Inventor · disambiguated record
Hao Liu
Also filed as: LIU HAO · LIU HAO-YEH
11 granted patents·101 citations·filing 2005–2018
89Inventor score
Files withUNITED MICROELECTRONICS CORP3TOH CHIN HOCK2UNITED TEST & ASSEMBLY CT LT2BIDIN RAHAMAT1KOLAN RAVI KANTH1
Top patents by PatentIndex Score
11 records- 0197US8426246B2Vented die and packageTOH CHIN HOCK·Filed 2012·Granted Apr 23, 2013·50 cites·21 claims
- 0293US9379242B1Method of fabricating fin field effect transistorUNITED MICROELECTRONICS CORP·Filed 2015·Granted Jun 28, 2016·13 cites·16 claims
- 0390US9524967B1Semiconductor device and method of forming the sameUNITED MICROELECTRONICS CORP·Filed 2016·Granted Dec 20, 2016·8 cites·18 claims
- 0486US8143719B2Vented die and packageTOH CHIN HOCK·Filed 2008·Granted Mar 27, 2012·13 cites·29 claims
- 0578US8586465B2Through silicon via dies and packagesLIU HAO·Filed 2008·Granted Nov 19, 2013·7 cites·15 claims
- 0675US8741762B2Through silicon via dies and packagesUNITED TEST & ASSEMBLY CT LT·Filed 2013·Granted Jun 3, 2014·3 cites·21 claims
- 0764US8030761B2Mold design and semiconductor packageUNITED TEST & ASSEMBLY CT LT·Filed 2008·Granted Oct 4, 2011·2 cites·19 claims
- 0858US8544755B2Subscriber identity module (SIM) cardBIDIN RAHAMAT·Filed 2011·Granted Oct 1, 2013·2 cites·20 claims
- 0958US7816775B2Multi-die IC package and manufacturing methodUNITED TEST & ASSEMBLY CT LTD·Filed 2005·Granted Oct 19, 2010·2 cites·14 claims
- 1056US8399985B2Mold design and semiconductor packageKOLAN RAVI KANTH·Filed 2011·Granted Mar 19, 2013·1 cites·20 claims
- 1150US10818556B2Method for forming a semiconductor structureUNITED MICROELECTRONICS CORP·Filed 2018·Granted Oct 27, 2020·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →