Inventor · disambiguated record
Guenter Denifl
Also filed as: DENIFL GUENTER
13 granted patents·5 pending applications·41 citations·filing 2012–2021
89Inventor score
Files withINFINEON TECHNOLOGIES AG13INFINEON TECHNOLOGIES AUSTRIA AG2DENIFL GUENTER1INFINEON TECHNOLOGIES AUSTRIA1STRANZL GUDRUN1
Top patents by PatentIndex Score
18 records- 0193US10710874B2Micromechanical structure and method for manufacturing the sameINFINEON TECHNOLOGIES AG·Filed 2017·Granted Jul 14, 2020·9 cites·21 claims
- 0292US10903078B2Methods for processing a silicon carbide wafer, and a silicon carbide semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2019·Granted Jan 26, 2021·9 cites·28 claims
- 0389US11211459B2Semiconductor device and method of manufacturing a semiconductor deviceINFINEON TECHNOLOGIES AG·Filed 2019·Granted Dec 28, 2021·5 cites·14 claims
- 0485US9212045B1Micro mechanical structure and method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2014·Granted Dec 15, 2015·6 cites·26 claims
- 0582US11107732B2Methods for processing a wide band gap semiconductor wafer, methods for forming a plurality of thin wide band gap semiconductor wafers, and wide band gap semiconductor wafersINFINEON TECHNOLOGIES AG·Filed 2019·Granted Aug 31, 2021·2 cites·19 claims
- 0675US9257342B2Methods of singulating substrates to form semiconductor devices using dummy materialINFINEON TECHNOLOGIES AG·Filed 2014·Granted Feb 9, 2016·2 cites·22 claims
- 0772US8748297B2Methods of forming semiconductor devices by singulating a substrate by removing a dummy fill materialSTRANZL GUDRUN·Filed 2012·Granted Jun 10, 2014·3 cites·28 claims
- 0868US9511560B2Processing a sacrificial material during manufacture of a microfabricated productDENIFL GUENTER·Filed 2012·Granted Dec 6, 2016·3 cites·16 claims
- 0967US9515162B2Surface treatment of semiconductor substrate using free radical state fluorine particlesINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2015·Granted Dec 6, 2016·2 cites·14 claims
- 1065US11990520B2Method of manufacturing a semiconductor device having frame structures laterally surrounding backside metal structuresINFINEON TECHNOLOGIES AG·Filed 2021·Granted May 21, 2024·0 cites·21 claims
- 1162US2017197865A1Mold, method for producing a mold, and method for forming a mold articleINFINEON TECHNOLOGIES AUSTRIA AG·Filed 2017·Application pending·0 cites
- 1259US2015175467A1Mold, method for producing a mold, and method for forming a mold articleINFINEON TECHNOLOGIES AUSTRIA·Filed 2013·Application pending·0 cites
- 1355US9741618B2Methods of forming semiconductor devicesINFINEON TECHNOLOGIES AG·Filed 2015·Granted Aug 22, 2017·0 cites·23 claims
- 1447US9530678B2Substrate carrier system for moving substrates in a vertical oven and method for processing substratesINFINEON TECHNOLOGIES AG·Filed 2014·Granted Dec 27, 2016·0 cites·15 claims
- 1540US10106398B2Micromechanical structure comprising carbon material and method for fabricating the sameINFINEON TECHNOLOGIES AG·Filed 2015·Granted Oct 23, 2018·0 cites·33 claims
- 1639US2017067158A1Substrate Carrier System for Moving Substrates in a Vertical Oven and Method for Processing SubstratesINFINEON TECHNOLOGIES AG·Filed 2016·Application pending·0 cites
- 1739US2014335700A1Carbon Layers for High Temperature ProcessesINFINEON TECHNOLOGIES AG·Filed 2013·Application pending·0 cites
- 1832US2017032964A1Method for Protecting a Surface of a Substrate and Semiconductor DeviceINFINEON TECHNOLOGIES AG·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →