Inventor · disambiguated record
Edward Fürgut
Also filed as: FUERGUT EDWARD · FÜRGUT EDWARD
5 granted patents·17 pending applications·74 citations·filing 2004–2025
74Inventor score
Files withINFINEON TECHNOLOGIES AUSTRIA AG11INFINEON TECHNOLOGIES AG10INFINEON TECHNOLOGIES AUSTRIA1
Top patents by PatentIndex Score
22 records- 0191US8350382B2Semiconductor device including electronic component coupled to a backside of a chipINFINEON TECHNOLOGIES AG·Filed 2007·Granted Jan 8, 2013·22 cites·9 claims
- 0289US7420262B2Electronic component and semiconductor wafer, and method for producing the sameINFINEON TECHNOLOGIES AG·Filed 2004·Granted Sep 2, 2008·52 cites·9 claims
- 0371US2024113026A1Silicon Carbide Device and Method for Forming a Silicon Carbide DeviceINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 0461US12483232B2Gate driver circuit and power switching assembly with gate driver circuitINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Granted Nov 25, 2025·0 cites·20 claims
- 0560US2025038082A1Package with recess for balancing creepage current pathsINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0659US2024347427A1Leadframe comprising a lead with an elevation for increasing mechanical robustness and a semiconductor packageINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 0759US2024266237A1A semiconductor transistor package having electrical contact layers and a method for fabricating the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 0859US2025201682A1Surface mount package having an internal redundant electrical connectionINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 0956US2023360929A1Method for fabricating a semiconductor device module with increased reliability and a semiconductor device moduleINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 1055US2025118637A1Package carrier with large back side areaINFINEON TECHNOLOGIES AG·Filed 2024·Application pending·0 cites
- 1155US2023282591A1Semiconductor package and a semiconductor device module including the sameINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 1254US12512380B2Semiconductor packages including a package body with grooves formed thereinINFINEON TECHNOLOGIES AG·Filed 2023·Granted Dec 30, 2025·0 cites·20 claims
- 1354US2024014104A1Semiconductor Package or a Printed Circuit Board, Both Modified to One or More of Reduce, Inverse or Utilize Magnetic Coupling Caused by the Load Current of a Semiconductor TransistorINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 1454US2023274996A1Chip arrangement, chip package, method of forming a chip arrangement, and method of forming a chip packageINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 1554US2025357454A1Power Semiconductor Device Stack, Power Module, and Method of Producing a Power Semiconductor Device StackINFINEON TECHNOLOGIES AG·Filed 2025·Application pending·0 cites
- 1653US2023378011A1Electronic device module and a device module both having an adhesion promoter layerINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 1753US2025014971A1Power Package With Galvanic IsolationINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2023·Application pending·0 cites
- 1852US2023361009A1Semiconductor package having an embedded electrical conductor connected between pins of a semiconductor die and a further deviceINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 1952US2025323138A1Application board and a semiconductor package mounted thereon for reducing creepage currentsINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2025·Application pending·0 cites
- 2051US2024243092A1Semiconductor package in a source-down configuration by use of vertical connectorsINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2024·Application pending·0 cites
- 2149US2025357232A1Semiconductor package including an encapsulant with a peripheral side wall having a recess and a lead disposed in the recessINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2025·Application pending·0 cites
- 2244US9385111B2Electronic component with electronic chip between redistribution structure and mounting structureINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Jul 5, 2016·0 cites·26 claims
Join the waitlist — get patent alerts
Get an alert when Edward Fürgut files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →