Inventor · disambiguated record
Dongsam Park
Also filed as: PARK DONGSAM
19 granted patents·3 pending applications·243 citations·filing 2006–2025
94Inventor score
Top patents by PatentIndex Score
22 records- 0197US8883561B2Semiconductor device and method of embedding TSV semiconductor die within encapsulant with TMV for vertical interconnect in POPPARK DONGSAM·Filed 2011·Granted Nov 11, 2014·71 cites·33 claims
- 0296US7312519B2Stacked integrated circuit package-in-package systemSTATS CHIPPAC LTD·Filed 2006·Granted Dec 25, 2007·50 cites·5 claims
- 0393US11823973B2Package with compartmentalized lid for heat spreader and EMI shieldSTATS CHIPPAC PTE LTD·Filed 2021·Granted Nov 21, 2023·2 cites·24 claims
- 0493US7989950B2Integrated circuit packaging system having a cavitySTATS CHIPPAC LTD·Filed 2008·Granted Aug 2, 2011·29 cites·10 claims
- 0592US7298037B2Stacked integrated circuit package-in-package system with recessed spacerSTATS CHIPPAC LTD·Filed 2006·Granted Nov 20, 2007·27 cites·15 claims
- 0691US8704365B2Integrated circuit packaging system having a cavityPARK DONGSAM·Filed 2011·Granted Apr 22, 2014·13 cites·10 claims
- 0790US7482203B2Stacked integrated circuit package-in-package systemSTATS CHIPPAC LTD·Filed 2007·Granted Jan 27, 2009·18 cites·20 claims
- 0888US9087701B2Semiconductor device and method of embedding TSV semiconductor die within substrate for vertical interconnect in POPPARK DONGSAM·Filed 2011·Granted Jul 21, 2015·10 cites·18 claims
- 0984US7986048B2Package-on-package system with through vias and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2009·Granted Jul 26, 2011·7 cites·5 claims
- 1082US8598034B2Package-on-package system with through vias and method of manufacture thereofPARK DONGSAM·Filed 2012·Granted Dec 3, 2013·4 cites·9 claims
- 1177US12107028B2Thermally enhanced FCBGA packageSTATS CHIPPAC PTE LTD·Filed 2023·Granted Oct 1, 2024·0 cites·22 claims
- 1277US2024421024A1Thermally Enhanced FCBGA PackageSTATS CHIPPAC PTE LTD·Filed 2024·Application pending·0 cites
- 1370US8334601B2Package-on-package system with through vias and method of manufacture thereofPARK DONGSAM·Filed 2011·Granted Dec 18, 2012·2 cites·13 claims
- 1469US11670563B2Thermally enhanced FCBGA packageSTATS CHIPPAC PTE LTD·Filed 2021·Granted Jun 6, 2023·0 cites·17 claims
- 1567US8110905B2Integrated circuit packaging system with leadframe interposer and method of manufacture thereofPARK DONGSAM·Filed 2008·Granted Feb 7, 2012·4 cites·20 claims
- 1664US7863100B2Integrated circuit packaging system with layered packaging and method of manufacture thereofSTATS CHIPPAC LTD·Filed 2009·Granted Jan 4, 2011·3 cites·20 claims
- 1759US8970044B2Integrated circuit packaging system with vertical interconnects and method of manufacture thereofCHOI A LEAM·Filed 2011·Granted Mar 3, 2015·1 cites·20 claims
- 1859US8008787B2Integrated circuit package system with delamination prevention structureSTATS CHIPPAC LTD·Filed 2007·Granted Aug 30, 2011·2 cites·18 claims
- 1949US2025266390A1Laser assisted bonding device and method for bonding a semiconductor die onto a substrateSTATS CHIPPAC PTE LTD·Filed 2025·Application pending·0 cites
- 2045US2015325553A1Semiconductor Device and Method of Embedding TSV Semiconductor Die Within Substrate for Vertical Interconnect in POPSTATS CHIPPAC LTD·Filed 2015·Application pending·0 cites
- 2143US8367465B2Integrated circuit package on package systemSTATS CHIPPAC LTD·Filed 2006·Granted Feb 5, 2013·0 cites·20 claims
- 2241US8460968B2Integrated circuit packaging system with post and method of manufacture thereofPARK DONGSAM·Filed 2010·Granted Jun 11, 2013·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →