Inventor · disambiguated record
Ha Na Lee
Also filed as: LEE HA NA
34 granted patents·15 pending applications·251 citations·filing 2003–2024
96Inventor score
Files withLG CHEMICAL LTD19KUMHO TIRE CO INC6HYNIX SEMICONDUCTOR INC5SAMSUNG ELECTRONICS CO LTD3I SENS INC2
Top patents by PatentIndex Score
49 records- 0195US7795139B2Method for manufacturing semiconductor packageHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Sep 14, 2010·47 cites·18 claims
- 0294US7429792B2Stack package with vertically formed heat sinkHYNIX SEMICONDUCTOR INC·Filed 2007·Granted Sep 30, 2008·32 cites·12 claims
- 0389US7898834B2Semiconductor chip with chip selection structure and stacked semiconductor package having the sameHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Mar 1, 2011·18 cites·23 claims
- 0485USD497143STireKUMHO TIRE CO INC·Filed 2003·Granted Oct 12, 2004·31 cites·1 claims
- 0584US7795073B2Method for manufacturing stack package using through-electrodesHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Sep 14, 2010·12 cites·18 claims
- 0683USD549166STire for a carKUMHO TIRE CO LTD·Filed 2006·Granted Aug 21, 2007·30 cites·1 claims
- 0781US10793441B2Method for preparing aluminosilicate particles having excellent dispersion, reinforcing material for rubber comprising the aluminosilicate particles, and rubber composition for tires comprising the reinforcing materialLG CHEMICAL LTD·Filed 2017·Granted Oct 6, 2020·1 cites·10 claims
- 0880US9998523B2Method for controlling file name and electronic device thereofSAMSUNG ELECTRONICS CO LTD·Filed 2013·Granted Jun 12, 2018·3 cites·20 claims
- 0978US12359013B2Curable compositionLG CHEMICAL LTD·Filed 2022·Granted Jul 15, 2025·0 cites·15 claims
- 1077US9872386B2Composition for forming conductive pattern, method for forming conductive pattern using same, and resin structure having conductive patternLG CHEMICAL LTD·Filed 2015·Granted Jan 16, 2018·1 cites·15 claims
- 1169US10093455B2Tongs for sealing opening of bagRUBETTY INC·Filed 2016·Granted Oct 9, 2018·2 cites·15 claims
- 1269USD605579STire for a carKUMHO TIRE CO INC·Filed 2004·Granted Dec 8, 2009·18 cites·1 claims
- 1368USD659011SDecorative package surface designLEE HA-NA·Filed 2011·Granted May 8, 2012·18 cites·1 claims
- 1467USD535940STire for a carKUMHO TIRE CO INC·Filed 2005·Granted Jan 30, 2007·15 cites·1 claims
- 1567US2024191071A1Curable CompositionLG CHEMICAL LTD·Filed 2022·Application pending·0 cites
- 1666US11459444B2Inorganic composite for rubber reinforcement, method for preparing the same, and rubber composition for tires comprising the sameLG CHEMICAL LTD·Filed 2018·Granted Oct 4, 2022·0 cites·12 claims
- 1766US2024132657A1Curable CompositionLG CHEMICAL LTD·Filed 2022·Application pending·0 cites
- 1866US2024186660A1Electrode tab assembly and secondary battery including the sameLG ENERGY SOLUTION LTD·Filed 2022·Application pending·0 cites
- 1963USD498458STireKUMHO TIRE CO INC·Filed 2003·Granted Nov 16, 2004·12 cites·1 claims
- 2062US2024383358A1Unmanned charging device and method for a smart logistics vehicleHYUNDAI MOTOR CO LTD·Filed 2023·Application pending·0 cites
- 2161US7563897B2Naphthalene diimide-Zn(II) complex having selectivity for pyrophosphate, preparation method thereof and detecting method of pyrophosphate using the sameUNIV EWHA IND COLLABORATION·Filed 2007·Granted Jul 21, 2009·0 cites·8 claims
- 2259USD525187STire for a carKUMHO TIRE CO INC·Filed 2004·Granted Jul 18, 2006·10 cites·1 claims
- 2358US10183866B2Composition for forming conductive pattern and resin structure having conductive patternLG CHEMICAL LTD·Filed 2015·Granted Jan 22, 2019·0 cites·7 claims
- 2458US7859102B2Multi-layer stacked wafer level semiconductor package moduleHYNIX SEMICONDUCTOR INC·Filed 2008·Granted Dec 28, 2010·1 cites·13 claims
- 2557US10689499B2Solvent separation apparatus and waste heat utilization methodLG CHEMICAL LTD·Filed 2017·Granted Jun 23, 2020·0 cites·11 claims
- 2657US2022400778A1Baby bibNEW VESSEL INC·Filed 2020·Application pending·0 cites
- 2755US2024140624A1Drone integrated control deviceLEE HA NA·Filed 2024·Application pending·0 cites
- 2853US2015279248A1Electronic information label tag and electronic information label management system including the sameSAMSUNG ELECTRO MECH·Filed 2014·Application pending·0 cites
- 2952US11852647B2Method for predicting the rubber reinforcing effect of organic-inorganic composite for rubber reinforcementLG CHEMICAL LTD·Filed 2018·Granted Dec 26, 2023·0 cites·4 claims
- 3052US11059956B2Organic-inorganic composite for rubber reinforcement, method for preparing the same, and rubber composition for tires comprising the sameLG CHEMICAL LTD·Filed 2018·Granted Jul 13, 2021·0 cites·8 claims
- 3152US2019375645A1Method for preparing aluminosilicate nanoparticles having excellent dispersibility, reinforcing material for rubber comprising the aluminosilicate nanoparticles, and rubber composition for tires comprising the reinforcing materialLG CHEMICAL LTD·Filed 2018·Application pending·0 cites
- 3251US2013078807A1Wafer level chip scale package having an enhanced heat exchange efficiency with an emf shield and a method for fabricating the sameSK HYNIX INC·Filed 2012·Application pending·0 cites
- 3350US12220232B2Apparatus for controlling operations of continuous glucose monitoring systemI SENS INC·Filed 2019·Granted Feb 11, 2025·0 cites·11 claims
- 3450US11091422B2Method for removing monohydric alcohol from esterification and method for preparing ester composition comprising sameLG CHEMICAL LTD·Filed 2018·Granted Aug 17, 2021·0 cites·7 claims
- 3550US10875980B2Reinforcing material for rubber comprising aluminosilicate particles and rubber composition for tires comprising the sameLG CHEMICAL LTD·Filed 2017·Granted Dec 29, 2020·0 cites·5 claims
- 3650US10815358B2Reinforcing material for rubber comprising aluminosilicate particles and rubber composition for tires comprising the sameLG CHEMICAL LTD·Filed 2017·Granted Oct 27, 2020·0 cites·5 claims
- 3750US10630406B2Method for providing mobile coupon and mobile electronic device supporting the sameSAMSUNG ELECTRONICS CO LTD·Filed 2014·Granted Apr 21, 2020·0 cites·15 claims
- 3850US2009184414A1Wafer level chip scale package having an enhanced heat exchange efficiency with an emf shield and a method for fabricating the samePARK CHANG JUN·Filed 2008·Application pending·0 cites
- 3949US10297363B2Composition for forming conductive pattern and resin structure having conductive patternLG CHEMICAL LTD·Filed 2015·Granted May 21, 2019·0 cites·10 claims
- 4049US8338921B2Wafer level chip scale package having an enhanced heat exchange efficiency with an EMF shield and a method for fabricating the samePARK CHANG JUN·Filed 2011·Granted Dec 25, 2012·0 cites·3 claims
- 4148US2023242713A1Curable Composition and Two-Component Curable CompositionLG ENERGY SOLUTION LTD·Filed 2021·Application pending·0 cites
- 4247US10829430B2Ester composition preparation system and ester composition preparation method using sameLG CHEMICAL LTD·Filed 2018·Granted Nov 10, 2020·0 cites·10 claims
- 4347US2021007641A1Continuous biometric information measuring device using sensor usage information stored in memoryI SENS INC·Filed 2019·Application pending·0 cites
- 4446US10766843B2Method for purifying phenolLG CHEMICAL LTD·Filed 2016·Granted Sep 8, 2020·0 cites·9 claims
- 4546US2014181737A1Method for processing contents and electronic device thereofSAMSUNG ELECTRONICS CO LTD·Filed 2013·Application pending·0 cites
- 4640US2017096566A1Composition for forming conductive pattern, method of forming conductive pattern using the same, and resin structure having conductive patternLG CHEMICAL LTD·Filed 2015·Application pending·0 cites
- 4739US2013235740A1Method and mobile terminal for managing circuit switched fallback procedure and network registrationPANTECH CO LTD·Filed 2012·Application pending·0 cites
- 4838US10354774B2Composition for forming conductive pattern and resin structure having conductive patternLG CHEMICAL LTD·Filed 2015·Granted Jul 16, 2019·0 cites·10 claims
- 4929USD555577STire for a carKUMHO TIRE CO INC·Filed 2006·Granted Nov 20, 2007·0 cites·1 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →