Inventor · disambiguated record
Giles Humpston
Also filed as: HUMPSTON GILES
46 granted patents·33 pending applications·1,026 citations·filing 1990–2016
98Inventor score
Top patents by PatentIndex Score
79 records- 0198US7768574B2Compact lens turret assemblyTESSERA INC·Filed 2005·Granted Aug 3, 2010·95 cites·20 claims
- 0297US7935568B2Wafer-level fabrication of lidded chips with electrodeposited dielectric coatingTESSERA TECH IRELAND LTD·Filed 2006·Granted May 3, 2011·74 cites·28 claims
- 0397US7443597B2Liquid lens with piezoelectric voltage converterTESSERA INC·Filed 2005·Granted Oct 28, 2008·44 cites·21 claims
- 0496US8193615B2Semiconductor packaging process using through silicon viasHABA BELGACEM·Filed 2008·Granted Jun 5, 2012·42 cites·32 claims
- 0596US7298030B2Structure and method of making sealed capped chipsTESSERA INC·Filed 2004·Granted Nov 20, 2007·75 cites·5 claims
- 0695US7719121B2Microelectronic packages and methods thereforTESSERA INC·Filed 2006·Granted May 18, 2010·45 cites·38 claims
- 0794US8461672B2Reconstituted wafer stack packaging with after-applied pad extensionsHABA BELGACEM·Filed 2008·Granted Jun 11, 2013·27 cites·38 claims
- 0894US8207604B2Microelectronic package comprising offset conductive posts on compliant layerHABA BELGACEM·Filed 2004·Granted Jun 26, 2012·93 cites·20 claims
- 0994US7936062B2Wafer level chip packagingTESSERA TECH IRELAND LTD·Filed 2007·Granted May 3, 2011·75 cites·23 claims
- 1094US7858445B2Wire bonded wafer level cavity packageTESSERA INC·Filed 2008·Granted Dec 28, 2010·26 cites·18 claims
- 1194US7593636B2Pin referenced image sensor to reduce tilt in a camera moduleTESSERA INC·Filed 2007·Granted Sep 22, 2009·35 cites·29 claims
- 1294US7569424B2Method of forming a wall structure in a microelectronic assemblyTESSERA INC·Filed 2006·Granted Aug 4, 2009·28 cites·18 claims
- 1394US7449779B2Wire bonded wafer level cavity packageTESSERA INC·Filed 2005·Granted Nov 11, 2008·26 cites·27 claims
- 1493US8466542B2Stacked microelectronic assemblies having vias extending through bond padsKRIMAN MOSHE·Filed 2010·Granted Jun 18, 2013·50 cites·23 claims
- 1593US7759166B2Microelectronic packages fabricated at the wafer level and methods thereforTESSERA INC·Filed 2006·Granted Jul 20, 2010·25 cites·12 claims
- 1693US7129576B2Structure and method of making capped chips including vertical interconnects having stud bumps engaged to surfaces of said capsTESSERA INC·Filed 2004·Granted Oct 31, 2006·46 cites·10 claims
- 1792US7224056B2Back-face and edge interconnects for lidded packageTESSERA INC·Filed 2004·Granted May 29, 2007·53 cites·24 claims
- 1891US7793414B2Methods for forming connection structures for microelectronic devicesTESSERA INC·Filed 2006·Granted Sep 14, 2010·18 cites·22 claims
- 1989US7485956B2Microelectronic package optionally having differing cover and device thermal expansivitiesTESSERA INC·Filed 2005·Granted Feb 3, 2009·19 cites·32 claims
- 2088US9029759B2Compact camera modules with features for reducing Z-height and facilitating lens alignment and methods for manufacturing the sameSINGH HARPUNEET·Filed 2012·Granted May 12, 2015·12 cites·46 claims
- 2187US8551815B2Stack packages using reconstituted wafersAVSIAN OSHER·Filed 2008·Granted Oct 8, 2013·21 cites·9 claims
- 2283US7545029B2Stack microelectronic assembliesTESSERA INC·Filed 2006·Granted Jun 9, 2009·13 cites·49 claims
- 2379US8735287B2Semiconductor packaging process using through silicon viasHABA BELGACEM·Filed 2012·Granted May 27, 2014·4 cites·16 claims
- 2473US8545599B2Electrohydrodynamic device components employing solid solutionsHUMPSTON GILES·Filed 2010·Granted Oct 1, 2013·1 cites·27 claims
- 2573US7510401B2Microelectronic component with foam-metal postsTESSERA INC·Filed 2006·Granted Mar 31, 2009·6 cites·9 claims
- 2669US7317249B2Microelectronic package having stacked semiconductor devices and a process for its fabricationTESSERA INC·Filed 2004·Granted Jan 8, 2008·15 cites·17 claims
- 2765US7262368B2Connection structures for microelectronic devices and methods for forming such structuresTESSERA INC·Filed 2004·Granted Aug 28, 2007·10 cites·51 claims
- 2862US8604605B2Microelectronic assembly with multi-layer support structureNYSTROM MICHAEL J·Filed 2007·Granted Dec 10, 2013·2 cites·27 claims
- 2959US9484379B2Rear-face illuminated solid state image sensorsINVENSAS CORP·Filed 2014·Granted Nov 1, 2016·0 cites·18 claims
- 3057US10249673B2Rear-face illuminated solid state image sensorsINVENSAS CORP·Filed 2016·Granted Apr 2, 2019·0 cites·16 claims
- 3157US8900910B2Rear-face illuminated solid state image sensorsINVENSAS CORP·Filed 2014·Granted Dec 2, 2014·0 cites·15 claims
- 3256US7026744B2Remote control and power systemBOOKHAM TECHNOLOGY PLC·Filed 2001·Granted Apr 11, 2006·4 cites·7 claims
- 3353US9548145B2Microelectronic assembly with multi-layer support structureINVENSAS CORP·Filed 2013·Granted Jan 17, 2017·0 cites·6 claims
- 3453US2008032457A1Structure and method of making sealed capped chipsTESSERA INC·Filed 2007·Application pending·0 cites
- 3552US2007096311A1Structure and method of making capped chips having vertical interconnectsTESSERA INC·Filed 2006·Application pending·0 cites
- 3652US2007096312A1Structure and self-locating method of making capped chipsTESSERA INC·Filed 2006·Application pending·0 cites
- 3751US8883562B2Reconstituted wafer stack packaging with after-applied pad extensionsTESSERA INC·Filed 2013·Granted Nov 11, 2014·0 cites·18 claims
- 3851US7521276B2Compliant terminal mountings with vented spaces and methodsTESSERA INC·Filed 2006·Granted Apr 21, 2009·0 cites·8 claims
- 3951US6732905B2Vented cavity, hermetic solder sealAGILENT TECHNOLOGIES INC·Filed 2002·Granted May 11, 2004·4 cites·13 claims
- 4051US5106009AMethods of joining componentsMARCONI ELECTRONIC DEVICES·Filed 1990·Granted Apr 21, 1992·20 cites·15 claims
- 4151US2006109366A1Compact lens turret assemblyTESSERA INC·Filed 2005·Application pending·0 cites
- 4251US2007096295A1Back-face and edge interconnects for lidded packageTESSERA INC·Filed 2006·Application pending·0 cites
- 4350US2010242269A1Compact lens turret assemblyTESSERA INC·Filed 2010·Application pending·0 cites
- 4450US2014027931A1Stack packages using reconstituted wafersTESSERA INC·Filed 2013·Application pending·0 cites
- 4550US2008029879A1Structure and method of making lidded chipsTESSERA INC·Filed 2007·Application pending·0 cites
- 4650US2008002460A1Structure and method of making lidded chipsTESSERA INC·Filed 2007·Application pending·0 cites
- 4749US2013340981A1Electrohydrodynamic (ehd) air mover configuration with flow path expansion and/or spreading for improved ozone catalysisTESSERA INC·Filed 2013·Application pending·0 cites
- 4848US7453139B2Compliant terminal mountings with vented spaces and methodsTESSERA INC·Filed 2005·Granted Nov 18, 2008·0 cites·12 claims
- 4948US6958446B2Compliant and hermetic solder sealAGILENT TECHNOLOGIES INC·Filed 2002·Granted Oct 25, 2005·2 cites·12 claims
- 5048US2008001241A1Structure and method of making lidded chipsTESSERA INC·Filed 2007·Application pending·0 cites
Showing the top 50 of 79 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →