Inventor · disambiguated record
Gi Tae Lim
Also filed as: LIM GI TAE
11 granted patents·6 pending applications·12 citations·filing 2010–2025
85Inventor score
Technology areasH10W
Top patents by PatentIndex Score
17 records- 0192US11482496B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Oct 25, 2022·3 cites·22 claims
- 0289US11996369B2Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted May 28, 2024·1 cites·20 claims
- 0386US11495505B2Semiconductor devices and related methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2020·Granted Nov 8, 2022·2 cites·19 claims
- 0482US2025022784A1Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrateAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 0579US11171127B2Semiconductor device and method of manufacturing semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Nov 9, 2021·3 cites·23 claims
- 0676US12107035B2Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrateAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Oct 1, 2024·0 cites·20 claims
- 0776US2025364504A1Semiconductor device and method of manufacturing semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2025·Application pending·0 cites
- 0874US2024395725A1Semiconductor devices and methods of manufacturing semiconductor devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2024·Application pending·0 cites
- 0973US10090230B2Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrateAMKOR TECHNOLOGY INC·Filed 2014·Granted Oct 2, 2018·2 cites·21 claims
- 1071US11961775B2Semiconductor devices and related methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Apr 16, 2024·0 cites·18 claims
- 1165US12388061B2Semiconductor device and method of manufacturing semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2022·Granted Aug 12, 2025·0 cites·20 claims
- 1265US11398455B2Semiconductor devices and related methodsAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2019·Granted Jul 26, 2022·1 cites·19 claims
- 1363US11749654B2Semiconductor device and method of manufacturing semiconductor deviceAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2021·Granted Sep 5, 2023·0 cites·23 claims
- 1459US11430723B2Semiconductor device with a semiconductor die embedded between an extended substrate and a bottom substrateAMKOR TECHNOLOGY INC·Filed 2018·Granted Aug 30, 2022·0 cites·21 claims
- 1556US2025087546A1Electronic devices and methods of manufacturing electronic devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Application pending·0 cites
- 1654US2025014975A1Electronic devices and methods of manufacturing electronic devicesAMKOR TECH SINGAPORE HOLDING PTE LTD·Filed 2023·Application pending·0 cites
- 1730US2010289104A1Photosensor packageOPTOPAC CO LTD·Filed 2010·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →