Inventor · disambiguated record
Hayato Noguchi
Also filed as: NOGUCHI HAYATO
9 granted patents·1 pending application·312 citations·filing 1997–2002
91Inventor score
Technology areasH10P
Files withLINTEC CORP10
Top patents by PatentIndex Score
10 records- 0187US6702910B2Process for producing a chipLINTEC CORP·Filed 2001·Granted Mar 9, 2004·36 cites·3 claims
- 0287US6398892B1Method of using pressure sensitive adhesive double coated sheetLINTEC CORP·Filed 1999·Granted Jun 4, 2002·91 cites·14 claims
- 0377US6718223B1Method of processing semiconductor wafer and semiconductor wafer supporting memberLINTEC CORP·Filed 2000·Granted Apr 6, 2004·22 cites·9 claims
- 0476US6436795B2Process for producing semiconductor chipLINTEC CORP·Filed 2001·Granted Aug 20, 2002·20 cites·4 claims
- 0576US5976691AProcess for producing chip and pressure sensitive adhesive sheet for said processLINTEC CORP·Filed 1997·Granted Nov 2, 1999·42 cites·4 claims
- 0675US6225194B1Process for producing chip and pressure sensitive adhesive sheet for said processLINTEC CORP·Filed 1999·Granted May 1, 2001·40 cites·3 claims
- 0763US6312800B1Pressure sensitive adhesive sheet for producing a chipLINTEC CORP·Filed 1998·Granted Nov 6, 2001·24 cites·11 claims
- 0863US5942578AEnergy beam curable pressure sensitive adhesive composition and use thereofLINTEC CORP·Filed 1997·Granted Aug 24, 1999·29 cites·6 claims
- 0961US7105226B2Pressure sensitive adhesive double coated sheet and method of use thereofLINTEC CORP·Filed 2002·Granted Sep 12, 2006·8 cites·4 claims
- 1040US2003031866A1Pressure sensitive adhesive double coated sheetLINTEC CORP·Filed 2002·Application pending·0 cites
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →