Inventor · disambiguated record
Frank Mantz
Also filed as: MANTZ FRANK · MANTZ FRANK E
3 granted patents·6 pending applications·51 citations·filing 2001–2011
72Inventor score
Top patents by PatentIndex Score
9 records- 0184US6573461B2Retaining ring interconnect used for 3-D stackingDPAC TECHNOLOGIES CORP·Filed 2001·Granted Jun 3, 2003·33 cites·10 claims
- 0272US6573460B2Post in ring interconnect using for 3-D stackingDPAC TECHNOLOGIES CORP·Filed 2001·Granted Jun 3, 2003·15 cites·9 claims
- 0361US7990727B1Ball grid array stackAPROLASE DEV CO LLC·Filed 2007·Granted Aug 2, 2011·3 cites·20 claims
- 0439US2011271523A1Ball grid array stackMANTZ FRANK·Filed 2011·Application pending·0 cites
- 0537US2003051903A1Retaining ring interconnect used for 3-D stackingDENSE PAC MICROSYSTEMS INC A C·Filed 2002·Application pending·0 cites
- 0635US2003051911A1Post in ring interconnect using 3-D stackingFiled 2002·Application pending·0 cites
- 0732US2003002267A1I/O interface structureFiled 2002·Application pending·0 cites
- 0832US2002190367A1Slice interconnect structureFiled 2002·Application pending·0 cites
- 0932US2003085455A1Thermal ring used in 3-D stackingFiled 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →