Inventor · disambiguated record
Gerald Lackner
Also filed as: LACKNER GERALD
25 granted patents·3 pending applications·115 citations·filing 1987–2023
95Inventor score
Files withINFINEON TECHNOLOGIES AG15AVL VERBRENNUNGSKRAFT MESSTECH3INFINEON TECHNOLOGIES AUSTRIA2TESMA MOTOREN GETRIEBETECHNIK2VON KOBLINSKI CARSTEN2
Top patents by PatentIndex Score
28 records- 0189US8202786B2Method for manufacturing semiconductor devices having a glass substrateVON KOBLINSKI CARSTEN·Filed 2010·Granted Jun 19, 2012·11 cites·17 claims
- 0287US8546934B2Method for manufacturing semiconductor devices having a glass substrateVON KOBLINSKI CARSTEN·Filed 2012·Granted Oct 1, 2013·9 cites·3 claims
- 0383US11302579B2Composite wafer, semiconductor device and electronic componentINFINEON TECHNOLOGIES AG·Filed 2020·Granted Apr 12, 2022·1 cites·5 claims
- 0481US9177893B2Semiconductor component with a front side and a back side metallization layer and manufacturing method thereofMAUDER ANTON·Filed 2011·Granted Nov 3, 2015·6 cites·13 claims
- 0580US12148640B2Method and apparatus for use in wafer processingINFINEON TECHNOLOGIES AG·Filed 2023·Granted Nov 19, 2024·0 cites·19 claims
- 0679US10672664B2Composite wafer, semiconductor device, electronic component and method of manufacturing a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jun 2, 2020·2 cites·14 claims
- 0779US10186438B2Method and apparatus for use in wafer processingINFINEON TECHNOLOGIES AG·Filed 2015·Granted Jan 22, 2019·2 cites·15 claims
- 0876US4809540AMethod and apparatus for testing internal combustion enginesAVL VERBRENNUNGSKRAFT MESSTECH·Filed 1987·Granted Mar 7, 1989·34 cites·15 claims
- 0975US8803312B2Method for manufacturing semiconductor devices having a glass substrateINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Aug 12, 2014·3 cites·7 claims
- 1074US11848237B2Composite wafer, semiconductor device and electronic componentINFINEON TECHNOLOGIES AG·Filed 2022·Granted Dec 19, 2023·0 cites·10 claims
- 1174US8822310B2Method, apparatus for holding and treatment of a substrateINFINEON TECHNOLOGIES AG·Filed 2013·Granted Sep 2, 2014·2 cites·19 claims
- 1272US11637028B2Method and apparatus for use in wafer processingINFINEON TECHNOLOGIES AG·Filed 2021·Granted Apr 25, 2023·0 cites·19 claims
- 1367US8857805B2Method, apparatus for holding and treatment of a substrateLACKNER GERALD·Filed 2007·Granted Oct 14, 2014·3 cites·22 claims
- 1467US2023330769A1Parent Substrate, Wafer Composite and Methods of Manufacturing Crystalline Substrates and Semiconductor DevicesINFINEON TECHNOLOGIES AG·Filed 2023·Application pending·0 cites
- 1563US11712749B2Parent substrate, wafer composite and methods of manufacturing crystalline substrates and semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2020·Granted Aug 1, 2023·0 cites·26 claims
- 1662US10985041B2Method and apparatus for use in wafer processingINFINEON TECHNOLOGIES AG·Filed 2018·Granted Apr 20, 2021·0 cites·20 claims
- 1762US8226144B2Motor vehicle with extendible vehicle bodySHEIKHHA MOHAMMAD HOSSEIN·Filed 2010·Granted Jul 24, 2012·6 cites·6 claims
- 1859US12205842B2Wafer chuck for a laser beam wafer dicing equipmentINFINEON TECHNOLOGIES AG·Filed 2022·Granted Jan 21, 2025·0 cites·19 claims
- 1959US8865522B2Method for manufacturing semiconductor devices having a glass substrateINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Granted Oct 21, 2014·1 cites·23 claims
- 2057US6443195B2Filler neckTESMA MOTOREN GETRIEBETECHNIK·Filed 2001·Granted Sep 3, 2002·13 cites·4 claims
- 2156US10777444B2Wafer arrangement and method for processing a waferINFINEON TECHNOLOGIES AG·Filed 2018·Granted Sep 15, 2020·0 cites·20 claims
- 2256US9966293B2Wafer arrangement and method for processing a waferINFINEON TECHNOLOGIES AG·Filed 2014·Granted May 8, 2018·0 cites·15 claims
- 2352US8993372B2Method for producing a semiconductor componentSCHNEEGANS MANFRED·Filed 2012·Granted Mar 31, 2015·0 cites·22 claims
- 2449US2023100613A1Wafer chuck for a laser beam wafer dicing equipmentINFINEON TECHNOLOGIES AG·Filed 2022·Application pending·0 cites
- 2545US5107213AMethod and apparatus for signal evaluation of zero-axis crossingsAVL VERBRENNUNGSKRAFT MESSTECH·Filed 1991·Granted Apr 21, 1992·9 cites·12 claims
- 2643US6547089B2Tank capTESMA MOTOREN GETRIEBETECHNIK·Filed 2001·Granted Apr 15, 2003·6 cites·10 claims
- 2742US2014306327A1Semiconductor device and method of manufacturing thereofINFINEON TECHNOLOGIES AG·Filed 2013·Application pending·0 cites
- 2831US4791808AMethod of diagnosis of multi-cylinder internal combustion engines and means for carrying out the methodAVL VERBRENNUNGSKRAFT MESSTECH·Filed 1987·Granted Dec 20, 1988·7 cites·22 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →