Inventor · disambiguated record
Haiying Fu
Also filed as: FU HAIYING
35 granted patents·3 pending applications·1,398 citations·filing 2002–2025
98Inventor score
Top patents by PatentIndex Score
38 records- 0198US9834852B2Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplatingNOVELLUS SYSTEMS INC·Filed 2016·Granted Dec 5, 2017·13 cites·20 claims
- 0298US7208389B1Method of porogen removal from porous low-k films using UV radiationNOVELLUS SYSTEMS INC·Filed 2003·Granted Apr 24, 2007·602 cites·38 claims
- 0397US9523155B2Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplatingNOVELLUS SYSTEMS INC·Filed 2013·Granted Dec 20, 2016·15 cites·22 claims
- 0496US9746427B2Detection of plating on wafer holding apparatusNOVELLUS SYSTEMS INC·Filed 2014·Granted Aug 29, 2017·9 cites·21 claims
- 0596US7906817B1High compressive stress carbon liners for MOS devicesNOVELLUS SYSTEMS INC·Filed 2008·Granted Mar 15, 2011·40 cites·8 claims
- 0696US7611757B1Method to improve mechanical strength of low-K dielectric film using modulated UV exposureNOVELLUS SYSTEMS INC·Filed 2007·Granted Nov 3, 2009·39 cites·20 claims
- 0795US10662545B2Enhancement of electrolyte hydrodynamics for efficient mass transfer during electroplatingNOVELLUS SYSTEMS INC·Filed 2017·Granted May 26, 2020·4 cites·22 claims
- 0895US7253125B1Method to improve mechanical strength of low-k dielectric film using modulated UV exposureNOVELLUS SYSTEMS INC·Filed 2004·Granted Aug 7, 2007·82 cites·32 claims
- 0994US7923385B2Methods for producing low stress porous and CDO low-K dielectric materials using precursors with organic functional groupsNOVELLUS SYSTEMS INC·Filed 2009·Granted Apr 12, 2011·17 cites·24 claims
- 1094US7573061B1Low-k SiC copper diffusion barrier filmsNOVELLUS SYSTEMS INC·Filed 2007·Granted Aug 11, 2009·24 cites·14 claims
- 1194US7381662B1Methods for improving the cracking resistance of low-k dielectric materialsNOVELLUS SYSTEMS INC·Filed 2006·Granted Jun 3, 2008·32 cites·20 claims
- 1293US8043667B1Method to improve mechanical strength of low-K dielectric film using modulated UV exposureNOVELLUS SYSTEMS INC·Filed 2009·Granted Oct 25, 2011·18 cites·17 claims
- 1393US7094713B1Methods for improving the cracking resistance of low-k dielectric materialsNOVELLUS SYSTEMS INC·Filed 2004·Granted Aug 22, 2006·74 cites·12 claims
- 1492US7968436B1Low-K SiC copper diffusion barrier filmsNOVELLUS SYSTEMS INC·Filed 2009·Granted Jun 28, 2011·15 cites·24 claims
- 1592US7390537B1Methods for producing low-k CDO films with low residual stressNOVELLUS SYSTEMS INC·Filed 2004·Granted Jun 24, 2008·51 cites·25 claims
- 1692US7282438B1Low-k SiC copper diffusion barrier filmsNOVELLUS SYSTEMS INC·Filed 2004·Granted Oct 16, 2007·53 cites·8 claims
- 1792US7241704B1Methods for producing low stress porous low-k dielectric materials using precursors with organic functional groupsNOVELLUS SYSTEMS INC·Filed 2004·Granted Jul 10, 2007·58 cites·30 claims
- 1891US7473653B1Methods for producing low stress porous low-k dielectric materials using precursors with organic functional groupsNOVELLUS SYSTEMS INC·Filed 2007·Granted Jan 6, 2009·12 cites·18 claims
- 1991US6855645B2Silicon carbide having low dielectric constantNOVELLUS SYSTEMS INC·Filed 2002·Granted Feb 15, 2005·61 cites·13 claims
- 2090US7737525B1Method for producing low-K CDO filmsNOVELLUS SYSTEMS INC·Filed 2007·Granted Jun 15, 2010·9 cites·20 claims
- 2189USD964573SWaist trainer beltFU HAIYING·Filed 2022·Granted Sep 20, 2022·12 cites·1 claims
- 2288USD967444SHip beltFU HAIYING·Filed 2021·Granted Oct 18, 2022·11 cites·1 claims
- 2387US8715788B1Method to improve mechanical strength of low-K dielectric film using modulated UV exposureBANDYOPADHYAY ANANDA K·Filed 2011·Granted May 6, 2014·9 cites·18 claims
- 2485US10508359B2TSV bath evaluation using field versus feature contrastLAM RES CORP·Filed 2017·Granted Dec 17, 2019·1 cites·20 claims
- 2584US8362571B1High compressive stress carbon liners for MOS devicesNOVELLUS SYSTEMS INC·Filed 2011·Granted Jan 29, 2013·5 cites·17 claims
- 2683US7799705B1Methods for producing low stress porous low-k dielectric materials using precursors with organic functional groupsNOVELLUS SYSTEMS INC·Filed 2009·Granted Sep 21, 2010·5 cites·20 claims
- 2782US6764952B1Systems and methods to retard copper diffusion and improve film adhesion for a dielectric barrier on copperNOVELLUS SYSTEMS INC·Filed 2002·Granted Jul 20, 2004·28 cites·25 claims
- 2881US6777349B2Hermetic silicon carbideNOVELLUS SYSTEMS INC·Filed 2002·Granted Aug 17, 2004·28 cites·52 claims
- 2980US7341761B1Methods for producing low-k CDO filmsNOVELLUS SYSTEMS INC·Filed 2004·Granted Mar 11, 2008·17 cites·14 claims
- 3080US7326444B1Methods for improving integration performance of low stress CDO filmsNOVELLUS SYSTEMS INC·Filed 2004·Granted Feb 5, 2008·30 cites·29 claims
- 3178US9816196B2Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyteNOVELLUS SYSTEMS INC·Filed 2013·Granted Nov 14, 2017·1 cites·19 claims
- 3277USD977118SAbdominal binderFU HAIYING·Filed 2021·Granted Jan 31, 2023·6 cites·1 claims
- 3375US9689083B2TSV bath evaluation using field versus feature contrastLAM RES CORP·Filed 2014·Granted Jun 27, 2017·3 cites·24 claims
- 3471US7781351B1Methods for producing low-k carbon doped oxide films with low residual stressNOVELLUS SYSTEMS INC·Filed 2004·Granted Aug 24, 2010·14 cites·30 claims
- 3563US2018030611A1Method and apparatus for electroplating semiconductor wafer when controlling cations in electrolyteNOVELLUS SYSTEMS INC·Filed 2017·Application pending·0 cites
- 3648USD1090864SStomach bandage wrapFU HAIYING·Filed 2025·Granted Aug 26, 2025·0 cites·1 claims
- 3748US2014001050A1Electroplating apparatuses and methods employing liquid particle counter modulesNOVELLUS SYSTEMS INC·Filed 2013·Application pending·0 cites
- 3837US2015157610A1Pharmaceutical composition for treating inflammatory diseaseUNIV OSAKA·Filed 2013·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →