Inventor · disambiguated record
Dong-Chan Lim
Also filed as: LIM DONG-CHAN
43 granted patents·18 pending applications·220 citations·filing 2005–2024
97Inventor score
Top patents by PatentIndex Score
61 records- 0196US8076234B1Semiconductor device and method of fabricating the same including a conductive structure is formed through at least one dielectric layer after forming a via structurePARK BYUNG-LYUL·Filed 2010·Granted Dec 13, 2011·40 cites·19 claims
- 0294US10950578B2Semiconductor device, semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 16, 2021·13 cites·20 claims
- 0394US8390120B2Semiconductor device and method of fabricating the sameMOON KWANG-JIN·Filed 2010·Granted Mar 5, 2013·29 cites·29 claims
- 0493US8592310B2Methods of manufacturing a semiconductor devicePARK BYUNG-LYUL·Filed 2011·Granted Nov 26, 2013·18 cites·20 claims
- 0592US8884440B2Integrated circuit device including through-silicon via structure having offset interfaceKIM SU-KYOUNG·Filed 2012·Granted Nov 11, 2014·19 cites·19 claims
- 0691US11289402B2Semiconductor device including TSV and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Mar 29, 2022·8 cites·21 claims
- 0791US10325869B2Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2018·Granted Jun 18, 2019·6 cites·20 claims
- 0887US9018768B2Integrated circuit having through silicon via structure with minimized deteriorationPARK BYUNG-LYUL·Filed 2012·Granted Apr 28, 2015·10 cites·7 claims
- 0986US8546256B2Method of forming semiconductor deviceJUNG DEOK-YOUNG·Filed 2011·Granted Oct 1, 2013·7 cites·20 claims
- 1085US7696552B2Semiconductor devices including high-k dielectric materialsSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted Apr 13, 2010·12 cites·7 claims
- 1184US7534709B2Semiconductor device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted May 19, 2009·12 cites·10 claims
- 1281US11791137B2Apparatus for etching substrate bevel and semiconductor fabrication method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Oct 17, 2023·1 cites·15 claims
- 1381US7544597B2Method of forming a semiconductor device including an ohmic layerSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Jun 9, 2009·3 cites·20 claims
- 1480US11004814B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 11, 2021·2 cites·20 claims
- 1580US8860221B2Electrode connecting structures containing copperSAMSUNG ELECTRONICS CO LTD·Filed 2012·Granted Oct 14, 2014·5 cites·20 claims
- 1678US7875939B2Semiconductor device including an ohmic layerSAMSUNG ELECTRONICS CO LTD·Filed 2009·Granted Jan 25, 2011·2 cites·6 claims
- 1778US7371669B2Method of forming a gate of a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2005·Granted May 13, 2008·7 cites·22 claims
- 1877US12424572B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Sep 23, 2025·0 cites·20 claims
- 1976US7582924B2Semiconductor devices having polymetal gate electrodesSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Sep 1, 2009·6 cites·7 claims
- 2075US8581334B2Via structures and semiconductor devices having the via structuresLIM DONG-CHAN·Filed 2010·Granted Nov 12, 2013·5 cites·13 claims
- 2171US12224163B2Ion beam source, substrate process apparatus including the same, and method of processing a substrate using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Granted Feb 11, 2025·0 cites·20 claims
- 2270US11728297B2Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Aug 15, 2023·0 cites·20 claims
- 2370US10763163B2Integrated circuit device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Sep 1, 2020·1 cites·19 claims
- 2469US11581279B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Feb 14, 2023·0 cites·20 claims
- 2569US11043445B2Semiconductor device having a through silicon via and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jun 22, 2021·1 cites·17 claims
- 2669US8691692B2Semiconductor chips and methods of forming the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Apr 8, 2014·2 cites·9 claims
- 2768US8847399B2Semiconductor device and method of fabricating the samePARK BYUNG-LYUL·Filed 2011·Granted Sep 30, 2014·2 cites·16 claims
- 2867US11929366B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Mar 12, 2024·0 cites·19 claims
- 2967US11069597B2Semiconductor chips and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted Jul 20, 2021·1 cites·20 claims
- 3067US9530726B2Semiconductor device and method of fabricating the sameMOON KWANG-JIN·Filed 2013·Granted Dec 27, 2016·2 cites·16 claims
- 3166US7867841B2Methods of forming semiconductor devices with extended active regionsSAMSUNG ELECTRONICS CO LTD·Filed 2008·Granted Jan 11, 2011·4 cites·12 claims
- 3265US11705386B2Semiconductor device including TSV and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2022·Granted Jul 18, 2023·0 cites·20 claims
- 3363US9831164B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Nov 28, 2017·1 cites·15 claims
- 3462US11600552B2Semiconductor device having a through silicon via and methods of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Mar 7, 2023·0 cites·20 claims
- 3562US11488860B2Integrated circuit device and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Nov 1, 2022·0 cites·23 claims
- 3661US11804472B2Semiconductor device, semiconductor package and method of manufacturing the sameSAMSUNG ELECTRONICS CO LTD·Filed 2021·Granted Oct 31, 2023·0 cites·20 claims
- 3761US8497157B2Method of manufacturing a semiconductor device and method of manufacturing a semiconductor package including the sameMOON KWANG-JIN·Filed 2012·Granted Jul 30, 2013·1 cites·14 claims
- 3861US2024395745A1Semiconductor device manufacturing method and semiconductor device manufactured using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2024·Application pending·0 cites
- 3960US11018101B2Semiconductor devices, semiconductor packages, and methods of manufacturing the semiconductor devicesSAMSUNG ELECTRONICS CO LTD·Filed 2019·Granted May 25, 2021·0 cites·20 claims
- 4059US2024071712A1Ion beam deposition apparatus and ion beam deposition method using the sameSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4158US11374001B2Semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2020·Granted Jun 28, 2022·0 cites·16 claims
- 4254US2024194604A1Material for metal line in semiconductor device, metal line in semiconductor device, and method for forming metal line in semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2023·Application pending·0 cites
- 4352US2013337647A1Methods of forming a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 4451US10276873B2Current collector for battery comprising metal mesh layer and manufacturing method thereforKOREA INST MACH & MATERIALS·Filed 2013·Granted Apr 30, 2019·0 cites·13 claims
- 4544US9221025B2Method of coating surface of inorganic powder particles with silicon-carbon composite and inorganic powder particles coated by the sameKIM YOUNG DOK·Filed 2012·Granted Dec 29, 2015·0 cites·8 claims
- 4643US7518214B2Semiconductor device and method of fabricating the sameSAMSUNG ELECTRONICS CO LTD·Filed 2006·Granted Apr 14, 2009·0 cites·12 claims
- 4742US2012119376A1Semiconductor chips and methods of forming the sameLIM DONG-CHAN·Filed 2011·Application pending·0 cites
- 4842US2006115967A1Methods of manufacturing a semiconductor deviceSAMSUNG ELECTRONICS CO LTD·Filed 2005·Application pending·0 cites
- 4940US2018199400A1Heating wire and planar heating sheet including the sameKOREA INST MACH & MATERIALS·Filed 2017·Application pending·0 cites
- 5040US2020075524A1Semiconductor device having bump structures and semiconductor package having the sameSAMSUNG ELECTRONICS CO LTD·Filed 2019·Application pending·0 cites
Showing the top 50 of 61 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →