28 cites·28 claims
- 2681US6547978B2Method of heating a semiconductor substrateAPPLIED MATERIALS INC·Filed 2001·Granted Apr 15, 2003·26 cites·18 claims
- 2781US6020686AInductively and multi-capacitively coupled plasma reactorAPPLIED MATERIALS INC·Filed 1997·Granted Feb 1, 2000·52 cites·18 claims
- 2881US5891348AProcess gas focusing apparatus and methodAPPLIED MATERIALS INC·Filed 1996·Granted Apr 6, 1999·61 cites·54 claims
- 2980US5779926APlasma process for etching multicomponent alloysAPPLIED MATERIALS INC·Filed 1996·Granted Jul 14, 1998·62 cites·35 claims
- 3079US6008140ACopper etch using HCI and HBr chemistryAPPLIED MATERIALS INC·Filed 1997·Granted Dec 28, 1999·47 cites·8 claims
- 3177US6248250B1RF plasma reactor with hybrid conductor and multi-radius dome ceilingAPPLIED MATERIALS INC·Filed 1997·Granted Jun 19, 2001·29 cites·31 claims
- 3277US6153530APost-etch treatment of plasma-etched feature surfaces to prevent corrosionAPPLIED MATERIALS INC·Filed 1999·Granted Nov 28, 2000·58 cites·30 claims
- 3376USRE46088EMaintainable substrate carrier for electroplatingSUNPOWER CORP·Filed 2015·Granted Aug 2, 2016·2 cites·20 claims
- 3475US6534416B1Control of patterned etching in semiconductor featuresAPPLIED MATERIALS INC·Filed 2000·Granted Mar 18, 2003·15 cites·7 claims
- 3574US6466881B1Method for monitoring the quality of a protective coating in a reactor chamberAPPLIED MATERIALS INC·Filed 1999·Granted Oct 15, 2002·40 cites·3 claims
- 3673US6296780B1System and method for etching organic anti-reflective coating from a substrateAPPLIED MATERIALS INC·Filed 1997·Granted Oct 2, 2001·44 cites·11 claims
- 3771US6010603APatterned copper etch for micron and submicron features, using enhanced physical bombardmentAPPLIED MATERIALS INC·Filed 1997·Granted Jan 4, 2000·34 cites·38 claims
- 3864US6488862B1Etched patterned copper features free from etch process residueAPPLIED MATERIALS INC·Filed 1999·Granted Dec 3, 2002·23 cites·4 claims
- 3959US11280019B2Non-permeable substrate carrier for electroplatingSUNPOWER CORP·Filed 2019·Granted Mar 22, 2022·0 cites·20 claims
- 4059US6620289B1Method and apparatus for asymmetric gas distribution in a semiconductor wafer processing systemAPPLIED MATERIALS INC·Filed 1999·Granted Sep 16, 2003·22 cites·9 claims
- 4153US6413389B1Method for recovering metal from etch by-productsAPPLIED MATERIALS INC·Filed 1999·Granted Jul 2, 2002·9 cites·16 claims
- 4253US5783101AHigh etch rate residue free metal etch process with low frequency high power inductive coupled plasmaAPPLIED MATERIALS INC·Filed 1994·Granted Jul 21, 1998·21 cites·31 claims
- 4348US6489247B1Copper etch using HCl and HBR chemistryAPPLIED MATERIALS INC·Filed 1999·Granted Dec 3, 2002·11 cites·42 claims
- 4448US2016108541A1Non-permeable substrate carrier for electroplatingSUNPOWER CORP·Filed 2015·Application pending·0 cites
- 4548US2009139657A1Etch systemAPPLIED MATERIALS INC·Filed 2008·Application pending·0 cites
- 4642US2009004875A1Methods of trimming amorphous carbon film for forming ultra thin structures on a substrateSHEN MEIHUA·Filed 2008·Application pending·0 cites
- 4740US2007284668A1CMOS S/D SiGe DEVICE MADE WITH ALTERNATIVE INTEGRATION PROCESSAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 4840US2007287244A1ALTERNATIVE INTEGRATION SCHEME FOR CMOS S/D SiGe PROCESSAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 4940US2002058408A1Method and apparatus for forming metal interconnectsAPPLIED MATERIALS INC·Filed 2002·Application pending·0 cites
- 5037US6635577B1Method for reducing topography dependent charging effects in a plasma enhanced semiconductor wafer processing systemAPPLIED MATERIALS INC·Filed 1999·Granted Oct 21, 2003·8 cites·21 claims
Showing the top 50 of 51 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →