Inventor · disambiguated record
Edwin J. Adlam
Also filed as: ADLAM EDWIN J · ADLAM EDWIN JOSEPH
6 granted patents·1 pending application·170 citations·filing 1995–2024
84Inventor score
Files withAMKOR TECH SINGAPORE HOLDING PTE LTD4ADLAM EDWIN JOSEPH1AMKOR TECHNOLOGY INC1PARK ELECTROCHEMICAL CORP1
Top patents by PatentIndex Score
7 records- 0197US11488934B2Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Nov 1, 2022·5 cites·20 claims
- 0294US10872879B2Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2018·Granted Dec 22, 2020·9 cites·20 claims
- 0394US10163867B2Semiconductor package and manufacturing method thereofAMKOR TECHNOLOGY INC·Filed 2018·Granted Dec 25, 2018·15 cites·20 claims
- 0490US5861076AMethod for making multi-layer circuit boardsPARK ELECTROCHEMICAL CORP·Filed 1995·Granted Jan 19, 1999·124 cites·39 claims
- 0587US9025301B1Wire fence fingerprint sensor package and fabrication methodADLAM EDWIN JOSEPH·Filed 2012·Granted May 5, 2015·17 cites·20 claims
- 0682US2024395771A1Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 0777US12057434B2Semiconductor package and manufacturing method thereofAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Aug 6, 2024·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →