Inventor · disambiguated record
Ekta Misra
Also filed as: MISRA EKTA
22 granted patents·4 pending applications·56 citations·filing 2005–2019
93Inventor score
Top patents by PatentIndex Score
26 records- 0192US10090271B1Metal pad modificationIBM·Filed 2017·Granted Oct 2, 2018·6 cites·16 claims
- 0289US9754905B1Final passivation for wafer level warpage and ULK stress reductionIBM·Filed 2016·Granted Sep 5, 2017·6 cites·6 claims
- 0385US9159696B2Plug via formation by patterned plating and polishingIBM·Filed 2013·Granted Oct 13, 2015·6 cites·20 claims
- 0483US8492892B2Solder bump connectionsDAUBENSPECK TIMOTHY H·Filed 2010·Granted Jul 23, 2013·6 cites·19 claims
- 0582US8937009B2Far back end of the line metallization method and structuresIBM·Filed 2013·Granted Jan 20, 2015·6 cites·18 claims
- 0676US8563416B2Coaxial solder bump support structureERWIN BRIAN MICHAEL·Filed 2011·Granted Oct 22, 2013·5 cites·10 claims
- 0776US8298929B2Offset solder vias, methods of manufacturing and design structuresDAUBENSPECK TIMOTHY H·Filed 2010·Granted Oct 30, 2012·4 cites·6 claims
- 0875US10373925B2Metal pad modificationIBM·Filed 2018·Granted Aug 6, 2019·1 cites·4 claims
- 0975US8778792B2Solder bump connectionsIBM·Filed 2013·Granted Jul 15, 2014·3 cites·20 claims
- 1070US9842810B1Tiled-stress-alleviating pad structureGLOBALFOUNDRIES INC·Filed 2016·Granted Dec 12, 2017·1 cites·12 claims
- 1169US8299581B2Passivation layer extension to chip edgeDAUBENSPECK TIMOTHY H·Filed 2010·Granted Oct 30, 2012·3 cites·18 claims
- 1269US7446037B2Cladded silver and silver alloy metallization for improved adhesion and electromigration resistanceALFORD TERRY L·Filed 2005·Granted Nov 4, 2008·4 cites·18 claims
- 1367US7888263B2Cladded silver and silver alloy metallization for improved adhesion electromigration resistanceUNIV ARIZONA·Filed 2008·Granted Feb 15, 2011·2 cites·22 claims
- 1464US8674506B2Structures and methods to reduce maximum current density in a solder ballIBM·Filed 2013·Granted Mar 18, 2014·1 cites·13 claims
- 1563US11756911B2Metal pad modificationIBM·Filed 2019·Granted Sep 12, 2023·0 cites·3 claims
- 1663US10593639B2Metal pad modificationIBM·Filed 2019·Granted Mar 17, 2020·0 cites·1 claims
- 1763US8446006B2Structures and methods to reduce maximum current density in a solder ballBEZAMA RASCHID J·Filed 2009·Granted May 21, 2013·2 cites·22 claims
- 1855US10096557B2Tiled-stress-alleviating pad structureGLOBALFOUNDRIES INC·Filed 2017·Granted Oct 9, 2018·0 cites·10 claims
- 1953US10622319B2Final passivation for wafer level warpage and ULK stress reductionIBM·Filed 2017·Granted Apr 14, 2020·0 cites·7 claims
- 2053US9214385B2Semiconductor device including passivation layer encapsulantIBM·Filed 2014·Granted Dec 15, 2015·0 cites·11 claims
- 2151US2015311161A1Selective plating without photoresistIBM·Filed 2014·Application pending·0 cites
- 2250US9431359B2Coaxial solder bump support structureIBM·Filed 2013·Granted Aug 30, 2016·0 cites·18 claims
- 2348US9633962B2Plug via formation with grid features in the passivation layerGLOBALFOUNDRIES INC·Filed 2013·Granted Apr 25, 2017·0 cites·17 claims
- 2446US2015325540A1Plug via formation by patterned plating and polishingIBM·Filed 2015·Application pending·0 cites
- 2545US2016035641A1Semiconductor device including passivation layer encapsulantGLOBALFOUNDRIES INC·Filed 2015·Application pending·0 cites
- 2645US2015348910A1Selective plating without photoresistIBM·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →