Inventor · disambiguated record
Eiichiro Takanabe
Also filed as: TAKANABE EIICHIRO
7 granted patents·696 citations·filing 1989–2000
89Inventor score
Top patents by PatentIndex Score
7 records- 0197US5775889AHeat treatment process for preventing slips in semiconductor wafersTOKYO ELECTRON LTD·Filed 1995·Granted Jul 7, 1998·395 cites·3 claims
- 0288US6402848B1Single-substrate-treating apparatus for semiconductor processing systemTOKYO ELECTRON LTD·Filed 2000·Granted Jun 11, 2002·48 cites·11 claims
- 0385US5388944AVertical heat-treating apparatus and heat-treating process by using the vertical heat-treating apparatusTOKYO ELECTRON TOHOKU KABUSHIK·Filed 1993·Granted Feb 14, 1995·116 cites·17 claims
- 0478US5277579AWafers transferring method in vertical type heat treatment apparatus and the vertical type heat treatment apparatus provided with a wafers transferring systemTEL SAGAMI LTD·Filed 1992·Granted Jan 11, 1994·71 cites·7 claims
- 0571US5016567AApparatus for treatment using gasTEL SAGAMI LTD·Filed 1989·Granted May 21, 1991·29 cites·7 claims
- 0651US5688116AHeat treatment processTOKYO ELECTRON LTD·Filed 1995·Granted Nov 18, 1997·17 cites·11 claims
- 0749US5030056ASubstrate transfer deviceTEL SAGAMI LTD·Filed 1990·Granted Jul 9, 1991·20 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →