Inventor · disambiguated record
Edric Tong
Also filed as: TONG EDRIC · TONG EDRIC H
26 granted patents·9 pending applications·163 citations·filing 1988–2025
95Inventor score
Top patents by PatentIndex Score
35 records- 0193US10062598B2Thermal processing susceptorAPPLIED MATERIALS INC·Filed 2015·Granted Aug 28, 2018·7 cites·12 claims
- 0293US2025364306A1Thermal processing susceptorAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 0392US9845550B2Upper dome with injection assemblyAPPLIED MATERIALS INC·Filed 2015·Granted Dec 19, 2017·7 cites·20 claims
- 0491US7611322B2Processing thin wafersINTEVAC INC·Filed 2005·Granted Nov 3, 2009·15 cites·8 claims
- 0590US10930543B2Thermal processing susceptorAPPLIED MATERIALS INC·Filed 2018·Granted Feb 23, 2021·4 cites·17 claims
- 0689US6563586B1Wafer metrology apparatus and methodTHERMA WAVE INC·Filed 2000·Granted May 13, 2003·44 cites·25 claims
- 0786US12400904B2Thermal processing susceptorAPPLIED MATERIALS INC·Filed 2023·Granted Aug 26, 2025·0 cites·20 claims
- 0886US10883190B2Apparatus and methods for alignment of a susceptorAPPLIED MATERIALS INC·Filed 2015·Granted Jan 5, 2021·4 cites·16 claims
- 0981US10727093B2Light pipe window structure for low pressure thermal processesAPPLIED MATERIALS INC·Filed 2015·Granted Jul 28, 2020·3 cites·16 claims
- 1080US10269614B2Susceptor design to reduce edge thermal peakAPPLIED MATERIALS INC·Filed 2015·Granted Apr 23, 2019·3 cites·15 claims
- 1177US7177019B2Apparatus for imaging metrologyTOKYO ELECTRON LTD·Filed 2005·Granted Feb 13, 2007·6 cites·16 claims
- 1275US11848226B2Thermal processing susceptorAPPLIED MATERIALS INC·Filed 2021·Granted Dec 19, 2023·0 cites·7 claims
- 1374US10458040B2Upper dome with injection assemblyAPPLIED MATERIALS INC·Filed 2017·Granted Oct 29, 2019·1 cites·20 claims
- 1474US8970963B2Multiple beam combiner for laser processing apparatusMOFFATT STEPHEN·Filed 2012·Granted Mar 3, 2015·2 cites·6 claims
- 1571US8569187B2Thermal processing apparatusMOFFATT STEPHEN·Filed 2011·Granted Oct 29, 2013·2 cites·18 claims
- 1670US4907931AApparatus for handling semiconductor wafersPROMETRIX CORP·Filed 1988·Granted Mar 13, 1990·43 cites·32 claims
- 1769US8206551B2Processing thin wafersBLUCK TERRY·Filed 2009·Granted Jun 26, 2012·2 cites·15 claims
- 1868US10619235B2Effective and novel design for lower particle count and better wafer quality by diffusing the flow inside the chamberAPPLIED MATERIALS INC·Filed 2017·Granted Apr 14, 2020·1 cites·11 claims
- 1968US9285595B2Multiple beam combiner for laser processing apparatusAPPLIED MATERIALS INC·Filed 2015·Granted Mar 15, 2016·1 cites·20 claims
- 2067US10181409B2Thermal processing apparatusAPPLIED MATERIALS INC·Filed 2014·Granted Jan 15, 2019·1 cites·13 claims
- 2165US11859307B2Apparatus and methods for alignment of a susceptorAPPLIED MATERIALS INC·Filed 2020·Granted Jan 2, 2024·0 cites·20 claims
- 2264US7042580B1Apparatus for imaging metrologyTOKYO ELECTRON LTD·Filed 2000·Granted May 9, 2006·10 cites·15 claims
- 2363US6919958B2Wafer metrology apparatus and methodTHERMA WAVE INC·Filed 2003·Granted Jul 19, 2005·7 cites·3 claims
- 2462US10808310B2Effective and novel design for lower particle count and better wafer quality by diffusing the flow inside the chamberAPPLIED MATERIALS INC·Filed 2020·Granted Oct 20, 2020·0 cites·20 claims
- 2559US2025132147A1Methods for treatment of high-k materials to reduce leakage current and increase capacitanceAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 2656US9927622B2Multiple beam combiner for laser processing apparatusAPPLIED MATERIALS INC·Filed 2016·Granted Mar 27, 2018·0 cites·20 claims
- 2756US2009234687A1Method of designing an optical metrology system optimized for operating time budgetTOKYO ELECTRON LTD·Filed 2008·Application pending·0 cites
- 2853US8354001B2Processing thin wafersINTEVAC INC·Filed 2011·Granted Jan 15, 2013·0 cites·19 claims
- 2946US2016033070A1Recursive pumping memberAPPLIED MATERIALS INC·Filed 2014·Application pending·0 cites
- 3046US2009240537A1Apparatus for designing an optical metrology system optimized for operating time budgetTOKYO ELECTRON LTD·Filed 2008·Application pending·0 cites
- 3141US2016068955A1Honeycomb multi-zone gas distribution plateAPPLIED MATERIALS INC·Filed 2015·Application pending·0 cites
- 3241US2015368830A1One-piece injector assembly and one-piece exhaust linerAPPLIED MATERIALS INC·Filed 2015·Application pending·0 cites
- 3340US2015368829A1Substrate thermal control in an epi chamberAPPLIED MATERIALS INC·Filed 2015·Application pending·0 cites
- 3439US2002018217A1Optical critical dimension metrology system integrated into semiconductor wafer process toolFiled 2001·Application pending·0 cites
- 3531US6572456B2Bathless wafer measurement apparatus and methodSENSYS INSTR CORP·Filed 2001·Granted Jun 3, 2003·0 cites·17 claims
Join the waitlist — get patent alerts
Get an alert when Edric Tong files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →