Inventor · disambiguated record
Haruo Sudo
Also filed as: SUDO HARUO
10 granted patents·10 pending applications·9 citations·filing 1989–2024
80Inventor score
Files withGLOBALWAFERS JAPAN CO LTD13SENDA TAKESHI4ASAHI OPTICAL CO LTD1GLOBAL WAFERS JAPAN CO LTD1ISOGAI HIROMICHI1
Top patents by PatentIndex Score
20 records- 0167US2024393052A1Heat treatment apparatus, method of maintaining heat treatment apparatus, and method of regenerating lamp sleeveGLOBALWAFERS JAPAN CO LTD·Filed 2024·Application pending·0 cites
- 0265US11162191B2Thermal processing method for silicon waferGLOBALWAFERS JAPAN CO LTD·Filed 2017·Granted Nov 2, 2021·1 cites·4 claims
- 0363US8476149B2Method of manufacturing single crystal silicon wafer from ingot grown by Czocharlski process with rapid heating/cooling processISOGAI HIROMICHI·Filed 2009·Granted Jul 2, 2013·3 cites·10 claims
- 0462US10141180B2Silicon wafer and method for manufacturing the sameGLOBALWAFERS JAPAN CO LTD·Filed 2014·Granted Nov 27, 2018·1 cites·3 claims
- 0560US2024395584A1Heat treatment apparatus and semiconductor substrate manufacturing methodGLOBALWAFERS JAPAN CO LTD·Filed 2024·Application pending·0 cites
- 0659US2025138080A1Evaluation method of metal contaminationGLOBALWAFERS JAPAN CO LTD·Filed 2024·Application pending·0 cites
- 0759US2024339315A1Method of manufacturing silicon wafersGLOBALWAFERS JAPAN CO LTD·Filed 2024·Application pending·0 cites
- 0858US2024379341A1Method of manufacturing semiconductor wafers and method of manufacturing semiconductor devicesGLOBALWAFERS JAPAN CO LTD·Filed 2024·Application pending·0 cites
- 0958US2024363363A1Method of manufacturing semiconductor wafer and semiconductor deviceGLOBALWAFERS JAPAN CO LTD·Filed 2024·Application pending·0 cites
- 1057US12371813B2Silicon wafer and method for producing silicon waferGLOBALWAFERS JAPAN CO LTD·Filed 2021·Granted Jul 29, 2025·0 cites·4 claims
- 1150US2024304458A1Method for manufacturing silicon wafer and silicon waferGLOBAL WAFERS JAPAN CO LTD·Filed 2022·Application pending·0 cites
- 1246US2023073641A1Manufacturing method for semiconductor silicon waferGLOBALWAFERS JAPAN CO LTD·Filed 2021·Application pending·0 cites
- 1345US11060983B2Evaluation method of silicon waferGLOBALWAFERS JAPAN CO LTD·Filed 2018·Granted Jul 13, 2021·0 cites·6 claims
- 1441US8252700B2Method of heat treating silicon waferSENDA TAKESHI·Filed 2010·Granted Aug 28, 2012·0 cites·8 claims
- 1540US10648101B2Silicon waferGLOBALWAFERS JAPAN CO LTD·Filed 2017·Granted May 12, 2020·0 cites·12 claims
- 1639US8999864B2Silicon wafer and method for heat-treating silicon waferSENDA TAKESHI·Filed 2010·Granted Apr 7, 2015·0 cites·4 claims
- 1737US2013078588A1Method for heat-treating silicon waferSENDA TAKESHI·Filed 2012·Application pending·0 cites
- 1834US8399341B2Method for heat treating a silicon waferSENDA TAKESHI·Filed 2010·Granted Mar 19, 2013·0 cites·8 claims
- 1934US2016293446A1Method for manufacturing a silicon waferGLOBALWAFERS JAPAN CO LTD·Filed 2016·Application pending·0 cites
- 2030US5058975AFiber optic mixing deviceASAHI OPTICAL CO LTD·Filed 1989·Granted Oct 22, 1991·4 cites·6 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →