Inventor · disambiguated record
Edvard Kalvesten
Also filed as: KAELVESTEN EDVARD · KALVESTEN EDVARD · KÄLVESTEN EDVARD
21 granted patents·4 pending applications·308 citations·filing 1997–2016
95Inventor score
Files withSILEX MICROSYSTEMS AB10KAELVESTEN EDVARD3EBEFORS THORBJOERN2EBEFORS THORBJÖRN2INSTRUMENTARIUM CORP2
Top patents by PatentIndex Score
25 records- 0192US7207227B2Pressure sensorSILEX MICROSYSTEMS AB·Filed 2005·Granted Apr 24, 2007·35 cites·24 claims
- 0289US8637351B2Methods for making micro needles and applications thereofKAELVESTEN EDVARD·Filed 2011·Granted Jan 28, 2014·14 cites·6 claims
- 0384US8308960B2Methods for making micro needles and applications thereofKAELVESTEN EDVARD·Filed 2006·Granted Nov 13, 2012·14 cites·14 claims
- 0482US6124145AMicromachined gas-filled chambers and method of microfabricationINSTRUMENTARIUM CORP·Filed 1998·Granted Sep 26, 2000·60 cites·46 claims
- 0581US7017420B2Miniaturized pressure sensorSILEX MICROSYSTEMS AB·Filed 2002·Granted Mar 28, 2006·31 cites·24 claims
- 0681US6973835B2Pressure sensorSILEX MICROSYSTEMS AB·Filed 2002·Granted Dec 13, 2005·25 cites·15 claims
- 0776US6548322B1Micromachined gas-filled chambers and method of microfabricationINSTRUMENTARIUM CORP·Filed 2000·Granted Apr 15, 2003·17 cites·35 claims
- 0876US6055869ALift force fluid flow sensor for measuring fluid flow velocitiesFiled 1997·Granted May 2, 2000·45 cites·54 claims
- 0975US9362139B2Method of making a semiconductor device having a functional cappingEBEFORS THORBJÖRN·Filed 2009·Granted Jun 7, 2016·7 cites·22 claims
- 1073US9718674B2Thin capping for MEMS devicesSILEX MICROSYSTEMS AB·Filed 2014·Granted Aug 1, 2017·3 cites·10 claims
- 1173US9620390B2Method of making a semiconductor device having a functional cappingSILEX MICROSYSTEMS AB·Filed 2016·Granted Apr 11, 2017·2 cites·8 claims
- 1271US7560802B2Electrical connections in substratesSilex Microsystems AG·Filed 2004·Granted Jul 14, 2009·25 cites·20 claims
- 1371US7172911B2Deflectable microstructure and method of manufacturing the same through bonding of wafersSILEX MICROSYSTEMS AB·Filed 2003·Granted Feb 6, 2007·20 cites·16 claims
- 1465US8592981B2Via structure and method thereofEBEFORS THORBJOERN·Filed 2009·Granted Nov 26, 2013·3 cites·7 claims
- 1561US9607915B2Through substrate vias and deviceSILEX MICROSYSTEMS AB·Filed 2013·Granted Mar 28, 2017·2 cites·6 claims
- 1656US8630033B2Via structure and method thereofEBEFORS THORBJOERN·Filed 2011·Granted Jan 14, 2014·1 cites·4 claims
- 1750US9448401B2Via structure and method thereofSILEX MICROSYSTEMS AB·Filed 2013·Granted Sep 20, 2016·0 cites·10 claims
- 1849US2010053922A1Micropackaging method and devicesSILEX MICROSYSTEMS AB·Filed 2008·Application pending·0 cites
- 1946US7067345B2Method of joining componentsKAELVESTEN EDVARD·Filed 2001·Granted Jun 27, 2006·4 cites·20 claims
- 2042US9312217B2Methods for making a starting substrate wafer for semiconductor engineering having wafer through connectionsKÄLVESTEN EDVARD·Filed 2007·Granted Apr 12, 2016·0 cites·7 claims
- 2140US8729713B2Via structure and method thereofEBEFORS THORBJÖRN·Filed 2011·Granted May 20, 2014·0 cites·17 claims
- 2240US2008308884A1Fabrication of Inlet and Outlet Connections for Microfluidic ChipsSILEX MICROSYSTEMS AB·Filed 2006·Application pending·0 cites
- 2337US2012288422A1Glass micro fluidic deviceKALVESTEN EDVARD·Filed 2012·Application pending·0 cites
- 2436US2006173261A1Biopotential sensorKALL MAGNUS·Filed 2005·Application pending·0 cites
- 2535US9936918B2Insulation of micro structuresKALVESTEN EDVARD·Filed 2012·Granted Apr 10, 2018·0 cites·10 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →