Inventor · disambiguated record
Graham W. Hills
Also filed as: HILLS GRAHAM · HILLS GRAHAM W · HILLS GRAHAM WILLIAM
14 granted patents·1 pending application·1,238 citations·filing 1988–2016
95Inventor score
Files withAPPLIED MATERIALS INC8AT & T BELL LAB3AMERICAN TELEPHONE AND TELEGRP1HILLS GRAHAM1LAM RES CORP1
Top patents by PatentIndex Score
15 records- 0198US5685914AFocus ring for semiconductor wafer processing in a plasma reactorAPPLIED MATERIALS INC·Filed 1994·Granted Nov 11, 1997·516 cites·19 claims
- 0286US5176790AProcess for forming a via in an integrated circuit structure by etching through an insulation layer while inhibiting sputtering of underlying metalAPPLIED MATERIALS INC·Filed 1991·Granted Jan 5, 1993·108 cites·49 claims
- 0384US6125788APlasma reactor with enhanced plasma uniformity by gas addition, reduced chamber diameter and reduced RF wafer pedestal diameterAPPLIED MATERIALS INC·Filed 1997·Granted Oct 3, 2000·64 cites·9 claims
- 0484US4832789ASemiconductor devices having multi-level metal interconnectsAMERICAN TELEPHONE AND TELEGRP·Filed 1988·Granted May 23, 1989·93 cites·6 claims
- 0581US5744049APlasma reactor with enhanced plasma uniformity by gas addition, and method of using sameAPPLIED MATERIALS INC·Filed 1994·Granted Apr 28, 1998·68 cites·25 claims
- 0681US5026666AMethod of making integrated circuits having a planarized dielectricAT & T BELL LAB·Filed 1989·Granted Jun 25, 1991·63 cites·12 claims
- 0780US5410122AUse of electrostatic forces to reduce particle contamination in semiconductor plasma processing chambersAPPLIED MATERIALS INC·Filed 1993·Granted Apr 25, 1995·36 cites·13 claims
- 0880US5382316AProcess for simultaneous removal of photoresist and polysilicon/polycide etch residues from an integrated circuit structureAPPLIED MATERIALS INC·Filed 1993·Granted Jan 17, 1995·89 cites·19 claims
- 0975US5242538AReactive ion etch process including hydrogen radicalsAPPLIED MATERIALS INC·Filed 1992·Granted Sep 7, 1993·63 cites·29 claims
- 1071US5534108AMethod and apparatus for altering magnetic coil current to produce etch uniformity in a magnetic field-enhanced plasma reactorAPPLIED MATERIALS INC·Filed 1995·Granted Jul 9, 1996·52 cites·28 claims
- 1168US6217786B1Mechanism for bow reduction and critical dimension control in etching silicon dioxide using hydrogen-containing additive gases in fluorocarbon gas chemistryLAM RES CORP·Filed 1998·Granted Apr 17, 2001·36 cites·32 claims
- 1262US5913148AReduced size etching method for integrated circuitsLUCENT TECHNOLOGIES INC·Filed 1995·Granted Jun 15, 1999·27 cites·10 claims
- 1343US5057186AMethod of taper-etching with photoresist adhesion layerAT & T BELL LAB·Filed 1990·Granted Oct 15, 1991·16 cites·12 claims
- 1443US2017297539A1Undercarriage Washing AssemblyHILLS GRAHAM·Filed 2016·Application pending·0 cites
- 1532US4980301AMethod for reducing mobile ion contamination in semiconductor integrated circuitsAT & T BELL LAB·Filed 1990·Granted Dec 25, 1990·7 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →