Inventor · disambiguated record
Giback Park
Also filed as: PARK GIBACK
29 granted patents·7 pending applications·53 citations·filing 2008–2025
95Inventor score
Top patents by PatentIndex Score
36 records- 0198US11676832B2Laser ablation system for package fabricationAPPLIED MATERIALS INC·Filed 2020·Granted Jun 13, 2023·7 cites·18 claims
- 0298US10886232B2Package structure and fabrication methodsAPPLIED MATERIALS INC·Filed 2020·Granted Jan 5, 2021·16 cites·19 claims
- 0396US11264331B2Package structure and fabrication methodsAPPLIED MATERIALS INC·Filed 2019·Granted Mar 1, 2022·10 cites·19 claims
- 0495US11715700B2Reconstituted substrate structure and fabrication methods for heterogeneous packaging integrationAPPLIED MATERIALS INC·Filed 2021·Granted Aug 1, 2023·2 cites·20 claims
- 0594US11257790B2High connectivity device stackingAPPLIED MATERIALS INC·Filed 2020·Granted Feb 22, 2022·3 cites·10 claims
- 0693US10937726B1Package structure with embedded coreAPPLIED MATERIALS INC·Filed 2020·Granted Mar 2, 2021·3 cites·20 claims
- 0789US11521937B2Package structures with built-in EMI shieldingAPPLIED MATERIALS INC·Filed 2020·Granted Dec 6, 2022·2 cites·20 claims
- 0885US12354968B2Reconstituted substrate structure and fabrication methods for heterogeneous packaging integrationAPPLIED MATERIALS INC·Filed 2023·Granted Jul 8, 2025·0 cites·20 claims
- 0985US10547040B2Energy storage device having an interlayer between electrode and electrolyte layerAPPLIED MATERIALS INC·Filed 2016·Granted Jan 28, 2020·2 cites·10 claims
- 1084US11063169B2Substrate structuring methodsAPPLIED MATERIALS INC·Filed 2019·Granted Jul 13, 2021·2 cites·20 claims
- 1183US11887934B2Package structure and fabrication methodsAPPLIED MATERIALS INC·Filed 2022·Granted Jan 30, 2024·0 cites·20 claims
- 1280US11388822B2Methods for improved polymer-copper adhesionAPPLIED MATERIALS INC·Filed 2020·Granted Jul 12, 2022·1 cites·20 claims
- 1378US12388049B2High connectivity device stackingAPPLIED MATERIALS INC·Filed 2023·Granted Aug 12, 2025·0 cites·16 claims
- 1478US11281094B2Method for via formation by micro-imprintingAPPLIED MATERIALS INC·Filed 2018·Granted Mar 22, 2022·2 cites·17 claims
- 1577US11837680B2Substrate structuring methodsAPPLIED MATERIALS INC·Filed 2022·Granted Dec 5, 2023·0 cites·20 claims
- 1676US11521935B2Package structure and fabrication methodsAPPLIED MATERIALS INC·Filed 2021·Granted Dec 6, 2022·0 cites·20 claims
- 1774US11476202B2Reconstituted substrate structure and fabrication methods for heterogeneous packaging integrationAPPLIED MATERIALS INC·Filed 2020·Granted Oct 18, 2022·0 cites·20 claims
- 1874US11398433B2Reconstituted substrate structure and fabrication methods for heterogeneous packaging integrationAPPLIED MATERIALS INC·Filed 2020·Granted Jul 26, 2022·0 cites·19 claims
- 1973US12374611B2Package core assembly and fabrication methodsAPPLIED MATERIALS INC·Filed 2021·Granted Jul 29, 2025·0 cites·24 claims
- 2073US11881447B2Package core assembly and fabrication methodsAPPLIED MATERIALS INC·Filed 2021·Granted Jan 23, 2024·0 cites·18 claims
- 2173US11362235B2Substrate structuring methodsAPPLIED MATERIALS INC·Filed 2021·Granted Jun 14, 2022·0 cites·20 claims
- 2273US11264333B2Reconstituted substrate structure and fabrication methods for heterogeneous packaging integrationAPPLIED MATERIALS INC·Filed 2020·Granted Mar 1, 2022·0 cites·20 claims
- 2372US11742330B2High connectivity device stackingAPPLIED MATERIALS INC·Filed 2022·Granted Aug 29, 2023·0 cites·8 claims
- 2471US12087679B2Package core assembly and fabrication methodsAPPLIED MATERIALS INC·Filed 2020·Granted Sep 10, 2024·0 cites·9 claims
- 2564US11862546B2Package core assembly and fabrication methodsAPPLIED MATERIALS INC·Filed 2019·Granted Jan 2, 2024·0 cites·19 claims
- 2664US2022171281A1Method for via formation by micro-imprintingAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 2760US9681501B2Multi layer for encapsulation comprising a planarizing organic thin layer and a conformal organic thin layerNAM SANGCHEOL·Filed 2008·Granted Jun 13, 2017·3 cites·13 claims
- 2859US2017301894A1Multilayer thin film device encapsulation using soft and pliable layer firstAPPLIED MATERIALS INC·Filed 2017·Application pending·0 cites
- 2954US2023070053A1Stiffener frame for semiconductor device packagesAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 3052US11705365B2Methods of micro-via formation for advanced packagingAPPLIED MATERIALS INC·Filed 2021·Granted Jul 18, 2023·0 cites·14 claims
- 3152US11400545B2Laser ablation for package fabricationAPPLIED MATERIALS INC·Filed 2020·Granted Aug 2, 2022·0 cites·20 claims
- 3252US2025279348A1Finishing on packaging substrate with ultra high-density interconnectsAPPLIED MATERIALS INC·Filed 2025·Application pending·0 cites
- 3347US11931855B2Planarization methods for packaging substratesAPPLIED MATERIALS INC·Filed 2020·Granted Mar 19, 2024·0 cites·20 claims
- 3441US2012270113A2Solid Electrolyte, Fabrication Method Thereof and Thin Film Battery Comprising the SameNAM SANGCHEOL·Filed 2008·Application pending·0 cites
- 3540US2017301891A1Multilayer thin film device encapsulation using soft and pliable layer firstAPPLIED MATERIALS INC·Filed 2017·Application pending·0 cites
- 3636US2018138522A1Laser ablation of wavelength transparent material with material modificationAPPLIED MATERIALS INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →