Inventor · disambiguated record
Douglas Albert
Also filed as: ALBERT DOUGLAS · ALBERT DOUGLAS M · ALBERT DOUGLAS N
2 granted patents·2 pending applications·12 citations·filing 2003–2010
55Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0180US7786562B2Stackable semiconductor chip layer comprising prefabricated trench interconnect viasOZGUZ VOLKAN·Filed 2005·Granted Aug 31, 2010·11 cites·34 claims
- 0241US2010291735A1Stackable semiconductor chip layer comprising prefabricated trench interconnect viasOZGUZ VOLKAN·Filed 2010·Application pending·0 cites
- 0338US7872339B2Vertically stacked pre-packaged integrated circuit chipsGANN KEITH·Filed 2004·Granted Jan 18, 2011·1 cites·36 claims
- 0435US2004113222A1Stacked microelectronic module with vertical interconnect viasOZGUZ VOLKAN H·Filed 2003·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Douglas Albert files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →