Inventor · disambiguated record
Fumiko Iwao
Also filed as: IWAO FUMIKO
11 granted patents·520 citations·filing 2001–2014
89Inventor score
Top patents by PatentIndex Score
11 records- 0198US9741559B2Film forming method, computer storage medium, and film forming systemTOKYO ELECTRON LTD·Filed 2014·Granted Aug 22, 2017·466 cites·16 claims
- 0288US7901514B2Substrate cleaning method and developing apparatusTOKYO ELECTRON LTD·Filed 2009·Granted Mar 8, 2011·12 cites·20 claims
- 0386US9329483B2Film forming method, non-transitory computer storage medium and film forming apparatusTOKYO ELECTRON LTD·Filed 2013·Granted May 3, 2016·7 cites·9 claims
- 0486US7604013B2Substrate cleaning method and developing apparatusTOKYO ELECTRON LTD·Filed 2005·Granted Oct 20, 2009·11 cites·10 claims
- 0579US8791030B2Coating treatment method and coating treatment apparatusTOKYO ELECTRON LTD·Filed 2013·Granted Jul 29, 2014·4 cites·21 claims
- 0679US6793793B2Electrochemical treating method such as electroplating and electrochemical reaction device thereforYOSHIDA HIDEO·Filed 2001·Granted Sep 21, 2004·13 cites·22 claims
- 0774US9341952B2Substrate treatment method, non-transitory computer storage medium and substrate treatment systemTOKYO ELECTRON LTD·Filed 2014·Granted May 17, 2016·2 cites·18 claims
- 0870US8530357B2Method for manufacturing semiconductor device and apparatus for manufacturing semiconductor deviceIWAO FUMIKO·Filed 2011·Granted Sep 10, 2013·3 cites·4 claims
- 0969US9280052B2Substrate treatment method, non-transitory computer storage medium and substrate treatment systemTOKYO ELECTRON LTD·Filed 2014·Granted Mar 8, 2016·2 cites·4 claims
- 1044US8202682B2Method of manufacturing semiconductor device, and resist coating and developing systemIWAO FUMIKO·Filed 2009·Granted Jun 19, 2012·0 cites·16 claims
- 1140US8842257B2Substrate treatment method, substrate treatment apparatus, and non-transitory computer storage mediumKOBAYASHI SHINJI·Filed 2012·Granted Sep 23, 2014·0 cites·9 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →