Inventor · disambiguated record
Frederick Wu
Also filed as: WU FREDERICK · WU FREDERICK C
12 granted patents·6 pending applications·554 citations·filing 1998–2012
94Inventor score
Top patents by PatentIndex Score
18 records- 0196US7682946B2Apparatus and process for plasma-enhanced atomic layer depositionAPPLIED MATERIALS INC·Filed 2006·Granted Mar 23, 2010·40 cites·33 claims
- 0296US7605083B2Formation of composite tungsten filmsAPPLIED MATERIALS INC·Filed 2008·Granted Oct 20, 2009·39 cites·25 claims
- 0396US6939804B2Formation of composite tungsten filmsAPPLIED MATERIALS INC·Filed 2002·Granted Sep 6, 2005·116 cites·61 claims
- 0496US6524952B1Method of forming a titanium silicide layer on a substrateAPPLIED MATERIALS INC·Filed 2000·Granted Feb 25, 2003·170 cites·15 claims
- 0595US7850779B2Apparatus and process for plasma-enhanced atomic layer depositionAPPLIED MATERISALS INC·Filed 2006·Granted Dec 14, 2010·69 cites·6 claims
- 0692US7384867B2Formation of composite tungsten filmsAPPLIED MATERIALS INC·Filed 2005·Granted Jun 10, 2008·16 cites·48 claims
- 0789US9032906B2Apparatus and process for plasma-enhanced atomic layer depositionMA PAUL·Filed 2007·Granted May 19, 2015·13 cites·20 claims
- 0887US7833358B2Method of recovering valuable material from exhaust gas stream of a reaction chamberAPPLIED MATERIALS INC·Filed 2006·Granted Nov 16, 2010·17 cites·11 claims
- 0974US6242347B1Method for cleaning a process chamberAPPLIED MATERIALS INC·Filed 1998·Granted Jun 5, 2001·39 cites·25 claims
- 1052US6482746B2Computer readable medium for controlling a method of cleaning a process chamberAPPLIED MATERIALS INC·Filed 2001·Granted Nov 19, 2002·4 cites·25 claims
- 1150US6548402B2Method of depositing a thick titanium nitride filmAPPLIED MATERIALS INC·Filed 1999·Granted Apr 15, 2003·16 cites·26 claims
- 1249US2006246699A1Process for electroless copper deposition on a ruthenium seedWEIDMAN TIMOTHY W·Filed 2006·Application pending·0 cites
- 1349US2012315756A1Process for electroless copper deposition on a ruthenium seedWEIDMAN TIMOTHY W·Filed 2012·Application pending·0 cites
- 1448US6221174B1Method of performing titanium/titanium nitride integrationAPPLIED MATERIALS INC·Filed 1999·Granted Apr 24, 2001·15 cites·22 claims
- 1544US2007054487A1Atomic layer deposition processes for ruthenium materialsAPPLIED MATERIALS INC·Filed 2006·Application pending·0 cites
- 1641US2007077750A1Atomic layer deposition processes for ruthenium materialsMA PAUL·Filed 2006·Application pending·0 cites
- 1737US2003049931A1Formation of refractory metal nitrides using chemisorption techniquesAPPLIED MATERIALS INC·Filed 2001·Application pending·0 cites
- 1836US2003072884A1Method of titanium and titanium nitride layer depositionAPPLIED MATERIALS INC·Filed 2001·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →