Inventor · disambiguated record
Gerard J. Sullivan
Also filed as: HUGHES A JAMES · SULLIVAN GERARD · SULLIVAN GERARD J
18 granted patents·4 pending applications·719 citations·filing 1990–2016
94Inventor score
Files withROCKWELL AUTOMATION TECH INC4TELEDYNE LICENSING LLC4BRAR BERINDER2HONEYWELL INT INC2INNOVATIVE TECH LICENSING LLC2
Top patents by PatentIndex Score
22 records- 0194US5391257AMethod of transferring a thin film to an alternate substrateROCKWELL INTERNATIONAL CORP·Filed 1993·Granted Feb 21, 1995·356 cites·17 claims
- 0292US6188322B1Method for sensing electrical currentROCKWELL TECH LLC·Filed 1999·Granted Feb 13, 2001·85 cites·23 claims
- 0390US6504356B2Microelectro-mechanical high resolution current sensing apparatusROCKWELL AUTOMATION TECH INC·Filed 2001·Granted Jan 7, 2003·34 cites·20 claims
- 0490US6483116B1High performance ultraviolet imager for operation at room temperatureINNOVATIVE TECH LICENSING LLC·Filed 2000·Granted Nov 19, 2002·77 cites·24 claims
- 0588US6476374B1Room temperature, low-light-level visible imagerINNOVATIVE TECH LICENSING LLC·Filed 2000·Granted Nov 5, 2002·57 cites·28 claims
- 0685US6466005B2High resolution current sensing apparatusROCKWELL AUTOMATION TECH INC·Filed 2001·Granted Oct 15, 2002·24 cites·6 claims
- 0785US6411214B1Method for sensing electrical currentROCKWELL AUTOMATION TECH INC·Filed 2000·Granted Jun 25, 2002·26 cites·37 claims
- 0885US6348788B1High resolution current sensing apparatusROCKWELL AUTOMATION TECH INC·Filed 1999·Granted Feb 19, 2002·46 cites·23 claims
- 0963US8178863B2Lateral collection architecture for SLS detectorsTENNANT WILLIAM E·Filed 2009·Granted May 15, 2012·1 cites·36 claims
- 1059US9570428B1Tiled hybrid array and method of formingTELEDYNE SCIENT & IMAGING LLC·Filed 2016·Granted Feb 14, 2017·1 cites·31 claims
- 1158US7518165B2Epitaxial nucleation and buffer sequence for via-compatible InAs/AlGaSb HEMTsTELEDYNE LICENSING LLC·Filed 2006·Granted Apr 14, 2009·1 cites·12 claims
- 1257US8697554B2Lateral collection architecture for SLS detectorsTENNANT WILLIAM E·Filed 2011·Granted Apr 15, 2014·0 cites·19 claims
- 1356US7176063B2High density 3-D integrated circuit packageHONEYWELL INT INC·Filed 2005·Granted Feb 13, 2007·1 cites·7 claims
- 1455US7808016B2Heterogeneous integration of low noise amplifiers with power amplifiers or switchesTELEDYNE LICENSING LLC·Filed 2006·Granted Oct 5, 2010·1 cites·19 claims
- 1550US7820541B2Process for forming low defect density heterojunctionsTELEDYNE LICENSING LLC·Filed 2006·Granted Oct 26, 2010·0 cites·18 claims
- 1646US2011220967A1Process for forming low defect density heterojunctionsTELEDYNE LICENSING LLC·Filed 2011·Application pending·0 cites
- 1745US6958533B2High density 3-D integrated circuit packageHONEYWELL INT INC·Filed 2002·Granted Oct 25, 2005·2 cites·17 claims
- 1843US2011031531A1Process for forming low defect density heterojunctionsSULLIVAN GERARD J·Filed 2010·Application pending·0 cites
- 1941US2011143518A1Heterogeneous integration of low noise amplifiers with power amplifiers or switchesBRAR BERINDER·Filed 2011·Application pending·0 cites
- 2041US2011018034A1Heterogeneous integration of low noise amplifiers with power amplifiers or switchesBRAR BERINDER·Filed 2010·Application pending·0 cites
- 2135US9520336B1Hybrid assembly with improved thermal performanceTELEDYNE SCIENT & IMAGING LLC·Filed 2016·Granted Dec 13, 2016·0 cites·9 claims
- 2234US5067828ATransferred electron effective mass modulatorROCKWELL INTERNATIONAL CORP·Filed 1990·Granted Nov 26, 1991·7 cites·18 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →