Inventor · disambiguated record
Donald Ferrier
Also filed as: FERRIER DONALD · FERRIER DONALD R · KUKANSKIS PETER E
33 granted patents·1 pending application·1,011 citations·filing 1978–2012
98Inventor score
Top patents by PatentIndex Score
34 records- 0196US5869130AProcess for improving the adhesion of polymeric materials to metal surfacesMACDERMID INC·Filed 1997·Granted Feb 9, 1999·149 cites·20 claims
- 0292US4209331AElectroless copper composition solution using a hypophosphite reducing agentMACDERMID INC·Filed 1978·Granted Jun 24, 1980·49 cites·20 claims
- 0391US6554948B1Process for improving the adhesion of polymeric materials to metal surfacesFiled 2000·Granted Apr 29, 2003·36 cites·29 claims
- 0490US4279948AElectroless copper deposition solution using a hypophosphite reducing agentMACDERMID INC·Filed 1979·Granted Jul 21, 1981·44 cites·15 claims
- 0589US6383272B1Process for improving the adhesion of polymeric materials to metal surfacesFiled 2000·Granted May 7, 2002·32 cites·48 claims
- 0686US5733599AMethod for enhancing the solderability of a surfaceMACDERMID INC·Filed 1996·Granted Mar 31, 1998·53 cites·8 claims
- 0785US5935640AMethod for enhancing the solderability of a surfaceMACDERMID INC·Filed 1997·Granted Aug 10, 1999·46 cites·5 claims
- 0885US4976990AProcess for metallizing non-conductive substratesMACDERMID INC·Filed 1989·Granted Dec 11, 1990·65 cites·14 claims
- 0983USRE45881EMethod for enhancing the solderability of a surfaceREDLINE RONALD·Filed 2012·Granted Feb 9, 2016·2 cites·8 claims
- 1082USRE45297EMethod for enhancing the solderability of a surfaceREDLINE RONALD·Filed 2012·Granted Dec 23, 2014·2 cites·7 claims
- 1180US6419784B1Process for improving the adhesion of polymeric materials to metal surfacesFiled 2000·Granted Jul 16, 2002·25 cites·17 claims
- 1279US6146701AProcess for improving the adhension of polymeric materials to metal surfacesMACDERMID INC·Filed 1999·Granted Nov 14, 2000·45 cites·13 claims
- 1379US4748104ASelective metallization process and additive method for manufactured printed circuit boardsMACDERMID INC·Filed 1986·Granted May 31, 1988·26 cites·18 claims
- 1476US5759378AProcess for preparing a non-conductive substrate for electroplatingMACDERMID INC·Filed 1997·Granted Jun 2, 1998·32 cites·16 claims
- 1574US6162503AProcess for improving the adhesion of polymeric materials to metal surfacesMACDERMID INC·Filed 1999·Granted Dec 19, 2000·37 cites·16 claims
- 1674US5632927AProcess for preparing a non-conductive substrate for electroplatingMACDERMID INC·Filed 1996·Granted May 27, 1997·24 cites·12 claims
- 1773USRE45842EMethod for enhancing the solderability of a surfaceREDLINE RONALD·Filed 2012·Granted Jan 12, 2016·2 cites·22 claims
- 1873US6503566B2Process for improving the adhesion of polymeric materials to metal surfacesFiled 2002·Granted Jan 7, 2003·10 cites·32 claims
- 1973US4831210AShields for electromagnetic radiationMACDERMID INC·Filed 1987·Granted May 16, 1989·29 cites·12 claims
- 2072US5536386AProcess for preparing a non-conductive substrate for electroplatingMACDERMID INC·Filed 1995·Granted Jul 16, 1996·23 cites·18 claims
- 2172US5468515AComposition and method for selective platingMACDERMID INC·Filed 1994·Granted Nov 21, 1995·31 cites·10 claims
- 2272US4897118ASelective metallization process, additive method for manufacturing printed circuit boards, and composition for use thereinMACDERMID INC·Filed 1987·Granted Jan 30, 1990·18 cites·2 claims
- 2370US6020029AProcess for treating metal surfacesMACDERMID INC·Filed 1998·Granted Feb 1, 2000·35 cites·20 claims
- 2469US5289630AProcess for fabricating multilayer printed circuitsMACDERMID INC·Filed 1991·Granted Mar 1, 1994·35 cites·4 claims
- 2569US4782007AAdditive method for manufacturing printed circuit boards using aqueous alkaline developable and strippable photoresistsMACDERMID INC·Filed 1987·Granted Nov 1, 1988·19 cites·5 claims
- 2669US4325990AElectroless copper deposition solutions with hypophosphite reducing agentMACDERMID INC·Filed 1980·Granted Apr 20, 1982·21 cites·10 claims
- 2768US5261154AProcess for fabricating multilayer printed circuitsMACDERMID INC·Filed 1992·Granted Nov 16, 1993·34 cites·10 claims
- 2866US5518760AComposition and method for selective platingMACDERMID INC·Filed 1995·Granted May 21, 1996·28 cites·9 claims
- 2961US7186305B2Process for improving the adhesion of polymeric materials to metal surfacesFERRIER DONALD·Filed 2002·Granted Mar 6, 2007·11 cites·36 claims
- 3057US4761303AProcess for preparing multilayer printed circuit boardsMACDERMID INC·Filed 1986·Granted Aug 2, 1988·20 cites·28 claims
- 3153US5843517AComposition and method for selective platingMACDERMID INC·Filed 1997·Granted Dec 1, 1998·16 cites·13 claims
- 3246US2006065365A1Melamine-formaldehyde post-dip composition for improving adhesion of metal to polymerFERRIER DONALD R·Filed 2004·Application pending·0 cites
- 3344US5334240AAqueous acidic tin-lead immersion plating bath containing weak acid and weak baseMACDERMID INC·Filed 1990·Granted Aug 2, 1994·9 cites·10 claims
- 3429US5104688APretreatment composition and process for tin-lead immersion platingMACDERMID INC·Filed 1990·Granted Apr 14, 1992·3 cites·13 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →