Inventor · disambiguated record
Hai Cong
Also filed as: CONG HAI · CONG HAI-WEI
28 granted patents·3 pending applications·97 citations·filing 2004–2023
95Inventor score
Files withGLOBALFOUNDRIES SG PTE LTD16CHARTERED SEMICONDUCTOR MFG4ADVANCED MICRO FABRICATION EQUIPMENT INC CHINA2CONG HAI2LIU JINPING2
Top patents by PatentIndex Score
31 records- 0194US9972775B2Integrated magnetic random access memory with logic device having low-k interconnectsGLOBALFOUNDRIES SG PTE LTD·Filed 2016·Granted May 15, 2018·13 cites·20 claims
- 0287US10608046B2Integrated two-terminal device with logic device for embedded applicationGLOBALFOUNDRIES SG PTE LTD·Filed 2019·Granted Mar 31, 2020·4 cites·16 claims
- 0386US10461247B2Integrated magnetic random access memory with logic device having low-K interconnectsGLOBALFOUNDRIES SG PTE LTD·Filed 2018·Granted Oct 29, 2019·4 cites·18 claims
- 0486US8518775B2Integration of eNVM, RMG, and HKMG modulesLIU HUANG·Filed 2011·Granted Aug 27, 2013·12 cites·18 claims
- 0586US7879732B2Thin film etching method and semiconductor device fabrication using sameCHARTERED SEMICONDUCTOR MFG·Filed 2007·Granted Feb 1, 2011·8 cites·24 claims
- 0684US10446607B2Integrated two-terminal device with logic device for embedded applicationGLOBALFOUNDRIES SG PTE LTD·Filed 2016·Granted Oct 15, 2019·4 cites·14 claims
- 0781US7745320B2Method for reducing silicide defects in integrated circuitsCHARTERED SEMICONDUCTOR MFG·Filed 2008·Granted Jun 29, 2010·7 cites·21 claims
- 0880US8058123B2Integrated circuit and method of fabrication thereofLIU JINPING·Filed 2007·Granted Nov 15, 2011·8 cites·24 claims
- 0980US7892900B2Integrated circuit system employing sacrificial spacersGLOBALFOUNDRIES SG PTE LTD·Filed 2008·Granted Feb 22, 2011·9 cites·20 claims
- 1077US8987134B2Reliable interconnect for semiconductor deviceGLOBALFOUNDRIES SG PTE LTD·Filed 2013·Granted Mar 24, 2015·4 cites·11 claims
- 1169US8940637B2Method for forming through silicon via with wafer backside protectionLEONG LUP SAN·Filed 2012·Granted Jan 27, 2015·3 cites·11 claims
- 1266US8737061B2Heat dissipating apparatusCHANG CHIEN-LUNG·Filed 2011·Granted May 27, 2014·3 cites·10 claims
- 1366US7247555B2Method to control dual damascene trench etch profile and trench depth uniformityCHARTERED SEMICONDUCTOR MFG·Filed 2004·Granted Jul 24, 2007·13 cites·30 claims
- 1463US9564575B2Dual encapsulation integration scheme for fabricating integrated circuits with magnetic random access memory structuresGLOBALFOUNDRIES SG PTE LTD·Filed 2014·Granted Feb 7, 2017·1 cites·14 claims
- 1563US2025129511A1Semiconductor processing chamber, semiconductor processing equipment and vapor epitaxy equipmentADVANCED MICRO FABRICATION EQUIPMENT INC CHINA·Filed 2023·Application pending·0 cites
- 1662US8293545B2Critical dimension for trench and viasCONG HAI·Filed 2007·Granted Oct 23, 2012·3 cites·22 claims
- 1762US2025027203A1Chemical vapor deposition equipment and method thereforADVANCED MICRO FABRICATION EQUIPMENT INC CHINA·Filed 2022·Application pending·0 cites
- 1861US8546873B2Integrated circuit and method of fabrication thereofLIU JINPING·Filed 2011·Granted Oct 1, 2013·1 cites·20 claims
- 1956US9230886B2Method for forming through silicon via with wafer backside protectionGLOBALFOUNDRIES SG PTE LTD·Filed 2014·Granted Jan 5, 2016·0 cites·17 claims
- 2054US10103097B2CD controlGLOBALFOUNDRIES SG PTE LTD·Filed 2014·Granted Oct 16, 2018·0 cites·20 claims
- 2151US8836139B2CD controlGLOBALFOUNDRIES SG PTE LTD·Filed 2012·Granted Sep 16, 2014·0 cites·17 claims
- 2248US7960283B2Method for reducing silicide defects in integrated circuitsCHARTERED SEMICONDUCTOR MFG·Filed 2010·Granted Jun 14, 2011·0 cites·20 claims
- 2346US9437550B2TSV without zero alignment marksGLOBALFOUNDRIES SG PTE LTD·Filed 2013·Granted Sep 6, 2016·0 cites·20 claims
- 2441US10510825B2Metal-insulator-metal capacitor with improved time-dependent dielectric breakdownGLOBALFOUNDRIES SG PTE LTD·Filed 2017·Granted Dec 17, 2019·0 cites·18 claims
- 2540US9520299B2Etch bias controlGLOBALFOUNDRIES SG PTE LTD·Filed 2015·Granted Dec 13, 2016·0 cites·26 claims
- 2640US8492236B1Step-like spacer profileRAO XUESONG·Filed 2012·Granted Jul 23, 2013·0 cites·20 claims
- 2738US10115625B2Methods for removal of hard maskGLOBALFOUNDRIES SG PTE LTD·Filed 2016·Granted Oct 30, 2018·0 cites·25 claims
- 2836US8828858B2Spacer profile engineering using films with continuously increased etch rate from inner to outer surfaceRAO XUESONG·Filed 2012·Granted Sep 9, 2014·0 cites·11 claims
- 2936US2015349095A1Methods for fabricating integrated circuits with nonvolatile memory devicesGLOBALFOUNDRIES SG PTE LTD·Filed 2014·Application pending·0 cites
- 3035US8394724B2Processing with reduced line end shortening ratioCONG HAI·Filed 2007·Granted Mar 12, 2013·0 cites·17 claims
- 3134US9805971B2Method of forming a via contactGLOBALFOUNDRIES SG PTE LTD·Filed 2015·Granted Oct 31, 2017·0 cites·20 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →