Inventor · disambiguated record
Han Kim
Also filed as: KIM HAN · KIM HAN-KYEOL
39 granted patents·18 pending applications·124 citations·filing 2006–2022
96Inventor score
Top patents by PatentIndex Score
57 records- 0196US10170386B2Electronic component package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Jan 1, 2019·40 cites·12 claims
- 0294US9984979B2Fan-out semiconductor package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted May 29, 2018·10 cites·34 claims
- 0392US10304784B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2018·Granted May 28, 2019·9 cites·20 claims
- 0492US10199337B2Electronic component package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Feb 5, 2019·9 cites·2 claims
- 0590US10083929B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Sep 25, 2018·7 cites·17 claims
- 0690US9842789B2Electronic component package and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Dec 12, 2017·7 cites·12 claims
- 0788US10157851B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Dec 18, 2018·5 cites·18 claims
- 0886US9935068B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Apr 3, 2018·6 cites·16 claims
- 0985US10157886B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Dec 18, 2018·4 cites·15 claims
- 1084US10242973B2Fan-out-semiconductor package moduleSAMSUNG ELECTRO MECH·Filed 2018·Granted Mar 26, 2019·4 cites·30 claims
- 1183US10490349B2Coil component and method for manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Nov 26, 2019·2 cites·12 claims
- 1280US10192831B1Fan-out semiconductor package moduleSAMSUNG ELECTRO MECH·Filed 2018·Granted Jan 29, 2019·3 cites·16 claims
- 1378US10026703B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Jul 17, 2018·2 cites·21 claims
- 1477US10849471B2Robot cleaner and method for driving the sameSAMSUNG ELECTRONICS CO LTD·Filed 2017·Granted Dec 1, 2020·3 cites·13 claims
- 1577US10304807B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2018·Granted May 28, 2019·2 cites·20 claims
- 1676US10943878B2Semiconductor packageSAMSUNG ELECTRO MECH·Filed 2019·Granted Mar 9, 2021·2 cites·20 claims
- 1773US10217631B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Feb 26, 2019·2 cites·22 claims
- 1873US10096552B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2017·Granted Oct 9, 2018·2 cites·20 claims
- 1968US12300416B2Coil componentSAMSUNG ELECTRO MECH·Filed 2021·Granted May 13, 2025·0 cites·20 claims
- 2068US12014860B2Coil componentSAMSUNG ELECTRO MECH·Filed 2021·Granted Jun 18, 2024·0 cites·15 claims
- 2168US11417631B2Semiconductor packageSAMSUNG ELECTRO MECH·Filed 2019·Granted Aug 16, 2022·1 cites·21 claims
- 2267US12476043B2Coil componentSAMSUNG ELECTRO MECH·Filed 2021·Granted Nov 18, 2025·0 cites·17 claims
- 2367US11043440B2Semiconductor packageSAMSUNG ELECTRO MECH·Filed 2019·Granted Jun 22, 2021·1 cites·14 claims
- 2467US10692818B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2018·Granted Jun 23, 2020·1 cites·21 claims
- 2566US10032697B2Electronic component package and electronic device including the sameSAMSUNG ELECTRO MECH·Filed 2016·Granted Jul 24, 2018·1 cites·15 claims
- 2664US10580559B2Coil componentSAMSUNG ELECTRO MECH·Filed 2017·Granted Mar 3, 2020·1 cites·20 claims
- 2763US12224102B2Coil componentSAMSUNG ELECTRO MECH·Filed 2021·Granted Feb 11, 2025·0 cites·19 claims
- 2863US11901125B2Capacitor component including unit device having polygonal-shaped cross-sectionSAMSUNG ELECTRO MECH·Filed 2022·Granted Feb 13, 2024·0 cites·20 claims
- 2960US12080468B2Coil componentSAMSUNG ELECTRO MECH·Filed 2021·Granted Sep 3, 2024·0 cites·17 claims
- 3058US11081283B2Multi-layered ceramic electronic component and mounting board thereofSAMSUNG ELECTRO MECH·Filed 2019·Granted Aug 3, 2021·0 cites·19 claims
- 3157US12033790B2Coil componentSAMSUNG ELECTRO MECH·Filed 2021·Granted Jul 9, 2024·0 cites·12 claims
- 3256US12322536B2Coil componentSAMSUNG ELECTRO MECH·Filed 2021·Granted Jun 3, 2025·0 cites·17 claims
- 3354US2009288872A1Printed circuit board including outmost fine circuit pattern and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 3454US2009085691A1Printed circuit board with embedded chip capacitor and chip capacitor embedment methodSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 3554US2009294164A1Printed circuit board including landless via and method of manufacturing the sameSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 3653US11978595B2Capacitor component including through-hole structure to increase capacitanceSAMSUNG ELECTRO MECH·Filed 2022·Granted May 7, 2024·0 cites·18 claims
- 3753US2012066902A1Method of manufacturing printed circuit board including landless viaKIM HAN·Filed 2011·Application pending·0 cites
- 3852US10796836B2InductorSAMSUNG ELECTRO MECH·Filed 2018·Granted Oct 6, 2020·0 cites·10 claims
- 3952US2012011716A1Method of manufacturing printed circuit board including outmost fine circuit patternKIM HAN·Filed 2011·Application pending·0 cites
- 4052US2011069470A1Electromagnetic interference noise reduction board using electromagnetic bandgap structureSAMSUNG ELECTRO MECH·Filed 2009·Application pending·0 cites
- 4152US2011315440A1Electromagnetic bandgap structure and printed circuit boardKIM HAN·Filed 2011·Application pending·0 cites
- 4251US10726999B2Composite electronic component and board having the sameSAMSUNG ELECTRO MECH·Filed 2017·Granted Jul 28, 2020·0 cites·19 claims
- 4351US10553541B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2018·Granted Feb 4, 2020·0 cites·19 claims
- 4451US2018233432A1Electronic component package and electronic device including the sameSAMSUNG ELECTRO MECH·Filed 2018·Application pending·0 cites
- 4550US10475751B2Fan-out semiconductor packageSAMSUNG ELECTRO MECH·Filed 2018·Granted Nov 12, 2019·0 cites·13 claims
- 4649US2009084582A1Printed circuit board having stepped conduction layerSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 4748US2009084591A1Cavity capacitor fabrication method and printed circuit board having embedded cavity capacitorSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 4847US2014003012A1Capacitor-embedded printed circuit boardSAMSUNG ELECTRO MECH·Filed 2013·Application pending·0 cites
- 4947US2009071603A1Method of manufacturing printed circuit board and electromagnetic bandgap structureSAMSUNG ELECTRO MECH·Filed 2008·Application pending·0 cites
- 5046US2007111380A1Fabricating method of printed circuit board having embedded componentSAMSUNG ELECTRO MECH·Filed 2006·Application pending·0 cites
Showing the top 50 of 57 patent records by PatentIndex Score.
Join the waitlist — get patent alerts
Get an alert when Han Kim files or is granted a new patent.
We store only your email — no account needed. See our privacy policy.
Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →