Inventor · disambiguated record
Gregory Herdt
Also filed as: HERDT GREGORY · HERDT GREGORY C · HERDT GREGORY CHARLES
12 granted patents·3 pending applications·73 citations·filing 1994–2022
90Inventor score
Top patents by PatentIndex Score
15 records- 0189US6890790B2Co-sputter deposition of metal-doped chalcogenidesMICRON TECHNOLOGY INC·Filed 2002·Granted May 10, 2005·26 cites·6 claims
- 0287US7446393B2Co-sputter deposition of metal-doped chalcogenidesMICRON TECHNOLOGY INC·Filed 2007·Granted Nov 4, 2008·5 cites·5 claims
- 0384US7776743B2Method of forming semiconductor devices containing metal cap layersTEL EPION INC·Filed 2008·Granted Aug 17, 2010·9 cites·23 claims
- 0479US8575752B2Modulated deposition process for stress control in thick TiN filmsTEXAS INSTRUMENTS INC·Filed 2012·Granted Nov 5, 2013·3 cites·5 claims
- 0579US7871929B2Method of forming semiconductor devices containing metal cap layersTEL EPION INC·Filed 2009·Granted Jan 18, 2011·6 cites·24 claims
- 0668US7964436B2Co-sputter deposition of metal-doped chalcogenidesROUND ROCK RES LLC·Filed 2008·Granted Jun 21, 2011·0 cites·10 claims
- 0766US8328585B2Modulated deposition process for stress control in thick TiN filmsHERDT GREGORY CHARLES·Filed 2009·Granted Dec 11, 2012·2 cites·12 claims
- 0865US7202104B2Co-sputter deposition of metal-doped chalcogenidesMICRON TECHNOLOGY INC·Filed 2004·Granted Apr 10, 2007·4 cites·22 claims
- 0963US8226835B2Ultra-thin film formation using gas cluster ion beam processingHAUTALA JOHN J·Filed 2009·Granted Jul 24, 2012·7 cites·23 claims
- 1061US10403575B2Interconnect structure with nitrided barrierMICRON TECHNOLOGY INC·Filed 2017·Granted Sep 3, 2019·1 cites·23 claims
- 1153US2023276639A1Metal silicide layer for memory arrayINTEL CORP·Filed 2022·Application pending·0 cites
- 1251US8592307B2Modulated deposition process for stress control in thick TiN filmsHERDT GREGORY CHARLES·Filed 2012·Granted Nov 26, 2013·0 cites·10 claims
- 1351US2023209834A1Reliable electrode for memory cellsINTEL CORP·Filed 2021·Application pending·0 cites
- 1450US2023157035A1Multi-layer interconnectINTEL CORP·Filed 2021·Application pending·0 cites
- 1546US5591690ASelf assembled molecular monolayers on high surface area materials as molecular gettersMIDWEST RESEARCH INST·Filed 1994·Granted Jan 7, 1997·10 cites·8 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →