Inventor · disambiguated record
Dong Jin Kim
Also filed as: KIM DONG · KIM DONG HWAN · KIM DONG HYUN · KIM DONG J
151 granted patents·91 pending applications·466 citations·filing 1994–2025
99Inventor score
Files withKIM DONG-JIN29SAMSUNG ELECTRO MECH16AMKOR TECHNOLOGY INC14AMKOR TECH SINGAPORE HOLDING PTE LTD13KOREA INST SCI & TECH12
Top patents by PatentIndex Score
242 records- 0196US9490231B2Manufacturing method of semiconductor device and semiconductor device thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted Nov 8, 2016·14 cites·20 claims
- 0296US8461760B1Thin film encapsulation for flat panel display device and method of manufacturing thin film encapsulation structureSAMSUNG DISPLAY CO LTD·Filed 2012·Granted Jun 11, 2013·20 cites·13 claims
- 0395US10509095B1System and method for sharing location of vehicleHYUNDAI MOTOR CO LTD·Filed 2019·Granted Dec 17, 2019·11 cites·20 claims
- 0494US9979014B2Composite cathode active material, cathode and lithium battery comprising the same, and preparation method thereofSAMSUNG SDI CO LTD·Filed 2014·Granted May 22, 2018·18 cites·19 claims
- 0594US8946883B2Wafer level fan-out package with a fiducial dieAMKOR TECHNOLOGY INC·Filed 2013·Granted Feb 3, 2015·23 cites·20 claims
- 0693US9898207B2Storage deviceSAMSUNG ELECTRONICS CO LTD·Filed 2016·Granted Feb 20, 2018·19 cites·20 claims
- 0792US10056349B2Manufacturing method of semiconductor device and semiconductor device thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Aug 21, 2018·5 cites·20 claims
- 0892US10008393B2Semiconductor device and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Jun 26, 2018·7 cites·22 claims
- 0991US10784178B2Wafer-level stack chip package and method of manufacturing the sameAMKOR TECHNOLOGY INC·Filed 2015·Granted Sep 22, 2020·7 cites·18 claims
- 1091US10410993B2Manufacturing method of semiconductor device and semiconductor device thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted Sep 10, 2019·4 cites·20 claims
- 1191US7934387B2Air conditionerLG ELECTRONICS INC·Filed 2006·Granted May 3, 2011·39 cites·30 claims
- 1290US12033910B2Wafer-level stack chip package and method of manufacturing the sameAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Jul 9, 2024·2 cites·20 claims
- 1390US9837376B2Manufacturing method of semiconductor device and semiconductor device thereofAMKOR TECHNOLOGY INC·Filed 2016·Granted Dec 5, 2017·4 cites·20 claims
- 1488US12046763B2Battery moduleSK ON CO LTD·Filed 2022·Granted Jul 23, 2024·2 cites·22 claims
- 1588US9818685B2Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layersAMKOR TECHNOLOGY INC·Filed 2016·Granted Nov 14, 2017·4 cites·20 claims
- 1687US12327812B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Jun 10, 2025·0 cites·22 claims
- 1787US10615212B2Fan-out sensor packageSAMSUNG ELECTRO MECH·Filed 2018·Granted Apr 7, 2020·6 cites·21 claims
- 1887US9741701B2Method of manufacturing a package-on-package type semiconductor packageAMKOR TECHNOLOGY INC·Filed 2015·Granted Aug 22, 2017·4 cites·20 claims
- 1987US9676903B2Polyester resin and method for preparing the sameSK CHEMICALS CO LTD·Filed 2016·Granted Jun 13, 2017·4 cites·2 claims
- 2086US11933955B2Method for evaluating quality of grapheneSEOUL NAT UNIV R&DB FOUNDATION·Filed 2021·Granted Mar 19, 2024·1 cites·10 claims
- 2186US9120949B2Polyester binder resin for coating and coating composition containing sameKIM DONG-JIN·Filed 2012·Granted Sep 1, 2015·4 cites·20 claims
- 2284US9991511B2Composite cathode active material, lithium battery including the same, and method of preparing the sameSAMSUNG SDI CO LTD·Filed 2015·Granted Jun 5, 2018·2 cites·9 claims
- 2384US9196863B2Organic light emitting display device and method of manufacturing the sameSAMSUNG DISPLAY CO LTD·Filed 2013·Granted Nov 24, 2015·6 cites·20 claims
- 2484US8815994B2Heat-shrinkable polyester-based single-layer filmKIM YUN JO·Filed 2011·Granted Aug 26, 2014·5 cites·7 claims
- 2584US2024332032A1Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 2684US2024332694A1Battery moduleSK ON CO LTD·Filed 2024·Application pending·0 cites
- 2783US10599494B2Method and system of performing inter-process communication between OS-level containers in user spaceHUAWEI TECH CO LTD·Filed 2016·Granted Mar 24, 2020·4 cites·19 claims
- 2883US8806884B2RefrigeratorPARK SANG-HO·Filed 2009·Granted Aug 19, 2014·12 cites·15 claims
- 2983US6630392B2Method for fabricating flash memory deviceHYNIX SEMICONDUCTOR INC·Filed 2001·Granted Oct 7, 2003·25 cites·21 claims
- 3082US10290621B2Method of manufacturing a package-on-package type semiconductor packageAMKOR TECHNOLOGY INC·Filed 2017·Granted May 14, 2019·2 cites·20 claims
- 3182US7365267B2Ground rod having induction discharge skin-effect plateKIM DONG-JIN·Filed 2007·Granted Apr 29, 2008·7 cites·3 claims
- 3282US7028127B2Method of controlling portable personal device having facilities for storing and playing digital contents by computer and portable personal device operation method thereforSAMSUNG ELECTRONICS CO LTD·Filed 2001·Granted Apr 11, 2006·15 cites·95 claims
- 3381US9388309B2Polyester resin composition and a production method thereforKIM DONG-JIN·Filed 2012·Granted Jul 12, 2016·3 cites·11 claims
- 3481US9054057B2Organic light-emitting display device and method of preparing the sameSAMSUNG DISPLAY CO LTD·Filed 2013·Granted Jun 9, 2015·4 cites·19 claims
- 3580US12255197B2Package-on-package type semiconductor packageAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Mar 18, 2025·0 cites·20 claims
- 3680US2024063380A1Positive Electrode Active Material for Lithium Secondary Battery, Method of Preparing the Same, and Positive Electrode for Lithium Secondary Battery and Lithium Secondary Battery which Include the Positive Electrode Active MaterialLG CHEMICAL LTD·Filed 2023·Application pending·0 cites
- 3779US11135953B2Seat back frame for vehicleHYUNDAI MOTOR CO LTD·Filed 2019·Granted Oct 5, 2021·3 cites·12 claims
- 3879US10892438B2Organic light-emitting display device having an upper substrate formed by a metal and method of fabricating the sameLG DISPLAY CO LTD·Filed 2018·Granted Jan 12, 2021·2 cites·12 claims
- 3979US10748828B2Fan-out sensor packageSAMSUNG ELECTRO MECH·Filed 2018·Granted Aug 18, 2020·3 cites·11 claims
- 4079US7459618B2Locking tailpieceGIBSON GUITAR CORP·Filed 2006·Granted Dec 2, 2008·11 cites·6 claims
- 4179US2025158007A1Method of manufacturing a package-on-package type semiconductor packageAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
- 4279US2024363470A1Wafer-level stack chip package and method of manufacturing the sameAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 4378USD401405SToiletry containerKIM DONG JIN·Filed 1997·Granted Nov 24, 1998·21 cites·1 claims
- 4478US2023057803A1Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layersAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Application pending·0 cites
- 4578US2025349877A1Battery module and battery pack including the sameSK ON CO LTD·Filed 2025·Application pending·0 cites
- 4677US11189168B2Apparatus and server for sharing position information of vehicleHYUNDAI MOTOR CO LTD·Filed 2019·Granted Nov 30, 2021·3 cites·20 claims
- 4777US10879001B2Multilayer ceramic capacitor with internal electrodes including nickel and antimony or germaniumSAMSUNG ELECTRO MECH·Filed 2018·Granted Dec 29, 2020·1 cites·14 claims
- 4877US8164525B2MIMO antenna and communication device using the samePARK SE-HYUN·Filed 2008·Granted Apr 24, 2012·8 cites·24 claims
- 4976US11901332B2Semiconductor device and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Feb 13, 2024·0 cites·20 claims
- 5076US11053190B2Alpha-aminoamide derivative compound and pharmaceutical composition comprising sameNEUROBIOGEN CO LTD·Filed 2020·Granted Jul 6, 2021·1 cites·14 claims
Showing the top 50 of 242 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →