Inventor · disambiguated record
Evan E. Patton
Also filed as: PATTON EVAN · PATTON EVAN E · PATTON EVAN EDWARD
39 granted patents·4 pending applications·3,695 citations·filing 1988–2017
99Inventor score
Top patents by PatentIndex Score
43 records- 0199US6527920B1Copper electroplating apparatusNOVELLUS SYSTEMS INC·Filed 2000·Granted Mar 4, 2003·251 cites·36 claims
- 0298US6964792B1Methods and apparatus for controlling electrolyte flow for uniform platingNOVELLUS SYSTEMS INC·Filed 2001·Granted Nov 15, 2005·121 cites·58 claims
- 0398US6890416B1Copper electroplating method and apparatusNOVELLUS SYSTEMS INC·Filed 2002·Granted May 10, 2005·92 cites·31 claims
- 0498US6402923B1Method and apparatus for uniform electroplating of integrated circuits using a variable field shaping elementNOVELLUS SYSTEMS INC·Filed 2000·Granted Jun 11, 2002·163 cites·25 claims
- 0598US6156167AClamshell apparatus for electrochemically treating semiconductor wafersNOVELLUS SYSTEMS INC·Filed 1997·Granted Dec 5, 2000·325 cites·35 claims
- 0698US6074544AMethod of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layerNOVELLUS SYSTEMS INC·Filed 1998·Granted Jun 13, 2000·288 cites·7 claims
- 0797US6773571B1Method and apparatus for uniform electroplating of thin metal seeded wafers using multiple segmented virtual anode sourcesNOVELLUS SYSTEMS INC·Filed 2002·Granted Aug 10, 2004·144 cites·45 claims
- 0897US6551487B1Methods and apparatus for controlled-angle wafer immersionNOVELLUS SYSTEMS INC·Filed 2001·Granted Apr 22, 2003·145 cites·16 claims
- 0997US6309981B1Edge bevel removal of copper from silicon wafersNOVELLUS SYSTEMS INC·Filed 2000·Granted Oct 30, 2001·161 cites·45 claims
- 1097US6193859B1Electric potential shaping apparatus for holding a semiconductor wafer during electroplatingNOVELLUS SYSTEMS INC·Filed 1998·Granted Feb 27, 2001·159 cites·29 claims
- 1197US6159354AElectric potential shaping method for electroplatingNOVELLUS SYSTEMS INC·Filed 1997·Granted Dec 12, 2000·182 cites·12 claims
- 1297US6139712AMethod of depositing metal layerNOVELLUS SYSTEMS INC·Filed 1999·Granted Oct 31, 2000·198 cites·4 claims
- 1397US6110346AMethod of electroplating semicoductor wafer using variable currents and mass transfer to obtain uniform plated layerNOVELLUS SYSTEMS INC·Filed 1999·Granted Aug 29, 2000·158 cites·9 claims
- 1496US6800187B1Clamshell apparatus for electrochemically treating wafersNOVELLUS SYSTEMS INC·Filed 2001·Granted Oct 5, 2004·168 cites·45 claims
- 1595US7686927B1Methods and apparatus for controlled-angle wafer positioningNOVELLUS SYSTEMS INC·Filed 2006·Granted Mar 30, 2010·26 cites·7 claims
- 1695US7033465B1Clamshell apparatus with crystal shielding and in-situ rinse-dryNOVELLUS SYSTEMS INC·Filed 2002·Granted Apr 25, 2006·48 cites·31 claims
- 1795US6436249B1Clamshell apparatus for electrochemically treating semiconductor wafersNOVELLUS SYSTEMS INC·Filed 2000·Granted Aug 20, 2002·69 cites·11 claims
- 1895US6162344AMethod of electroplating semiconductor wafer using variable currents and mass transfer to obtain uniform plated layerNOVELLUS SYSTEMS INC·Filed 1999·Granted Dec 19, 2000·179 cites·9 claims
- 1995US6099702AElectroplating chamber with rotatable wafer holder and pre-wetting and rinsing capabilityNOVELLUS SYSTEMS INC·Filed 1998·Granted Aug 8, 2000·203 cites·10 claims
- 2094US6589401B1Apparatus for electroplating copper onto semiconductor waferNOVELLUS SYSTEMS INC·Filed 2000·Granted Jul 8, 2003·67 cites·14 claims
- 2193US8048280B2Process for electroplating metals into microscopic recessed featuresNOVELLUS SYSTEMS INC·Filed 2005·Granted Nov 1, 2011·24 cites·34 claims
- 2293US6755946B1Clamshell apparatus with dynamic uniformity controlNOVELLUS SYSTEMS INC·Filed 2001·Granted Jun 29, 2004·79 cites·29 claims
- 2392US6946065B1Process for electroplating metal into microscopic recessed featuresNOVELLUS SYSTEMS INC·Filed 2000·Granted Sep 20, 2005·60 cites·14 claims
- 2491US7189647B2Sequential station tool for wet processing of semiconductor wafersNOVELLUS SYSTEMS INC·Filed 2003·Granted Mar 13, 2007·41 cites·13 claims
- 2589US6471845B1Method of controlling chemical bath composition in a manufacturing environmentIBM·Filed 1999·Granted Oct 29, 2002·63 cites·11 claims
- 2686US7097410B1Methods and apparatus for controlled-angle wafer positioningNOVELLUS SYSTEMS INC·Filed 2003·Granted Aug 29, 2006·28 cites·10 claims
- 2784US5029117AMethod and apparatus for active pyrometryTEKTRONIX INC·Filed 1989·Granted Jul 2, 1991·44 cites·23 claims
- 2883US6716334B1Electroplating process chamber and method with pre-wetting and rinsing capabilityNOVELLUS SYSTEMS INC·Filed 2001·Granted Apr 6, 2004·30 cites·10 claims
- 2981US8883640B1Sequential station tool for wet processing of semiconductor wafersNOVELLUS SYSTEMS INC·Filed 2013·Granted Nov 11, 2014·3 cites·17 claims
- 3080US8450210B1Sequential station tool for wet processing of semiconductor wafersPATTON EVAN E·Filed 2011·Granted May 28, 2013·5 cites·16 claims
- 3180US6214193B1Electroplating process including pre-wetting and rinsingNOVELLUS SYSTEMS INC·Filed 1999·Granted Apr 10, 2001·48 cites·10 claims
- 3277US4994400AMethod of fabricating a semiconductor device using a tri-layer structure and conductive sidewallsTEKTRONIX INC·Filed 1989·Granted Feb 19, 1991·42 cites·25 claims
- 3375US8026174B1Sequential station tool for wet processing of semiconductor wafersNOVELLUS SYSTEMS INC·Filed 2009·Granted Sep 27, 2011·3 cites·20 claims
- 3473US7084466B1Liquid detection end effector sensor and method of using the sameNOVELLUS SYSTEMS INC·Filed 2002·Granted Aug 1, 2006·14 cites·8 claims
- 3572US7696538B2Sensor for measuring liquid contaminants in a semiconductor wafer fabrication processNOVELLUS SYSTEMS INC·Filed 2006·Granted Apr 13, 2010·3 cites·20 claims
- 3665US6343793B1Dual channel rotary unionNOVELLUS SYSTEMS INC·Filed 1999·Granted Feb 5, 2002·19 cites·12 claims
- 3763USD672010SAdjustable chemical vapor deposition showerhead assemblyVERDEFLOR PERCIVAL·Filed 2012·Granted Dec 4, 2012·17 cites·1 claims
- 3859US4876214AMethod for fabricating an isolation region in a semiconductor substrateTEKTRONIX INC·Filed 1988·Granted Oct 24, 1989·25 cites·18 claims
- 3949US2012279864A1Process for electroplating metals into microscopic recessed featuresMAYER STEVEN T·Filed 2011·Application pending·0 cites
- 4046US10964514B2Electrode for plasma processing chamberLAM RES CORP·Filed 2017·Granted Mar 30, 2021·0 cites·23 claims
- 4146US2014122396A1Rules engine as a platform for mobile applicationsQUALCOMM INC·Filed 2013·Application pending·0 cites
- 4244US2014122378A1Rules engine as a platform for mobile applicationsQUALCOMM INC·Filed 2013·Application pending·0 cites
- 4342US2016254125A1Method for coating surfacesLAM RES CORP·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →