Inventor · disambiguated record
Griselda Bonilla
Also filed as: BONILLA GRISELDA
95 granted patents·12 pending applications·589 citations·filing 2005–2021
99Inventor score
Top patents by PatentIndex Score
107 records- 0199US9502350B1Interconnect scaling method including forming dielectric layer over subtractively etched first conductive layer and forming second conductive material on dielectric layerIBM·Filed 2016·Granted Nov 22, 2016·49 cites·14 claims
- 0298US9786760B1Air gap and air spacer pinch offIBM·Filed 2016·Granted Oct 10, 2017·22 cites·7 claims
- 0398US9601426B1Interconnect structure having subtractive etch feature and damascene featureIBM·Filed 2016·Granted Mar 21, 2017·26 cites·5 claims
- 0495US10256186B2Interconnect structure having subtractive etch feature and damascene featureIBM·Filed 2017·Granted Apr 9, 2019·9 cites·16 claims
- 0595US10177031B2Subtractive etch interconnectsIBM·Filed 2014·Granted Jan 8, 2019·22 cites·10 claims
- 0694US10490513B2Advanced crack stop structureIBM·Filed 2018·Granted Nov 26, 2019·8 cites·12 claims
- 0794US9793193B1Air gap and air spacer pinch offIBM·Filed 2016·Granted Oct 17, 2017·7 cites·7 claims
- 0894US9472477B1Electromigration test structure for Cu barrier integrity and blech effect evaluationsIBM·Filed 2015·Granted Oct 18, 2016·6 cites·9 claims
- 0994US9171801B2E-fuse with hybrid metallizationIBM·Filed 2014·Granted Oct 27, 2015·19 cites·16 claims
- 1094US8633707B2Stacked via structure for metal fuse applicationsFILIPPI RONALD G·Filed 2011·Granted Jan 21, 2014·15 cites·17 claims
- 1193US9852980B2Interconnect structure having substractive etch feature and damascene featureIBM·Filed 2017·Granted Dec 26, 2017·7 cites·20 claims
- 1293US9685404B2Back-end electrically programmable fuseBAO JUNJING·Filed 2012·Granted Jun 20, 2017·14 cites·11 claims
- 1393US9472450B2Graphene cap for copper interconnect structuresBONILLA GRISELDA·Filed 2012·Granted Oct 18, 2016·13 cites·5 claims
- 1493US8232646B2Interconnect structure for integrated circuits having enhanced electromigration resistanceBONILLA GRISELDA·Filed 2010·Granted Jul 31, 2012·17 cites·15 claims
- 1593US7514361B2Selective thin metal cap processIBM·Filed 2007·Granted Apr 7, 2009·28 cites·6 claims
- 1692US9536830B2High performance refractory metal / copper interconnects to eliminate electromigrationIBM·Filed 2013·Granted Jan 3, 2017·14 cites·12 claims
- 1792US7737052B2Advanced multilayer dielectric cap with improved mechanical and electrical propertiesIBM·Filed 2008·Granted Jun 15, 2010·21 cites·10 claims
- 1891US10475753B2Advanced crack stop structureIBM·Filed 2018·Granted Nov 12, 2019·5 cites·18 claims
- 1991US9431292B1Alternate dual damascene method for forming interconnectsGLOBALFOUNDRIES INC·Filed 2015·Granted Aug 30, 2016·8 cites·20 claims
- 2091US9059170B2Electronic fuse having a damaged regionIBM·Filed 2013·Granted Jun 16, 2015·12 cites·24 claims
- 2191US8895433B2Method of forming a graphene cap for copper interconnect structuresSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Nov 25, 2014·9 cites·17 claims
- 2290US10242933B2Air gap and air spacer pinch offIBM·Filed 2017·Granted Mar 26, 2019·4 cites·20 claims
- 2390US8779600B2Interlevel dielectric stack for interconnect structuresNGUYEN SON VAN·Filed 2012·Granted Jul 15, 2014·8 cites·14 claims
- 2490US8623761B2Method of forming a graphene cap for copper interconnect structuresBONILLA GRISELDA·Filed 2012·Granted Jan 7, 2014·9 cites·10 claims
- 2589US8470706B2Methods to mitigate plasma damage in organosilicate dielectricsARNOLD JOHN C·Filed 2012·Granted Jun 25, 2013·8 cites·15 claims
- 2689US7666753B2Metal capping process for BEOL interconnect with air gapsIBM·Filed 2007·Granted Feb 23, 2010·18 cites·1 claims
- 2789US7629264B2Structure and method for hybrid tungsten copper metal contactIBM·Filed 2008·Granted Dec 8, 2009·18 cites·19 claims
- 2888US9293412B2Graphene and metal interconnects with reduced contact resistanceIBM·Filed 2014·Granted Mar 22, 2016·9 cites·18 claims
- 2988US8916461B2Electronic fuse vias in interconnect structuresIBM·Filed 2012·Granted Dec 23, 2014·8 cites·9 claims
- 3088US8736020B2Electronic anti-fuseBAO JUNJING·Filed 2012·Granted May 27, 2014·10 cites·18 claims
- 3188US7749892B2Embedded nano UV blocking and diffusion barrier for improved reliability of copper/ultra low K interlevel dielectric electronic devicesIBM·Filed 2006·Granted Jul 6, 2010·16 cites·3 claims
- 3287US9455186B2Selective local metal cap layer formation for improved electromigration behaviorIBM·Filed 2015·Granted Sep 27, 2016·4 cites·1 claims
- 3387US9142506B2E-fuse structures and methods of manufactureIBM·Filed 2013·Granted Sep 22, 2015·7 cites·11 claims
- 3486US8003520B2Air gap structure having protective metal silicide pads on a metal featureIBM·Filed 2010·Granted Aug 23, 2011·6 cites·10 claims
- 3585US9202743B2Graphene and metal interconnectsIBM·Filed 2012·Granted Dec 1, 2015·7 cites·18 claims
- 3685US8962467B2Metal fuse structure for improved programming capabilityBONILLA GRISELDA·Filed 2012·Granted Feb 24, 2015·6 cites·9 claims
- 3785US7446058B2Adhesion enhancement for metal/dielectric interfaceIBM·Filed 2006·Granted Nov 4, 2008·10 cites·10 claims
- 3884US8481423B2Methods to mitigate plasma damage in organosilicate dielectricsARNOLD JOHN C·Filed 2007·Granted Jul 9, 2013·8 cites·20 claims
- 3984US7737528B2Structure and method of forming electrically blown metal fuses for integrated circuitsIBM·Filed 2008·Granted Jun 15, 2010·12 cites·20 claims
- 4080US9287185B1Determining appropriateness of sampling integrated circuit test data in the presence of manufacturing variationsIBM·Filed 2015·Granted Mar 15, 2016·3 cites·20 claims
- 4180US8742766B2Stacked via structure for metal fuse applicationsIBM·Filed 2013·Granted Jun 3, 2014·3 cites·3 claims
- 4280US7795740B2Adhesion enhancement for metal/dielectric interfaceIBM·Filed 2008·Granted Sep 14, 2010·6 cites·11 claims
- 4380US7491578B1Method of forming crack trapping and arrest in thin film structuresIBM·Filed 2008·Granted Feb 17, 2009·8 cites·1 claims
- 4479US9385038B2Selective local metal cap layer formation for improved electromigration behaviorIBM·Filed 2015·Granted Jul 5, 2016·2 cites·6 claims
- 4578US9536842B2Structure with air gap crack stopGLOBALFOUNDRIES INC·Filed 2014·Granted Jan 3, 2017·4 cites·18 claims
- 4678US9018089B2Multiple step anneal method and semiconductor formed by multiple step annealLINIGER ERIC G·Filed 2011·Granted Apr 28, 2015·6 cites·21 claims
- 4778US7439624B2Enhanced mechanical strength via contactsIBM·Filed 2006·Granted Oct 21, 2008·6 cites·3 claims
- 4877US9425144B2Metal fuse structure for improved programming capabilityGLOBALFOUNDRIES INC·Filed 2014·Granted Aug 23, 2016·3 cites·15 claims
- 4977US7671470B2Enhanced mechanical strength via contactsIBM·Filed 2008·Granted Mar 2, 2010·5 cites·18 claims
- 5076US9893011B2Back-end electrically programmable fuseIBM·Filed 2015·Granted Feb 13, 2018·2 cites·4 claims
Showing the top 50 of 107 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Griselda Bonilla files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →