Inventor · disambiguated record
Dong Su Ryu
Also filed as: RYU DONG SU
3 granted patents·6 pending applications·4 citations·filing 2004–2024
55Inventor score
Technology areasH10W
Top patents by PatentIndex Score
9 records- 0160US2023411342A1Laser bonded devices, laser bonding tools, and related methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Application pending·0 cites
- 0259US9627348B2Laser assisted bonding for semiconductor die interconnectionsAMKOR TECHNOLOGY INC·Filed 2015·Granted Apr 18, 2017·1 cites·17 claims
- 0357US2023088061A1Laser bonded devices, laser bonding tools, and related methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Application pending·0 cites
- 0454US2025233083A1Electronic devices and methods of manufacturing electronic devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 0552US2025132220A1Electronic devices and a methods of manufacturing electronic devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Application pending·0 cites
- 0651US2025087549A1Electronic devices and methods of manufacturing electronic devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Application pending·0 cites
- 0744US7030508B2Substrate for semiconductor package and wire bonding method using thereofAMKOR TECHNOLOGY INC·Filed 2004·Granted Apr 18, 2006·3 cites·23 claims
- 0839US11749637B2Hybrid bonding interconnection using laser and thermal compressionAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Sep 5, 2023·0 cites·21 claims
- 0938US2021398936A1Laser bonded devices, laser bonding tools, and related methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →