Inventor · disambiguated record
Dmitry Lubomirsky
Also filed as: LUBOMIRSKY DMITRY
223 granted patents·83 pending applications·8,995 citations·filing 1998–2024
99Inventor score
Files withAPPLIED MATERIALS INC282LUBOMIRSKY DMITRY12NEMANI SRINIVAS D3RASHEED MUHAMMAD M2YANG JANG-GYOO2
Top patents by PatentIndex Score
306 records- 0199US10062585B2Oxygen compatible plasma sourceAPPLIED MATERIALS INC·Filed 2016·Granted Aug 28, 2018·102 cites·15 claims
- 0299US9934942B1Chamber with flow-through sourceAPPLIED MATERIALS INC·Filed 2016·Granted Apr 3, 2018·108 cites·19 claims
- 0399US9607856B2Selective titanium nitride removalAPPLIED MATERIALS INC·Filed 2015·Granted Mar 28, 2017·126 cites·18 claims
- 0499US9212099B2Heat treated ceramic substrate having ceramic coating and heat treatment for coated ceramicsAPPLIED MATERIALS INC·Filed 2013·Granted Dec 15, 2015·56 cites·15 claims
- 0599US9144147B2Semiconductor processing system and methods using capacitively coupled plasmaAPPLIED MATERIALS INC·Filed 2013·Granted Sep 22, 2015·188 cites·11 claims
- 0699US9090046B2Ceramic coated article and process for applying ceramic coatingAPPLIED MATERIALS INC·Filed 2013·Granted Jul 28, 2015·68 cites·12 claims
- 0799US9040422B2Selective titanium nitride removalAPPLIED MATERIALS INC·Filed 2013·Granted May 26, 2015·194 cites·19 claims
- 0899US8357435B2Flowable dielectric equipment and processesAPPLIED MATERIALS INC·Filed 2008·Granted Jan 22, 2013·160 cites·5 claims
- 0998US10923367B2Process chamber for etching low K and other dielectric filmsAPPLIED MATERIALS INC·Filed 2018·Granted Feb 16, 2021·41 cites·34 claims
- 1098US10354843B2Chemical control features in wafer process equipmentAPPLIED MATERIALS INC·Filed 2017·Granted Jul 16, 2019·40 cites·20 claims
- 1198US9991134B2Processing systems and methods for halide scavengingAPPLIED MATERIALS INC·Filed 2014·Granted Jun 5, 2018·100 cites·17 claims
- 1298US9978564B2Chemical control features in wafer process equipmentAPPLIED MATERIALS INC·Filed 2015·Granted May 22, 2018·106 cites·13 claims
- 1398US9892888B2Particle generation suppresor by DC bias modulationAPPLIED MATERIALS INC·Filed 2017·Granted Feb 13, 2018·26 cites·12 claims
- 1498US9885117B2Conditioned semiconductor system partsAPPLIED MATERIALS INC·Filed 2015·Granted Feb 6, 2018·108 cites·14 claims
- 1598US9837249B2Radial waveguide systems and methods for post-match control of microwavesAPPLIED MATERIALS INC·Filed 2016·Granted Dec 5, 2017·111 cites·20 claims
- 1698US9773648B2Dual discharge modes operation for remote plasmaAPPLIED MATERIALS INC·Filed 2014·Granted Sep 26, 2017·114 cites·20 claims
- 1798US9741593B2Thermal management systems and methods for wafer processing systemsAPPLIED MATERIALS INC·Filed 2015·Granted Aug 22, 2017·115 cites·17 claims
- 1898US9728437B2High temperature chuck for plasma processing systemsAPPLIED MATERIALS INC·Filed 2015·Granted Aug 8, 2017·123 cites·14 claims
- 1998US9704723B2Processing systems and methods for halide scavengingAPPLIED MATERIALS INC·Filed 2015·Granted Jul 11, 2017·114 cites·17 claims
- 2098US9659792B2Processing systems and methods for halide scavengingAPPLIED MATERIALS INC·Filed 2015·Granted May 23, 2017·125 cites·13 claims
- 2198US9593421B2Particle generation suppressor by DC bias modulationAPPLIED MATERIALS INC·Filed 2014·Granted Mar 14, 2017·63 cites·10 claims
- 2298US9564296B2Radial waveguide systems and methods for post-match control of microwavesAPPLIED MATERIALS INC·Filed 2016·Granted Feb 7, 2017·129 cites·20 claims
- 2398US9499898B2Layered thin film heater and method of fabricationAPPLIED MATERIALS INC·Filed 2014·Granted Nov 22, 2016·130 cites·11 claims
- 2498US9449850B2Processing systems and methods for halide scavengingAPPLIED MATERIALS INC·Filed 2015·Granted Sep 20, 2016·135 cites·18 claims
- 2598US9362130B2Enhanced etching processes using remote plasma sourcesAPPLIED MATERIALS INC·Filed 2014·Granted Jun 7, 2016·138 cites·15 claims
- 2698US9355922B2Systems and methods for internal surface conditioning in plasma processing equipmentAPPLIED MATERIALS INC·Filed 2014·Granted May 31, 2016·150 cites·17 claims
- 2798US9299537B2Radial waveguide systems and methods for post-match control of microwavesAPPLIED MATERIALS INC·Filed 2014·Granted Mar 29, 2016·160 cites·15 claims
- 2898US9299538B2Radial waveguide systems and methods for post-match control of microwavesAPPLIED MATERIALS INC·Filed 2014·Granted Mar 29, 2016·154 cites·15 claims
- 2998US9184055B2Processing systems and methods for halide scavengingAPPLIED MATERIALS INC·Filed 2014·Granted Nov 10, 2015·181 cites·20 claims
- 3098US9153442B2Processing systems and methods for halide scavengingAPPLIED MATERIALS INC·Filed 2014·Granted Oct 6, 2015·220 cites·13 claims
- 3198US9132436B2Chemical control features in wafer process equipmentAPPLIED MATERIALS INC·Filed 2013·Granted Sep 15, 2015·198 cites·19 claims
- 3298US9117855B2Polarity control for remote plasmaAPPLIED MATERIALS INC·Filed 2014·Granted Aug 25, 2015·184 cites·15 claims
- 3398US9093389B2Method of patterning a silicon nitride dielectric filmAPPLIED MATERIALS INC·Filed 2014·Granted Jul 28, 2015·104 cites·19 claims
- 3498US9093371B2Processing systems and methods for halide scavengingAPPLIED MATERIALS INC·Filed 2014·Granted Jul 28, 2015·184 cites·17 claims
- 3598US9068265B2Gas distribution plate with discrete protective elementsLUBOMIRSKY DMITRY·Filed 2012·Granted Jun 30, 2015·75 cites·20 claims
- 3698US9023732B2Processing systems and methods for halide scavengingAPPLIED MATERIALS INC·Filed 2014·Granted May 5, 2015·187 cites·14 claims
- 3798US8802572B2Method of patterning a low-k dielectric filmAPPLIED MATERIALS INC·Filed 2013·Granted Aug 12, 2014·115 cites·20 claims
- 3898US7465358B2Measurement techniques for controlling aspects of a electroless deposition processAPPLIED MATERIALS INC·Filed 2004·Granted Dec 16, 2008·235 cites·1 claims
- 3997US10504697B2Particle generation suppresor by DC bias modulationAPPLIED MATERIALS INC·Filed 2017·Granted Dec 10, 2019·8 cites·13 claims
- 4097US10256079B2Semiconductor processing systems having multiple plasma configurationsAPPLIED MATERIALS INC·Filed 2013·Granted Apr 9, 2019·42 cites·23 claims
- 4197US9966240B2Systems and methods for internal surface conditioning assessment in plasma processing equipmentAPPLIED MATERIALS INC·Filed 2014·Granted May 8, 2018·101 cites·12 claims
- 4297US9659753B2Grooved insulator to reduce leakage currentAPPLIED MATERIALS INC·Filed 2014·Granted May 23, 2017·123 cites·12 claims
- 4397US9343289B2Chemistry compatible coating material for advanced device on-wafer particle performanceAPPLIED MATERIALS INC·Filed 2013·Granted May 17, 2016·26 cites·15 claims
- 4497US9165783B2Method of patterning a low-k dielectric filmNEMANI SRINIVAS D·Filed 2013·Granted Oct 20, 2015·118 cites·17 claims
- 4597US8941969B2Single-body electrostatic chuckAPPLIED MATERIALS INC·Filed 2012·Granted Jan 27, 2015·44 cites·20 claims
- 4697US8937800B2Electrostatic chuck with advanced RF and temperature uniformityLUBOMIRSKY DMITRY·Filed 2013·Granted Jan 20, 2015·305 cites·20 claims
- 4797US7989365B2Remote plasma source seasoningAPPLIED MATERIALS INC·Filed 2009·Granted Aug 2, 2011·621 cites·23 claims
- 4897US7341633B2Apparatus for electroless depositionAPPLIED MATERIALS INC·Filed 2004·Granted Mar 11, 2008·230 cites·23 claims
- 4997US6673199B1Shaping a plasma with a magnetic field to control etch rate uniformityAPPLIED MATERIALS INC·Filed 2001·Granted Jan 6, 2004·107 cites·39 claims
- 5096US11728139B2Process chamber for cyclic and selective material removal and etchingAPPLIED MATERIALS INC·Filed 2021·Granted Aug 15, 2023·3 cites·18 claims
Showing the top 50 of 306 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →