Inventor · disambiguated record
Dyi-Chung Hu
Also filed as: HU DYI-CHUNG
119 granted patents·30 pending applications·817 citations·filing 1992–2025
99Inventor score
Files withHU DYI CHUNG96UNIMICRON TECHNOLOGY CORP22ADVANCED CHIP ENG TECH INC7IND TECH RES INST7HU YU-SHAN4
Top patents by PatentIndex Score
149 records- 0198US9543249B1Package substrate with lateral communication circuitryHU DYI-CHUNG·Filed 2015·Granted Jan 10, 2017·42 cites·20 claims
- 0296US9263373B2Thin film RDL for nanochip packageHU DYI-CHUNG·Filed 2015·Granted Feb 16, 2016·19 cites·10 claims
- 0396US8709865B2Fabrication method of packaging substrate having through-holed interposer embedded thereinHU YU-SHAN·Filed 2012·Granted Apr 29, 2014·43 cites·12 claims
- 0496US8269337B2Packaging substrate having through-holed interposer embedded therein and fabrication method thereofHU YU-SHAN·Filed 2011·Granted Sep 18, 2012·43 cites·11 claims
- 0595US10037946B2Package structure having embedded bonding film and manufacturing method thereofHU DYI CHUNG·Filed 2017·Granted Jul 31, 2018·10 cites·14 claims
- 0694US11948899B2Semiconductor substrate structure and manufacturing method thereofHU DYI CHUNG·Filed 2022·Granted Apr 2, 2024·2 cites·10 claims
- 0794US10643936B2Package substrate and package structureHU DYI CHUNG·Filed 2017·Granted May 5, 2020·11 cites·18 claims
- 0894US10002852B1Package on package configurationHU DYI CHUNG·Filed 2016·Granted Jun 19, 2018·11 cites·12 claims
- 0994US9673148B2System in packageHU DYI-CHUNG·Filed 2015·Granted Jun 6, 2017·10 cites·13 claims
- 1093US7534632B2Method for circuits inspection and method of the sameADVANCED CHIP ENG TECH INC·Filed 2007·Granted May 19, 2009·28 cites·15 claims
- 1192US9385056B2Packaging substrate having embedded interposer and fabrication method thereofHU DYI-CHUNG·Filed 2012·Granted Jul 5, 2016·15 cites·2 claims
- 1292US9374896B2Packaging carrier and manufacturing method thereof and chip package structureUNIMICRON TECHNOLOGY CORP·Filed 2013·Granted Jun 21, 2016·12 cites·6 claims
- 1390US11125781B1Integrated substrate and manufacturing method thereofHU DYI CHUNG·Filed 2020·Granted Sep 21, 2021·2 cites·6 claims
- 1490US10290586B2Package substrate with embedded noise shielding wallsHU DYI CHUNG·Filed 2017·Granted May 14, 2019·7 cites·9 claims
- 1589US9431335B2Molding compound supported RDL for IC packageHU DYI-CHUNG·Filed 2014·Granted Aug 30, 2016·10 cites·19 claims
- 1689US5517344ASystem for protection of drive circuits formed on a substrate of a liquid crystal displayPRIME VIEW HK LIMITED·Filed 1994·Granted May 14, 1996·128 cites·14 claims
- 1788US12176277B2Package substrate and package structureHU DYI CHUNG·Filed 2022·Granted Dec 24, 2024·1 cites·18 claims
- 1888US9357659B2Packaging substrate having embedded through-via interposerUNIMICRON TECHNOLOGY CORP·Filed 2015·Granted May 31, 2016·5 cites·6 claims
- 1987US8946564B2Packaging substrate having embedded through-via interposer and method of fabricating the sameHU DYI-CHUNG·Filed 2012·Granted Feb 3, 2015·7 cites·6 claims
- 2086US9799622B2High density film for IC packageHU DYI-CHUNG·Filed 2014·Granted Oct 24, 2017·6 cites·14 claims
- 2185US10535622B2Substrate structure and electronic device having coarse redistribution layer electrically connected to fine redistribution layerHU DYI CHUNG·Filed 2018·Granted Jan 14, 2020·4 cites·18 claims
- 2285US9837347B2Coaxial copper pillarHU DYI-CHUNG·Filed 2016·Granted Dec 5, 2017·4 cites·16 claims
- 2385US9756738B2Redistribution film for IC packageHU DYI-CHUNG·Filed 2014·Granted Sep 5, 2017·5 cites·18 claims
- 2485US9337136B2Method of fabricating a through-holed interposerUNIMICRON TECHNOLOGY CORP·Filed 2015·Granted May 10, 2016·4 cites·3 claims
- 2584US10224300B2Pad structure and manufacturing method thereofHU DYI CHUNG·Filed 2017·Granted Mar 5, 2019·4 cites·16 claims
- 2684US9958616B2Embedded optical fiber moduleHU DYI CHUNG·Filed 2016·Granted May 1, 2018·4 cites·8 claims
- 2784US8513796B2Package structure, fabricating method thereof, and package-on-package device therebyTSENG TZYY-JANG·Filed 2012·Granted Aug 20, 2013·6 cites·12 claims
- 2883US9859202B2Spacer connectorHU DYI-CHUNG·Filed 2016·Granted Jan 2, 2018·4 cites·9 claims
- 2983US9485874B2Package substrate having photo-sensitive dielectric layer and method of fabricating the sameIND TECH RES INST·Filed 2013·Granted Nov 1, 2016·7 cites·19 claims
- 3083US8304923B2Chip packaging structureHU DYI-CHUNG·Filed 2007·Granted Nov 6, 2012·11 cites·15 claims
- 3183US6406928B1Back-channel-etch process for forming TFT matrix of LCD with reduced masking stepsHANNSTAR DISPLAY CORP·Filed 2000·Granted Jun 18, 2002·26 cites·13 claims
- 3282US12315788B1Semiconductor substrate and manufacturing method thereofHU DYI CHUNG·Filed 2024·Granted May 27, 2025·0 cites·20 claims
- 3382US8952268B2Interposed substrate and manufacturing method thereofHU DYI-CHUNG·Filed 2012·Granted Feb 10, 2015·5 cites·3 claims
- 3482US5555001ARedundant scheme for LCD display with integrated data driving circuitPRIME VIEW HK LIMITED·Filed 1994·Granted Sep 10, 1996·70 cites·10 claims
- 3581US11309252B2Package substrate and package structureHU DYI CHUNG·Filed 2020·Granted Apr 19, 2022·1 cites·19 claims
- 3681US9806044B2Bonding film for signal communication between central chip and peripheral chips and fabricating method thereofHU DYI-CHUNG·Filed 2016·Granted Oct 31, 2017·3 cites·13 claims
- 3781US7884461B2System-in-package and manufacturing method of the sameADVANCED CHIP ENG TECH INC·Filed 2008·Granted Feb 8, 2011·9 cites·10 claims
- 3879US10154599B2Redistribution film for IC packageHU DYI CHUNG·Filed 2017·Granted Dec 11, 2018·2 cites·9 claims
- 3979US9859159B2Interconnection structure and manufacturing method thereofUNIMICRON TECHNOLOGY CORP·Filed 2015·Granted Jan 2, 2018·3 cites·3 claims
- 4078US10068847B2Package substrate and method of fabricating the sameIND TECH RES INST·Filed 2017·Granted Sep 4, 2018·2 cites·4 claims
- 4178US8981570B2Through-holed interposer, packaging substrate, and methods of fabricating the sameUNIMICRON TECHNOLOGY CORP·Filed 2013·Granted Mar 17, 2015·3 cites·8 claims
- 4277US12249567B2Manufacturing method of integrated substrate structureHU DYI CHUNG·Filed 2023·Granted Mar 11, 2025·0 cites·8 claims
- 4377US9362256B2Bonding process for a chip bonding to a thin film substrateHU DYI-CHUNG·Filed 2015·Granted Jun 7, 2016·2 cites·13 claims
- 4477US8956909B2Method of fabricating an electronic device comprising photodiodeUNIMICRON TECHNOLOGY CORP·Filed 2013·Granted Feb 17, 2015·1 cites·6 claims
- 4577US2025070006A1Package substrate and package structureHU DYI CHUNG·Filed 2024·Application pending·0 cites
- 4676US9781843B2Method of fabricating packaging substrate having embedded through-via interposerUNIMICRON TECHNOLOGY CORP·Filed 2015·Granted Oct 3, 2017·2 cites·4 claims
- 4776US9627285B2Package substrateHU DYI-CHUNG·Filed 2014·Granted Apr 18, 2017·3 cites·19 claims
- 4876US2025029911A1Manufacturing method of semiconductor substrateHU DYI CHUNG·Filed 2024·Application pending·0 cites
- 4975US12148688B2Semiconductor substrate and manufacturing method thereofHU DYI CHUNG·Filed 2024·Granted Nov 19, 2024·0 cites·27 claims
- 5075US10818584B2Package substrate and package structureHU DYI CHUNG·Filed 2017·Granted Oct 27, 2020·2 cites·13 claims
Showing the top 50 of 149 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →