Inventor · disambiguated record
Gyung Sik Yun
Also filed as: YUN GYUNG S · YUN GYUNG SIK
2 granted patents·2 pending applications·2 citations·filing 2006–2011
35Inventor score
Technology areasH10W
Top patents by PatentIndex Score
4 records- 0146US8609525B2Integrated circuit packaging system with interconnects and method of manufacture thereofHAN BONGHWAN·Filed 2011·Granted Dec 17, 2013·2 cites·10 claims
- 0243US2008272487A1System for implementing hard-metal wire bondsSHIM IL KWON·Filed 2008·Application pending·0 cites
- 0337US8304898B2Integrated circuit package system with overhang filmLEE HYE RAN·Filed 2008·Granted Nov 6, 2012·0 cites·20 claims
- 0434US2006251538A1Au alloy bonding wireMK ELECTRON CO LTD·Filed 2006·Application pending·0 cites
Join the waitlist — get patent alerts
Get an alert when Gyung Sik Yun files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →