Inventor · disambiguated record
Frank Osterwald
Also filed as: OSTERWALD FRANK
17 granted patents·4 pending applications·16 citations·filing 2011–2020
89Inventor score
Top patents by PatentIndex Score
21 records- 0194US11400514B2Sintering tool and method for sintering an electronic subassemblyDANFOSS SILICON POWER GMBH·Filed 2020·Granted Aug 2, 2022·3 cites·14 claims
- 0283US10832995B2Power moduleDANFOSS SILICON POWER GMBH·Filed 2019·Granted Nov 10, 2020·3 cites·20 claims
- 0372US10079219B2Power semiconductor contact structure and method for the production thereofDANFOSS SILICON POWER GMBH·Filed 2015·Granted Sep 18, 2018·2 cites·18 claims
- 0471US10483229B2Sintering deviceDANFOSS SILICON POWER GMBH·Filed 2015·Granted Nov 19, 2019·2 cites·20 claims
- 0570US10622331B2Method for producing a substrate arrangement, substrate arrangement, and method for connecting a substrate arrangement to an electronic componentHERAEUS DEUTSCHLAND GMBH & CO KG·Filed 2016·Granted Apr 14, 2020·2 cites·11 claims
- 0665US9613929B2Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereofDANFOSS SILICON POWER GMBH·Filed 2016·Granted Apr 4, 2017·1 cites·7 claims
- 0762US10381283B2Power semiconductor moduleDANFOSS SILICON POWER GMBH·Filed 2016·Granted Aug 13, 2019·1 cites·13 claims
- 0858US9786627B2Method for creating a connection between metallic moulded bodies and a power semiconductor which is used to bond to thick wires or stripsBECKER MARTIN·Filed 2012·Granted Oct 10, 2017·1 cites·22 claims
- 0955US10306800B2Cooling trough, cooler and power module assemblyDANFOSS SILICON POWER GMBH·Filed 2015·Granted May 28, 2019·1 cites·17 claims
- 1050US10814396B2Sintering tool and method for sintering an electronic subassemblyDANFOSS SILICON POWER GMBH·Filed 2015·Granted Oct 27, 2020·0 cites·15 claims
- 1150US10403566B2Power moduleDANFOSS SILICON POWER GMBH·Filed 2016·Granted Sep 3, 2019·0 cites·11 claims
- 1249US12125817B2Semiconductor module with a first substrate, a second substrate and a spacer separating the substrates from each otherDANFOSS SILICON POWER GMBH·Filed 2020·Granted Oct 22, 2024·0 cites·24 claims
- 1348US9318421B2Power semiconductor chip with a metallic moulded body for contacting thick wires or strips and method for the production thereofBECKER MARTIN·Filed 2012·Granted Apr 19, 2016·0 cites·18 claims
- 1444US10607962B2Method for manufacturing semiconductor chipsDANFOSS SILICON POWER GMBH·Filed 2016·Granted Mar 31, 2020·0 cites·11 claims
- 1544US10332858B2Electronic sandwich structure with two parts joined together by means of a sintering layerDANFOSS SILICON POWER GMBH·Filed 2015·Granted Jun 25, 2019·0 cites·20 claims
- 1642US10818633B2Sintering tool for the lower die of a sintering deviceDANFOSS SILICON POWER GMBH·Filed 2015·Granted Oct 27, 2020·0 cites·18 claims
- 1742US10438924B2Method for cohesively connecting a first component of a power semiconductor module to a second component of a power semiconductor moduleDANFOSS SILICON POWER GMBH·Filed 2017·Granted Oct 8, 2019·0 cites·20 claims
- 1840US2021013175A1Method of assembling a semiconductor power module component and a semiconductor power module with such a module component and manufacturing system thereforDANFOSS SILICON POWER GMBH·Filed 2019·Application pending·0 cites
- 1937US2013032230A1Flow distributorDANFOSS SILICON POWER GMBH·Filed 2011·Application pending·0 cites
- 2034US2018301354A1Method for manufacturing a circuit carrierDANFOSS SILICON POWER GMBH·Filed 2016·Application pending·0 cites
- 2132US2017338193A1Power semiconductor module with short-circuit failure modeDANFOSS SILICON POWER GMBH·Filed 2015·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →