Inventor · disambiguated record
Dong Soo Ryu
Also filed as: RYU DONG SOO
10 granted patents·2 pending applications·41 citations·filing 2015–2025
87Inventor score
Top patents by PatentIndex Score
12 records- 0194US9859203B2Semiconductor package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2015·Granted Jan 2, 2018·16 cites·18 claims
- 0293US11961797B2Semiconductor package and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Apr 16, 2024·2 cites·19 claims
- 0393US9916989B2System and method for laser assisted bonding of semiconductor dieAMKOR TECHNOLOGY INC·Filed 2016·Granted Mar 13, 2018·11 cites·20 claims
- 0492US10304698B2System and method for laser assisted bonding of semiconductor dieAMKOR TECHNOLOGY INC·Filed 2018·Granted May 28, 2019·7 cites·23 claims
- 0587US11121071B2Semiconductor package and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Sep 14, 2021·2 cites·17 claims
- 0687US10763129B2System and method for laser assisted bonding of an electronic deviceAMKOR TECHNOLOGY INC·Filed 2019·Granted Sep 1, 2020·3 cites·15 claims
- 0787US2025372399A1System and method for laser assisted bonding of an electronic deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
- 0885US12388005B2Semiconductor package and fabricating method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Granted Aug 12, 2025·0 cites·20 claims
- 0983US12374558B2Laser-assisted bonding apparatus for bonding an electronic device to a substrateAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Granted Jul 29, 2025·0 cites·19 claims
- 1071US11742216B2System and method for laser assisted bonding of an electronic deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Aug 29, 2023·0 cites·16 claims
- 1159US10586761B2Semiconductor package and fabricating method thereofAMKOR TECHNOLOGY INC·Filed 2017·Granted Mar 10, 2020·0 cites·10 claims
- 1252US2024204216A1Separator plate assembly for fuel cell capable of forming variable flow path patternJIN YOUNG PREC MACHINE CO LTD·Filed 2021·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →