Inventor · disambiguated record
Eng Meow Koon
Also filed as: KOON ENG M · KOON ENG MEOW
27 granted patents·1 pending application·893 citations·filing 2000–2019
97Inventor score
Technology areasH10W
Top patents by PatentIndex Score
28 records- 0197US6949407B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2005·Granted Sep 27, 2005·42 cites·18 claims
- 0296US6855572B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2002·Granted Feb 15, 2005·96 cites·41 claims
- 0396US6552910B1Stacked-die assemblies with a plurality of microelectronic devices and methods of manufactureMICRON TECHNOLOGY INC·Filed 2000·Granted Apr 22, 2003·331 cites·26 claims
- 0495US7358154B2Method for fabricating packaged dieMICRON TECHNOLOGY INC·Filed 2005·Granted Apr 15, 2008·30 cites·24 claims
- 0594US6894386B2Apparatus and method for packaging circuitsMICRON TECHNOLOGY INC·Filed 2002·Granted May 17, 2005·69 cites·30 claims
- 0693US8065792B2Method for packaging circuitsCHIA YONG POO·Filed 2010·Granted Nov 29, 2011·13 cites·18 claims
- 0793US7115986B2Flexible ball grid array chip scale packagesMICRON TECHNOLOGY INC·Filed 2001·Granted Oct 3, 2006·114 cites·41 claims
- 0891US6836009B2Packaged microelectronic componentsMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 28, 2004·51 cites·53 claims
- 0988US7528477B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2005·Granted May 5, 2009·10 cites·22 claims
- 1087US8555495B2Method for packaging circuitsCHIA YONG POO·Filed 2011·Granted Oct 15, 2013·6 cites·20 claims
- 1187US7947529B2Microelectronic die packages with leadframes, including leadframe-based interposer for stacked die packages, and associated systems and methodsMICRON TECHNOLOGY INC·Filed 2007·Granted May 24, 2011·13 cites·21 claims
- 1286US7712211B2Method for packaging circuits and packaged circuitsMICRON TECHNOLOGY INC·Filed 2003·Granted May 11, 2010·26 cites·25 claims
- 1386US7679179B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 16, 2010·8 cites·19 claims
- 1485US9484225B2Method for packaging circuitsMICRON TECHNOLOGY INC·Filed 2013·Granted Nov 1, 2016·4 cites·7 claims
- 1585US8008126B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2009·Granted Aug 30, 2011·7 cites·14 claims
- 1684US8629054B2Packaged semiconductor assemblies and methods for manufacturing such assembliesBOON SUAN JEUNG·Filed 2012·Granted Jan 14, 2014·4 cites·13 claims
- 1784US7675169B2Apparatus and method for packaging circuitsMICRON TECHNOLOGY INC·Filed 2007·Granted Mar 9, 2010·9 cites·20 claims
- 1883US7195957B2Packaged microelectronic componentsMICRON TECHNOLOGY INC·Filed 2004·Granted Mar 27, 2007·25 cites·6 claims
- 1977US8138617B2Apparatus and method for packaging circuitsPOO CHIA YONG·Filed 2004·Granted Mar 20, 2012·19 cites·15 claims
- 2070US7276387B2Castellation wafer level packaging of integrated circuit chipsMICRON TECHNOLOGY INC·Filed 2005·Granted Oct 2, 2007·2 cites·19 claims
- 2166US6836008B2Semiconductor packages with leadframe grid arrays and componentsMICRON TECHNOLOGY INC·Filed 2002·Granted Dec 28, 2004·10 cites·52 claims
- 2265US7170161B2In-process semiconductor packages with leadframe grid arraysMICRON TECHNOLOGY INC·Filed 2005·Granted Jan 30, 2007·2 cites·20 claims
- 2364US10811278B2Method for packaging circuitsMICRON TECHNOLOGY INC·Filed 2019·Granted Oct 20, 2020·0 cites·13 claims
- 2459US8115306B2Apparatus and method for packaging circuitsPOO CHIA YONG·Filed 2010·Granted Feb 14, 2012·1 cites·20 claims
- 2558US10453704B2Method for packaging circuitsMICRON TECHNOLOGY INC·Filed 2016·Granted Oct 22, 2019·0 cites·14 claims
- 2651US2007120247A1Semiconductor packages having leadframe-based connection arraysYU CHAN M·Filed 2007·Application pending·0 cites
- 2746US6967127B2Methods for making semiconductor packages with leadframe grid arraysMICRON TECHNOLOGY INC·Filed 2003·Granted Nov 22, 2005·1 cites·19 claims
- 2845US8637973B2Packaged microelectronic components with terminals exposed through encapsulantKOON ENG MEOW·Filed 2007·Granted Jan 28, 2014·0 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →