Inventor · disambiguated record
Doyle E. Bennett
Also filed as: BENNETT DOYLE · BENNETT DOYLE E
39 granted patents·9 pending applications·769 citations·filing 1998–2023
98Inventor score
Top patents by PatentIndex Score
48 records- 0196US9281253B2Determination of gain for eddy current sensorAPPLIED MATERIALS INC·Filed 2013·Granted Mar 8, 2016·28 cites·13 claims
- 0296US5984769APolishing pad having a grooved pattern for use in a chemical mechanical polishing apparatusAPPLIED MATERIALS INC·Filed 1998·Granted Nov 16, 1999·142 cites·15 claims
- 0395US8393940B2Molding windows in thin padsSWEDEK BOGUSLAW A·Filed 2010·Granted Mar 12, 2013·15 cites·13 claims
- 0493US9636797B2Adjusting eddy current measurementsAPPLIED MATERIALS INC·Filed 2014·Granted May 2, 2017·11 cites·19 claims
- 0593US7621798B1Reducing polishing pad deformationAPPLIED MATERIALS INC·Filed 2007·Granted Nov 24, 2009·19 cites·16 claims
- 0693US7247080B1Feedback controlled polishing processesAPPLIED MATERIALS INC·Filed 2006·Granted Jul 24, 2007·29 cites·7 claims
- 0792US7024268B1Feedback controlled polishing processesAPPLIED MATERIALS INC·Filed 2003·Granted Apr 4, 2006·43 cites·9 claims
- 0891US8408965B2Eddy current gain compensationBENNETT DOYLE E·Filed 2009·Granted Apr 2, 2013·21 cites·17 claims
- 0991US7074109B1Chemical mechanical polishing control system and methodAPPLIED MATERIALS INC·Filed 2004·Granted Jul 11, 2006·50 cites·24 claims
- 1090US6273806B1Polishing pad having a grooved pattern for use in a chemical mechanical polishing apparatusAPPLIED MATERIALS INC·Filed 1999·Granted Aug 14, 2001·111 cites·16 claims
- 1189US6645061B1Polishing pad having a grooved pattern for use in chemical mechanical polishingAPPLIED MATERIALS INC·Filed 1999·Granted Nov 11, 2003·56 cites·28 claims
- 1288US9227293B2Multi-platen multi-head polishing architectureAPPLIED MATERIALS INC·Filed 2013·Granted Jan 5, 2016·6 cites·19 claims
- 1387US11658078B2Using a trained neural network for use in in-situ monitoring during polishing and polishing systemAPPLIED MATERIALS INC·Filed 2021·Granted May 23, 2023·1 cites·17 claims
- 1487US6371836B1Groove cleaning device for chemical-mechanical polishingAPPLIED MATERIALS INC·Filed 2000·Granted Apr 16, 2002·26 cites·9 claims
- 1586US9205527B2In-situ monitoring system with monitoring of elongated regionAPPLIED MATERIALS INC·Filed 2013·Granted Dec 8, 2015·7 cites·19 claims
- 1684US8535121B2Retaining ring and articles for carrier headAPPLIED MATERIALS INC·Filed 2013·Granted Sep 17, 2013·3 cites·18 claims
- 1784US8157614B2Method of making and apparatus having windowless polishing pad and protected fiberZHANG JIMIN·Filed 2009·Granted Apr 17, 2012·8 cites·21 claims
- 1883US12136574B2Technique for training neural network for use in in-situ monitoring during polishing and polishing systemAPPLIED MATERIALS INC·Filed 2023·Granted Nov 5, 2024·0 cites·17 claims
- 1983US6135868AGroove cleaning device for chemical-mechanical polishingAPPLIED MATERIALS INC·Filed 1998·Granted Oct 24, 2000·49 cites·10 claims
- 2081US12057354B2Trained neural network in in-situ monitoring during polishing and polishing systemAPPLIED MATERIALS INC·Filed 2023·Granted Aug 6, 2024·0 cites·21 claims
- 2181US7354334B1Reducing polishing pad deformationAPPLIED MATERIALS INC·Filed 2005·Granted Apr 8, 2008·7 cites·20 claims
- 2281US6572453B1Multi-fluid polishing processAPPLIED MATERIALS INC·Filed 2000·Granted Jun 3, 2003·25 cites·20 claims
- 2380US6945845B2Chemical mechanical polishing apparatus with non-conductive elementsAPPLIED MATERIALS INC·Filed 2003·Granted Sep 20, 2005·20 cites·16 claims
- 2478US9056383B2Path for probe of spectrographic metrology systemAPPLIED MATERIALS INC·Filed 2013·Granted Jun 16, 2015·3 cites·15 claims
- 2575US10556315B2Determination of gain for eddy current sensorAPPLIED MATERIALS INC·Filed 2019·Granted Feb 11, 2020·1 cites·19 claims
- 2674US11791224B2Technique for training neural network for use in in-situ monitoring during polishing and polishing systemAPPLIED MATERIALS INC·Filed 2021·Granted Oct 17, 2023·0 cites·16 claims
- 2774US6991516B1Chemical mechanical polishing with multi-stage monitoring of metal clearingAPPLIED MATERIALS INC·Filed 2004·Granted Jan 31, 2006·16 cites·49 claims
- 2873US6220941B1Method of post CMP defect stability improvementAPPLIED MATERIALS INC·Filed 1998·Granted Apr 24, 2001·35 cites·21 claims
- 2971US8376813B2Retaining ring and articles for carrier headAPPLIED MATERIALS INC·Filed 2010·Granted Feb 19, 2013·1 cites·6 claims
- 3071US7494929B2Automatic gain controlAPPLIED MATERIALS INC·Filed 2006·Granted Feb 24, 2009·3 cites·22 claims
- 3170US10207386B2Determination of gain for eddy current sensorAPPLIED MATERIALS INC·Filed 2016·Granted Feb 19, 2019·1 cites·16 claims
- 3270US9221147B2Endpointing with selective spectral monitoringQIAN JUN·Filed 2012·Granted Dec 29, 2015·2 cites·24 claims
- 3366US8187977B2Automatic gain controlSWEDEK BOGUSLAW A·Filed 2009·Granted May 29, 2012·2 cites·15 claims
- 3465US7255637B2Carrier head vibration dampingAPPLIED MATERIALS INC·Filed 2001·Granted Aug 14, 2007·7 cites·9 claims
- 3560US6251001B1Substrate polishing with reduced contaminationAPPLIED MATERIALS INC·Filed 1999·Granted Jun 26, 2001·21 cites·12 claims
- 3660US2016101497A1Multi-Platen Multi-Head Polishing ArchitectureAPPLIED MATERIALS INC·Filed 2015·Application pending·0 cites
- 3756US8465342B2Method of making and apparatus having windowless polishing pad and protected fiberZHANG JIMIN·Filed 2012·Granted Jun 18, 2013·0 cites·11 claims
- 3856US2012227903A1Automatic Gain ControlSWEDEK BOGUSLAW A·Filed 2012·Application pending·0 cites
- 3954US12447578B2Compensation for substrate doping in edge reconstruction for in-situ electromagnetic inductive monitoringAPPLIED MATERIALS INC·Filed 2018·Granted Oct 21, 2025·0 cites·24 claims
- 4053US8287330B1Reducing polishing pad deformationBENNETT DOYLE E·Filed 2009·Granted Oct 16, 2012·0 cites·18 claims
- 4153US2008039000A1Reataining ring and articles for carrier headAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 4251US2008020690A1Reducing polishing pad deformationAPPLIED MATERIALS INC·Filed 2007·Application pending·0 cites
- 4347US2014242883A1Determination of wafer angular position for in-sequence metrologyAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 4447US2014242881A1Feed forward parameter values for use in theoretically generating spectraAPPLIED MATERIALS INC·Filed 2013·Application pending·0 cites
- 4545US9275917B2Determination of gain for eddy current sensorAPPLIED MATERIALS INC·Filed 2013·Granted Mar 1, 2016·0 cites·16 claims
- 4642US2006009132A1Chemical mechanical polishing apparatus with non-conductive elementsBENNETT DOYLE E·Filed 2005·Application pending·0 cites
- 4740US2007123046A1Continuous in-line monitoring and qualification of polishing ratesAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 4835US2001029155A1Multi-step conditioning processAPPLIED MATERIALS INC·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →