Inventor · disambiguated record
Harry Q. Lee
Also filed as: LEE HARRY · LEE HARRY Q
87 granted patents·24 pending applications·2,876 citations·filing 1992–2025
99Inventor score
Top patents by PatentIndex Score
111 records- 0199US5738574AContinuous processing system for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 1995·Granted Apr 14, 1998·797 cites·41 claims
- 0298US5804507ARadially oscillating carousel processing system for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 1995·Granted Sep 8, 1998·243 cites·84 claims
- 0397US7614939B2Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motionAPPLIED MATERIALS INC·Filed 2007·Granted Nov 10, 2009·39 cites·6 claims
- 0497US7409260B2Substrate thickness measuring during polishingAPPLIED MATERIALS INC·Filed 2007·Granted Aug 5, 2008·60 cites·19 claims
- 0597US6024630AFluid-pressure regulated wafer polishing headAPPLIED MATERIALS INC·Filed 1995·Granted Feb 15, 2000·249 cites·9 claims
- 0697US5795215AMethod and apparatus for using a retaining ring to control the edge effectAPPLIED MATERIALS INC·Filed 1996·Granted Aug 18, 1998·243 cites·5 claims
- 0797US5681215ACarrier head design for a chemical mechanical polishing apparatusAPPLIED MATERIALS INC·Filed 1995·Granted Oct 28, 1997·222 cites·8 claims
- 0896US8260446B2Spectrographic monitoring of a substrate during processing using index valuesDAVID JEFFREY DRUE·Filed 2010·Granted Sep 4, 2012·14 cites·7 claims
- 0995US5599423AApparatus and method for simulating and optimizing a chemical mechanical polishing systemAPPLIED MATERIALS INC·Filed 1995·Granted Feb 4, 1997·153 cites·29 claims
- 1094US9490186B2Limiting adjustment of polishing rates during substrate polishingAPPLIED MATERIALS INC·Filed 2013·Granted Nov 8, 2016·15 cites·18 claims
- 1194US8039397B2Using optical metrology for within wafer feed forward process controlAPPLIED MATERIALS INC·Filed 2009·Granted Oct 18, 2011·20 cites·24 claims
- 1294US7774086B2Substrate thickness measuring during polishingAPPLIED MATERIALS INC·Filed 2008·Granted Aug 10, 2010·22 cites·19 claims
- 1393US11524382B2Polishing apparatus using machine learning and compensation for pad thicknessAPPLIED MATERIALS INC·Filed 2019·Granted Dec 13, 2022·8 cites·21 claims
- 1493US8292693B2Using optical metrology for wafer to wafer feed back process controlDAVID JEFFREY DRUE·Filed 2009·Granted Oct 23, 2012·16 cites·24 claims
- 1593US8190285B2Feedback for polishing rate correction in chemical mechanical polishingQIAN JUN·Filed 2010·Granted May 29, 2012·10 cites·20 claims
- 1693US5497007AMethod for automatically establishing a wafer coordinate systemAPPLIED MATERIALS INC·Filed 1995·Granted Mar 5, 1996·92 cites·20 claims
- 1792US8977379B2Endpoint method using peak location of spectra contour plots versus timeDAVID JEFFREY DRUE·Filed 2010·Granted Mar 10, 2015·8 cites·18 claims
- 1892US8834229B2Dynamically tracking spectrum features for endpoint detectionDAVID JEFFREY DRUE·Filed 2011·Granted Sep 16, 2014·9 cites·18 claims
- 1992US7255632B2Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motionAPPLIED MATERIALS INC·Filed 2006·Granted Aug 14, 2007·13 cites·11 claims
- 2092US7175505B1Method for adjusting substrate processing times in a substrate polishing systemAPPLIED MATERIALS INC·Filed 2006·Granted Feb 13, 2007·21 cites·23 claims
- 2192US6716094B2Chemical mechanical polishing retaining ringAPPLIED MATERIALS INC·Filed 2002·Granted Apr 6, 2004·31 cites·13 claims
- 2291US10994389B2Polishing apparatus using neural network for monitoringAPPLIED MATERIALS INC·Filed 2018·Granted May 4, 2021·11 cites·20 claims
- 2391US8352061B2Semi-quantitative thickness determinationAPPLIED MATERIALS INC·Filed 2008·Granted Jan 8, 2013·14 cites·21 claims
- 2491US7952708B2High throughput measurement systemAPPLIED MATERIALS INC·Filed 2008·Granted May 31, 2011·13 cites·21 claims
- 2590US9579767B2Automatic generation of reference spectra for optical monitoring of substratesQIAN JUN·Filed 2011·Granted Feb 28, 2017·8 cites·15 claims
- 2690US7840375B2Methods and apparatus for generating a library of spectraAPPLIED MATERIALS INC·Filed 2008·Granted Nov 23, 2010·12 cites·23 claims
- 2790US7444198B2Determining physical property of substrateAPPLIED MATERIALS INC·Filed 2006·Granted Oct 28, 2008·17 cites·15 claims
- 2890US6443824B2Fluid-pressure regulated wafer polishing headAPPLIED MATERIALS INC·Filed 2001·Granted Sep 3, 2002·25 cites·14 claims
- 2989US8814631B2Tracking spectrum features in two dimensions for endpoint detectionDAVID JEFFREY DRUE·Filed 2011·Granted Aug 26, 2014·13 cites·15 claims
- 3088US12403561B2Eddy current monitoring to detect vibration in polishingAPPLIED MATERIALS INC·Filed 2022·Granted Sep 2, 2025·1 cites·5 claims
- 3188US9375824B2Adjustment of polishing rates during substrate polishing with predictive filtersAPPLIED MATERIALS INC·Filed 2013·Granted Jun 28, 2016·7 cites·19 claims
- 3288US9227293B2Multi-platen multi-head polishing architectureAPPLIED MATERIALS INC·Filed 2013·Granted Jan 5, 2016·6 cites·19 claims
- 3388US8718810B2Semi-quantitative thickness determinationAPPLIED MATERIALS INC·Filed 2012·Granted May 6, 2014·7 cites·15 claims
- 3488US8202738B2Endpoint method using peak location of modified spectraDAVID JEFFREY DRUE·Filed 2011·Granted Jun 19, 2012·9 cites·20 claims
- 3587US11865664B2Profile control with multiple instances of contol algorithm during polishingAPPLIED MATERIALS INC·Filed 2021·Granted Jan 9, 2024·1 cites·19 claims
- 3687US11658078B2Using a trained neural network for use in in-situ monitoring during polishing and polishing systemAPPLIED MATERIALS INC·Filed 2021·Granted May 23, 2023·1 cites·17 claims
- 3787US9142466B2Using spectra to determine polishing endpointsAPPLIED MATERIALS INC·Filed 2013·Granted Sep 22, 2015·6 cites·16 claims
- 3887US8079894B2Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motionTOLLES ROBERT D·Filed 2009·Granted Dec 20, 2011·11 cites·6 claims
- 3987US6126517ASystem for chemical mechanical polishing having multiple polishing stationsAPPLIED MATERIALS INC·Filed 1998·Granted Oct 3, 2000·63 cites·52 claims
- 4086US11850699B2Switching control algorithms on detection of exposure of underlying layer during polishingAPPLIED MATERIALS INC·Filed 2021·Granted Dec 26, 2023·1 cites·18 claims
- 4184US6080046AUnderwater wafer storage and wafer picking for chemical mechanical polishingAPPLIED MATERIALS INC·Filed 1998·Granted Jun 27, 2000·49 cites·26 claims
- 4284US5381004AParticle analysis of notched wafersAPPLIED MATERIALS INC·Filed 1993·Granted Jan 10, 1995·79 cites·21 claims
- 4383US12136574B2Technique for training neural network for use in in-situ monitoring during polishing and polishing systemAPPLIED MATERIALS INC·Filed 2023·Granted Nov 5, 2024·0 cites·17 claims
- 4482US7097544B1Chemical mechanical polishing system having multiple polishing stations and providing relative linear polishing motionAPPLIED MATERIALS INC·Filed 2000·Granted Aug 29, 2006·18 cites·30 claims
- 4581US12057354B2Trained neural network in in-situ monitoring during polishing and polishing systemAPPLIED MATERIALS INC·Filed 2023·Granted Aug 6, 2024·0 cites·21 claims
- 4681US8860932B2Detection of layer clearing using spectral monitoringZHANG JIMIN·Filed 2011·Granted Oct 14, 2014·5 cites·21 claims
- 4781US8369978B2Adjusting polishing rates by using spectrographic monitoring of a substrate during processingAPPLIED MATERIALS INC·Filed 2009·Granted Feb 5, 2013·6 cites·16 claims
- 4881US8014004B2Determining physical property of substrateAPPLIED MATERIALS INC·Filed 2010·Granted Sep 6, 2011·4 cites·20 claims
- 4981US5267017AMethod of particle analysis on a mirror waferAPPLIED MATERIALS INC·Filed 1992·Granted Nov 30, 1993·48 cites·18 claims
- 5080US11780045B2Compensation for substrate doping for in-situ electromagnetic inductive monitoringAPPLIED MATERIALS INC·Filed 2019·Granted Oct 10, 2023·1 cites·19 claims
Showing the top 50 of 111 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →