Inventor · disambiguated record
Hadi Jebory
Also filed as: JEBORY HADI
5 granted patents·2 pending applications·11 citations·filing 2012–2018
71Inventor score
Technology areasH10W
Files withNEWPORT FAB LLC3NEWPORT FAB LLC DBA JAZZ SEMICONDUCTOR INC2JEBORY HADI1NEWPORT FAB LLC DBA JAZZ SEMICONDUCTOR1
Top patents by PatentIndex Score
7 records- 0180US9577035B2Isolated through silicon vias in RF technologiesNEWPORT FAB LLC DBA JAZZ SEMICONDUCTOR·Filed 2013·Granted Feb 21, 2017·7 cites·20 claims
- 0260US9673081B2Isolated through silicon via and isolated deep silicon via having total or partial isolationNEWPORT FAB LLC·Filed 2013·Granted Jun 6, 2017·1 cites·9 claims
- 0359US9147609B2Through silicon via structure, method of formation, and integration in semiconductor substrateJEBORY HADI·Filed 2012·Granted Sep 29, 2015·2 cites·18 claims
- 0457US9245826B2Anchor vias for improved backside metal adhesion to semiconductor substrateNEWPORT FAB LLC·Filed 2014·Granted Jan 26, 2016·1 cites·20 claims
- 0548US9984888B2Method of fabricating a semiconductor wafer including a through substrate via (TSV) and a stepped support ring on a back side of the waferNEWPORT FAB LLC·Filed 2015·Granted May 29, 2018·0 cites·11 claims
- 0641US2018247822A1Method Of Fabricating A Semiconductor Wafer Including A Through Substrate Via (TSV) And A Stepped Support Ring On A Back Side Of The WaferNEWPORT FAB LLC DBA JAZZ SEMICONDUCTOR INC·Filed 2018·Application pending·0 cites
- 0727US2016379926A1Semiconductor Wafer Backside Metallization With Improved Backside Metal AdhesionNEWPORT FAB LLC DBA JAZZ SEMICONDUCTOR INC·Filed 2016·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →