Inventor · disambiguated record
Gene Hempel
Also filed as: HEMPEL GENE
6 granted patents·252 citations·filing 1999–2001
87Inventor score
Top patents by PatentIndex Score
6 records- 0186US6645046B1Conditioning mechanism in a chemical mechanical polishing apparatus for semiconductor wafersLAM RES CORP·Filed 2000·Granted Nov 11, 2003·40 cites·13 claims
- 0286US6227950B1Dual purpose handoff station for workpiece polishing machineSPEEDFAM IPEC CORP·Filed 1999·Granted May 8, 2001·67 cites·17 claims
- 0379US6309279B1Arrangements for wafer polishingSPEEDFAM IPEC CORP·Filed 1999·Granted Oct 30, 2001·64 cites·31 claims
- 0479US6244941B1Method and apparatus for pad removal and replacementSPEEDFAM IPEC CORP·Filed 1999·Granted Jun 12, 2001·50 cites·2 claims
- 0576US6575816B2Dual purpose handoff station for workpiece polishing machineSPEEDFAM IPEC CORP·Filed 2001·Granted Jun 10, 2003·17 cites·5 claims
- 0645US6290578B1Method for chemical mechanical polishing using synergistic geometric patternsSPEEDFAM IPEC CORP·Filed 1999·Granted Sep 18, 2001·14 cites·11 claims
Join the waitlist — get patent alerts
Get an alert when Gene Hempel files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →