Inventor · disambiguated record
Dominic J. Benvegnu
Also filed as: BENVEGNU DOMINIC · BENVEGNU DOMINIC J
119 granted patents·22 pending applications·1,325 citations·filing 1997–2025
99Inventor score
Files withAPPLIED MATERIALS INC101DAVID JEFFREY DRUE15BENVEGNU DOMINIC J9SWEDEK BOGUSLAW A5LEE HARRY Q2
Top patents by PatentIndex Score
141 records- 0198US7764377B2Spectrum based endpointing for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2005·Granted Jul 27, 2010·48 cites·32 claims
- 0298US7195535B1Metrology for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2005·Granted Mar 27, 2007·40 cites·30 claims
- 0398US5900130AMethod for sample injection in microchannel deviceACLARA BIOSCIENCES INC·Filed 1997·Granted May 4, 1999·389 cites·18 claims
- 0497US7409260B2Substrate thickness measuring during polishingAPPLIED MATERIALS INC·Filed 2007·Granted Aug 5, 2008·60 cites·19 claims
- 0597US7406394B2Spectra based endpointing for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2005·Granted Jul 29, 2008·38 cites·17 claims
- 0697US7226339B2Spectrum based endpointing for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2005·Granted Jun 5, 2007·26 cites·8 claims
- 0796US9308618B2Linear prediction for filtering of data during in-situ monitoring of polishingBENVEGNU DOMINIC J·Filed 2012·Granted Apr 12, 2016·19 cites·20 claims
- 0896US9138858B2Thin polishing pad with window and molding processAPPLIED MATERIALS INC·Filed 2013·Granted Sep 22, 2015·12 cites·10 claims
- 0996US8475228B2Polishing pad with partially recessed windowBENVEGNU DOMINIC J·Filed 2011·Granted Jul 2, 2013·16 cites·17 claims
- 1096US8260446B2Spectrographic monitoring of a substrate during processing using index valuesDAVID JEFFREY DRUE·Filed 2010·Granted Sep 4, 2012·14 cites·7 claims
- 1195US11847776B2System using film thickness estimation from machine learning based processing of substrate imagesAPPLIED MATERIALS INC·Filed 2021·Granted Dec 19, 2023·4 cites·18 claims
- 1295US10325364B2Thickness measurement of substrate using color metrologyAPPLIED MATERIALS INC·Filed 2017·Granted Jun 18, 2019·8 cites·20 claims
- 1395US8393940B2Molding windows in thin padsSWEDEK BOGUSLAW A·Filed 2010·Granted Mar 12, 2013·15 cites·13 claims
- 1495US8088298B2Spectra based endpointing for chemical mechanical polishingSWEDEK BOGUSLAW A·Filed 2008·Granted Jan 3, 2012·25 cites·12 claims
- 1595US7306507B2Polishing pad assembly with glass or crystalline windowAPPLIED MATERIALS INC·Filed 2005·Granted Dec 11, 2007·17 cites·6 claims
- 1695US7210980B2Sealed polishing pad, system and methodsAPPLIED MATERIALS INC·Filed 2005·Granted May 1, 2007·20 cites·12 claims
- 1795US7112119B1Sealed polishing pad methodsAPPLIED MATERIALS INC·Filed 2006·Granted Sep 26, 2006·29 cites·13 claims
- 1894US9490186B2Limiting adjustment of polishing rates during substrate polishingAPPLIED MATERIALS INC·Filed 2013·Granted Nov 8, 2016·15 cites·18 claims
- 1994US9117751B2Endpointing detection for chemical mechanical polishing based on spectrometryAPPLIED MATERIALS INC·Filed 2013·Granted Aug 25, 2015·8 cites·19 claims
- 2094US8563335B1Method of controlling polishing using in-situ optical monitoring and fourier transformBENVEGNU DOMINIC J·Filed 2012·Granted Oct 22, 2013·16 cites·17 claims
- 2194US8562389B2Thin polishing pad with window and molding processBENVEGNU DOMINIC J·Filed 2008·Granted Oct 22, 2013·20 cites·22 claims
- 2294US8039397B2Using optical metrology for within wafer feed forward process controlAPPLIED MATERIALS INC·Filed 2009·Granted Oct 18, 2011·20 cites·24 claims
- 2394US7774086B2Substrate thickness measuring during polishingAPPLIED MATERIALS INC·Filed 2008·Granted Aug 10, 2010·22 cites·19 claims
- 2493US8944884B2Fitting of optical model to measured spectrumDAVID JEFFREY DRUE·Filed 2013·Granted Feb 3, 2015·10 cites·20 claims
- 2593US8292693B2Using optical metrology for wafer to wafer feed back process controlDAVID JEFFREY DRUE·Filed 2009·Granted Oct 23, 2012·16 cites·24 claims
- 2692US11836913B2Film thickness estimation from machine learning based processing of substrate imagesAPPLIED MATERIALS INC·Filed 2021·Granted Dec 5, 2023·2 cites·20 claims
- 2792US8992286B2Weighted regression of thickness maps from spectral dataAPPLIED MATERIALS INC·Filed 2013·Granted Mar 31, 2015·9 cites·20 claims
- 2892US8977379B2Endpoint method using peak location of spectra contour plots versus timeDAVID JEFFREY DRUE·Filed 2010·Granted Mar 10, 2015·8 cites·18 claims
- 2992US7614933B2Polishing pad assembly with glass or crystalline windowAPPLIED MATERIALS INC·Filed 2007·Granted Nov 10, 2009·10 cites·17 claims
- 3092US7513818B2Polishing endpoint detection system and method using friction sensorAPPLIED MATERIALS INC·Filed 2004·Granted Apr 7, 2009·41 cites·24 claims
- 3191US8535115B2Gathering spectra from multiple optical headsDAVID JEFFREY DRUE·Filed 2011·Granted Sep 17, 2013·8 cites·25 claims
- 3291US8352061B2Semi-quantitative thickness determinationAPPLIED MATERIALS INC·Filed 2008·Granted Jan 8, 2013·14 cites·21 claims
- 3391US8125654B2Methods and apparatus for measuring substrate edge thickness during polishingBENVEGNU DOMINIC J·Filed 2009·Granted Feb 28, 2012·19 cites·16 claims
- 3491US7998358B2Peak-based endpointing for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2006·Granted Aug 16, 2011·14 cites·18 claims
- 3591US7952708B2High throughput measurement systemAPPLIED MATERIALS INC·Filed 2008·Granted May 31, 2011·13 cites·21 claims
- 3691US7727049B2Friction sensor for polishing systemAPPLIED MATERIALS INC·Filed 2006·Granted Jun 1, 2010·18 cites·25 claims
- 3790US11100628B2Thickness measurement of substrate using color metrologyAPPLIED MATERIALS INC·Filed 2019·Granted Aug 24, 2021·7 cites·21 claims
- 3890US8657646B2Endpoint detection using spectrum feature trajectoriesBENVEGNU DOMINIC J·Filed 2011·Granted Feb 25, 2014·8 cites·22 claims
- 3990US7942724B2Polishing pad with window having multiple portionsAPPLIED MATERIALS INC·Filed 2007·Granted May 17, 2011·13 cites·22 claims
- 4090US7840375B2Methods and apparatus for generating a library of spectraAPPLIED MATERIALS INC·Filed 2008·Granted Nov 23, 2010·12 cites·23 claims
- 4190US7444198B2Determining physical property of substrateAPPLIED MATERIALS INC·Filed 2006·Granted Oct 28, 2008·17 cites·15 claims
- 4289US12491603B2Passive acoustic monitoring and acoustic sensors for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 2022·Granted Dec 9, 2025·1 cites·19 claims
- 4389US11682114B2Thickness measurement of substrate using color metrologyAPPLIED MATERIALS INC·Filed 2021·Granted Jun 20, 2023·1 cites·11 claims
- 4489US9095952B2Reflectivity measurements during polishing using a cameraAPPLIED MATERIALS INC·Filed 2013·Granted Aug 4, 2015·7 cites·18 claims
- 4589US7547243B2Method of making and apparatus having polishing pad with windowAPPLIED MATERIALS INC·Filed 2007·Granted Jun 16, 2009·15 cites·12 claims
- 4688US9375824B2Adjustment of polishing rates during substrate polishing with predictive filtersAPPLIED MATERIALS INC·Filed 2013·Granted Jun 28, 2016·7 cites·19 claims
- 4788US9227293B2Multi-platen multi-head polishing architectureAPPLIED MATERIALS INC·Filed 2013·Granted Jan 5, 2016·6 cites·19 claims
- 4888US8718810B2Semi-quantitative thickness determinationAPPLIED MATERIALS INC·Filed 2012·Granted May 6, 2014·7 cites·15 claims
- 4988US8202738B2Endpoint method using peak location of modified spectraDAVID JEFFREY DRUE·Filed 2011·Granted Jun 19, 2012·9 cites·20 claims
- 5088US7163437B1System with sealed polishing padAPPLIED MATERIALS INC·Filed 2006·Granted Jan 16, 2007·12 cites·15 claims
Showing the top 50 of 141 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →