Inventor · disambiguated record
Fen Chen
Also filed as: CHEN FEN · Chen fen-fen
72 granted patents·10 pending applications·470 citations·filing 2000–2019
99Inventor score
Top patents by PatentIndex Score
82 records- 0196US8053814B2On-chip embedded thermal antenna for chip coolingIBM·Filed 2009·Granted Nov 8, 2011·44 cites·16 claims
- 0295US8847401B2Semiconductor structure incorporating a contact sidewall spacer with a self-aligned airgap and a method of forming the semiconductor structureIBM·Filed 2012·Granted Sep 30, 2014·22 cites·25 claims
- 0394US10309919B2Moisture detection and ingression monitoring systems and methods of manufactureIBM·Filed 2018·Granted Jun 4, 2019·5 cites·13 claims
- 0494US8563336B2Method for forming thin film resistor and terminal bond pad simultaneouslyCHEN FEN·Filed 2008·Granted Oct 22, 2013·18 cites·16 claims
- 0593US10126260B2Moisture detection and ingression monitoring systems and methods of manufactureIBM·Filed 2015·Granted Nov 13, 2018·5 cites·20 claims
- 0693US8405135B23D via capacitor with a floating conductive plate for improved reliabilityYANG CHIH-CHAO·Filed 2010·Granted Mar 26, 2013·14 cites·16 claims
- 0792US7571637B2Design structure for an on-chip real-time moisture sensor for and method of detecting moisture ingress in an integrated circuit chipIBM·Filed 2007·Granted Aug 11, 2009·20 cites·5 claims
- 0892US6788093B2Methodology and apparatus using real-time optical signal for wafer-level device dielectrical reliability studiesIBM·Filed 2002·Granted Sep 7, 2004·131 cites·17 claims
- 0991US10324056B2Moisture detection and ingression monitoring systems and methods of manufactureIBM·Filed 2018·Granted Jun 18, 2019·3 cites·9 claims
- 1090US10388567B2Thru-silicon-via structuresGLOBALFOUNDRIES INC·Filed 2017·Granted Aug 20, 2019·6 cites·19 claims
- 1190US7381981B2Phase-change TaN resistor based triple-state/multi-state read only memoryIBM·Filed 2005·Granted Jun 3, 2008·18 cites·20 claims
- 1289US9812359B2Thru-silicon-via structuresIBM·Filed 2015·Granted Nov 7, 2017·6 cites·4 claims
- 1387US7345503B2Method and apparatus for impedance matching in transmission circuits using tantalum nitride resistor devicesIBM·Filed 2006·Granted Mar 18, 2008·13 cites·8 claims
- 1486US9891261B2Electromigration monitorIBM·Filed 2014·Granted Feb 13, 2018·6 cites·10 claims
- 1585US9159671B2Copper wire and dielectric with air gapsIBM·Filed 2013·Granted Oct 13, 2015·5 cites·16 claims
- 1684US8890556B2Real-time on-chip EM performance monitoringCHEN FEN·Filed 2011·Granted Nov 18, 2014·6 cites·19 claims
- 1783US8779491B23D via capacitor with a floating conductive plate for improved reliabilityIBM·Filed 2013·Granted Jul 15, 2014·5 cites·14 claims
- 1882US10545110B2Moisture detection and ingression monitoring systems and methods of manufactureIBM·Filed 2019·Granted Jan 28, 2020·2 cites·13 claims
- 1982US6639242B1Monolithically integrated solid-state SiGe thermoelectric energy converter for high speed and low power circuitsIBM·Filed 2002·Granted Oct 28, 2003·29 cites·24 claims
- 2081US8609504B23D via capacitor with a floating conductive plate for improved reliabilityIBM·Filed 2013·Granted Dec 17, 2013·4 cites·15 claims
- 2179US9613853B2Copper wire and dielectric with air gapsIBM·Filed 2015·Granted Apr 4, 2017·2 cites·18 claims
- 2278US9711464B2Semiconductor chip with anti-reverse engineering functionIBM·Filed 2015·Granted Jul 18, 2017·3 cites·13 claims
- 2378US9093503B1Semiconductor chip with a dual damascene wire and through-substrate via (TSV) structureIBM·Filed 2014·Granted Jul 28, 2015·4 cites·14 claims
- 2476US7795679B2Device structures with a self-aligned damage layer and methods for forming such device structuresIBM·Filed 2008·Granted Sep 14, 2010·5 cites·19 claims
- 2576US6790744B2Monolithically integrated solid-state sige thermoelectric energy converter for high speed and low power circuitsIBM·Filed 2003·Granted Sep 14, 2004·19 cites·6 claims
- 2673US9851397B2Electromigration testing of interconnect analogues having bottom-connected sensory pinsGLOBALFOUNDRIES INC·Filed 2015·Granted Dec 26, 2017·2 cites·18 claims
- 2772US9404953B2Structures and methods for monitoring dielectric reliability with through-silicon viasIBM·Filed 2013·Granted Aug 2, 2016·2 cites·12 claims
- 2872US8569888B2Wiring structure and method of forming the structureCHEN FEN·Filed 2011·Granted Oct 29, 2013·3 cites·23 claims
- 2972US8497203B2Semiconductor structures and methods of manufactureCHEN FEN·Filed 2010·Granted Jul 30, 2013·3 cites·23 claims
- 3071US10900923B2Moisture detection and ingression monitoring systems and methods of manufactureIBM·Filed 2019·Granted Jan 26, 2021·0 cites·18 claims
- 3171US9287345B2Semiconductor structure with thin film resistor and terminal bond padIBM·Filed 2013·Granted Mar 15, 2016·2 cites·19 claims
- 3271US9059052B2Alternating open-ended via chains for testing via formation and dielectric integrityIBM·Filed 2013·Granted Jun 16, 2015·2 cites·20 claims
- 3371US9013202B2Testing structure and method of using the testing structureCHEN FEN·Filed 2012·Granted Apr 21, 2015·3 cites·17 claims
- 3471US7709401B2Method of making thermally programmable anti-reverse engineering interconnects wherein interconnects only conduct when heated above room temperatureIBM·Filed 2008·Granted May 4, 2010·4 cites·12 claims
- 3570US8294505B2Stackable programmable passive device and a testing methodCHEN FEN·Filed 2005·Granted Oct 23, 2012·4 cites·3 claims
- 3670US7998828B2Method of forming metal ion transistorIBM·Filed 2010·Granted Aug 16, 2011·2 cites·13 claims
- 3770US7768815B2Optoelectronic memory devicesIBM·Filed 2005·Granted Aug 3, 2010·5 cites·13 claims
- 3869US9453873B2Non-planar field effect transistor test structure and lateral dielectric breakdown testing methodIBM·Filed 2014·Granted Sep 27, 2016·2 cites·20 claims
- 3969US8917104B2Analyzing EM performance during IC manufacturingCHEN FEN·Filed 2011·Granted Dec 23, 2014·2 cites·19 claims
- 4069US8754655B2Test structure, method and circuit for simultaneously testing time dependent dielectric breakdown and electromigration or stress migrationBROCHU JR DAVID G·Filed 2011·Granted Jun 17, 2014·3 cites·25 claims
- 4169US8362794B2Method and system for assessing reliability of integrated circuitIBM·Filed 2009·Granted Jan 29, 2013·5 cites·22 claims
- 4268US7500208B2Non-destructive evaluation of microstructure and interface roughness of electrically conducting lines in semiconductor integrated circuits in deep sub-micron regimeIBM·Filed 2007·Granted Mar 3, 2009·2 cites·7 claims
- 4367US9230914B2Copper wire and dielectric with air gapsIBM·Filed 2014·Granted Jan 5, 2016·1 cites·15 claims
- 4467US7843062B2Thermally programmable anti-reverse engineering interconnects wherein interconnects only conduct when heated above room temperatureIBM·Filed 2010·Granted Nov 30, 2010·2 cites·13 claims
- 4566US10141274B2Semiconductor chip with anti-reverse engineering functionIBM·Filed 2017·Granted Nov 27, 2018·1 cites·13 claims
- 4665US7084483B2Trench type buried on-chip precision programmable resistorIBM·Filed 2004·Granted Aug 1, 2006·10 cites·16 claims
- 4764US9029172B2On-chip poly-to-contact process monitoring and reliability evaluation system and method of useCHEN FEN·Filed 2012·Granted May 12, 2015·1 cites·16 claims
- 4863US7601602B2Trench type buried on-chip precision programmable resistorIBM·Filed 2006·Granted Oct 13, 2009·2 cites·2 claims
- 4962US7715248B2Phase-change TaN resistor based triple-state/multi-state read only memoryIBM·Filed 2008·Granted May 11, 2010·3 cites·20 claims
- 5060US10545111B1Moisture detection and ingression monitoring systems and methods of manufactureIBM·Filed 2019·Granted Jan 28, 2020·0 cites·12 claims
Showing the top 50 of 82 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →