Inventor · disambiguated record
George R. Leal
Also filed as: LEAL GEORGE R
23 granted patents·3 pending applications·977 citations·filing 2002–2015
96Inventor score
Top patents by PatentIndex Score
26 records- 0198US6921975B2Circuit device with at least partial packaging, exposed active surface and a voltage reference planeFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Jul 26, 2005·233 cites·23 claims
- 0298US6838776B2Circuit device with at least partial packaging and method for formingFREESCALE SEMICONDUCTOR INC·Filed 2003·Granted Jan 4, 2005·314 cites·43 claims
- 0397US7405102B2Methods and apparatus for thermal management in a multi-layer embedded chip structureFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Jul 29, 2008·69 cites·12 claims
- 0497US7361987B2Circuit device with at least partial packaging and method for formingFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted Apr 22, 2008·75 cites·15 claims
- 0594US8216918B2Method of forming a packaged semiconductor deviceGONG ZHIWEI·Filed 2010·Granted Jul 10, 2012·22 cites·5 claims
- 0694US6844631B2Semiconductor device having a bond pad and method thereforFREESCALE SEMICONDUCTOR INC·Filed 2002·Granted Jan 18, 2005·161 cites·11 claims
- 0792US8349666B1Fused buss for plating features on a semiconductor dieFREESCALE SEMICONDUCTOR INC·Filed 2011·Granted Jan 8, 2013·15 cites·11 claims
- 0892US7892882B2Methods and apparatus for a semiconductor device package with improved thermal performanceFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Feb 22, 2011·26 cites·10 claims
- 0982US9107303B2Warp compensated electronic assembliesFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Aug 11, 2015·5 cites·15 claims
- 1080US8829661B2Warp compensated package and methodLYTLE WILLIAM H·Filed 2006·Granted Sep 9, 2014·11 cites·18 claims
- 1176US7528069B2Fine pitch interconnect and method of makingFREESCALE SEMICONDUCTOR INC·Filed 2005·Granted May 5, 2009·7 cites·18 claims
- 1275US7950144B2Method for controlling warpage in redistributed chip packaging panelsFREESCALE SEMICONDUCTOR INC·Filed 2008·Granted May 31, 2011·7 cites·19 claims
- 1374US9142434B2Method for singulating electronic components from a substrateGAO WEI·Filed 2008·Granted Sep 22, 2015·4 cites·7 claims
- 1472US10424521B2Programmable stitch chaining of die-level interconnects for reliability testingFREESCALE SEMICONDUCTOR INC·Filed 2014·Granted Sep 24, 2019·2 cites·14 claims
- 1570US8877523B2Recovery method for poor yield at integrated circuit die panelizationLEAL GEORGE R·Filed 2011·Granted Nov 4, 2014·3 cites·15 claims
- 1670US8368172B1Fused buss for plating features on a semiconductor dieFREESCALE SEMICONDUCTOR INC·Filed 2011·Granted Feb 5, 2013·2 cites·20 claims
- 1770US7271013B2Semiconductor device having a bond pad and method thereforFREESCALE SEMICONDUCTOR INC·Filed 2004·Granted Sep 18, 2007·17 cites·18 claims
- 1868US8072062B2Circuit device with at least partial packaging and method for formingLEAL GEORGE R·Filed 2008·Granted Dec 6, 2011·3 cites·14 claims
- 1960US8970026B2Methods and structures for reducing stress on die assemblyLEAL GEORGE R·Filed 2013·Granted Mar 3, 2015·1 cites·20 claims
- 2048US9159643B2Matrix lid heatspreader for flip chip packageLEAL GEORGE R·Filed 2012·Granted Oct 13, 2015·0 cites·13 claims
- 2148US7579219B2Semiconductor device with a protected active die region and method thereforFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Aug 25, 2009·0 cites·16 claims
- 2246US9640469B2Matrix lid heatspreader for flip chip packageLEAL GEORGE R·Filed 2015·Granted May 2, 2017·0 cites·15 claims
- 2345US7553753B2Method of forming crack arrest features in embedded device build-up package and package thereofFREESCALE SEMICONDUCTOR INC·Filed 2006·Granted Jun 30, 2009·0 cites·15 claims
- 2444US2010148357A1Method of packaging integrated circuit dies with thermal dissipation capabilityFREESCALE SEMICONDUCTOR INC·Filed 2008·Application pending·0 cites
- 2541US2007212813A1Perforated embedded plane package and methodFAY OWEN R·Filed 2006·Application pending·0 cites
- 2640US2005242425A1Semiconductor device with a protected active die region and method thereforLEAL GEORGE R·Filed 2004·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →