Inventor · disambiguated record
He Ren
Also filed as: REN HE
64 granted patents·16 pending applications·525 citations·filing 2013–2025
98Inventor score
Top patents by PatentIndex Score
80 records- 0198US9384997B2Dry-etch selectivityAPPLIED MATERIALS INC·Filed 2015·Granted Jul 5, 2016·146 cites·20 claims
- 0298US8969212B2Dry-etch selectivityAPPLIED MATERIALS INC·Filed 2013·Granted Mar 3, 2015·184 cites·20 claims
- 0396US10957533B2Methods for etching a structure for semiconductor applicationsAPPLIED MATERIALS INC·Filed 2019·Granted Mar 23, 2021·15 cites·20 claims
- 0496US10636704B2Seam-healing method upon supra-atmospheric process in diffusion promoting ambientAPPLIED MATERIALS INC·Filed 2018·Granted Apr 28, 2020·14 cites·20 claims
- 0596US9576810B2Process for etching metal using a combination of plasma and solid state sourcesAPPLIED MATERIALS INC·Filed 2014·Granted Feb 21, 2017·40 cites·19 claims
- 0695US10916433B2Methods of forming metal silicide layers and metal silicide layers formed therefromAPPLIED MATERIALS INC·Filed 2019·Granted Feb 9, 2021·14 cites·16 claims
- 0795US10049927B2Seam-healing method upon supra-atmospheric process in diffusion promoting ambientAPPLIED MATERIALS INC·Filed 2016·Granted Aug 14, 2018·14 cites·20 claims
- 0895US9761489B2Self-aligned interconnects formed using substractive techniquesAPPLIED MATERIALS INC·Filed 2013·Granted Sep 12, 2017·20 cites·2 claims
- 0992US9640424B2Integrated metal spacer and air gap interconnectAPPLIED MATERIALS INC·Filed 2016·Granted May 2, 2017·6 cites·20 claims
- 1091US9646876B2Aluminum nitride barrier layerAPPLIED MATERIALS INC·Filed 2015·Granted May 9, 2017·9 cites·10 claims
- 1190US9269563B2Methods for forming interconnect structure utilizing selective protection process for hardmask removal processAPPLIED MATERIALS INC·Filed 2014·Granted Feb 23, 2016·9 cites·18 claims
- 1288US11410885B2Fully aligned subtractive processes and electronic devices therefromAPPLIED MATERIALS INC·Filed 2020·Granted Aug 9, 2022·2 cites·10 claims
- 1388US10643895B2Self-aligned interconnects formed using subtractive techniquesAPPLIED MATERIALS INC·Filed 2017·Granted May 5, 2020·5 cites·14 claims
- 1487US9305831B2Integrated metal spacer and air gap interconnectAPPLIED MATERIALS INC·Filed 2015·Granted Apr 5, 2016·4 cites·20 claims
- 1586US10256144B2Process integration approach of selective tungsten via fillAPPLIED MATERIALS INC·Filed 2017·Granted Apr 9, 2019·5 cites·20 claims
- 1684US9508561B2Methods for forming interconnection structures in an integrated cluster system for semicondcutor applicationsAPPLIED MATERIALS INC·Filed 2014·Granted Nov 29, 2016·6 cites·20 claims
- 1782US10790191B2Selective removal process to create high aspect ratio fully self-aligned viaMICROMATERIALS LLC·Filed 2019·Granted Sep 29, 2020·3 cites·15 claims
- 1881US9601431B2Dielectric/metal barrier integration to prevent copper diffusionAPPLIED MATERIALS INC·Filed 2014·Granted Mar 21, 2017·4 cites·1 claims
- 1980US11380536B2Multi-step pre-clean for selective metal gap fillAPPLIED MATERIALS INC·Filed 2020·Granted Jul 5, 2022·1 cites·18 claims
- 2080US11164780B2Process integration approach for selective metal via fillAPPLIED MATERIALS INC·Filed 2019·Granted Nov 2, 2021·3 cites·15 claims
- 2180US10388533B2Process integration method to tune resistivity of nickel silicideAPPLIED MATERIALS INC·Filed 2018·Granted Aug 20, 2019·2 cites·20 claims
- 2280US10008448B2Dielectric/metal barrier integration to prevent copper diffusionAPPLIED MATERIALS INC·Filed 2017·Granted Jun 26, 2018·2 cites·14 claims
- 2379US11437274B2Fully self-aligned viaMICROMATERIALS LLC·Filed 2020·Granted Sep 6, 2022·1 cites·9 claims
- 2478US10727119B2Process integration approach of selective tungsten via fillAPPLIED MATERIALS INC·Filed 2019·Granted Jul 28, 2020·2 cites·20 claims
- 2578US10109520B2Methods for depositing dielectric barrier layers and aluminum containing etch stop layersAPPLIED MATERIALS INC·Filed 2016·Granted Oct 23, 2018·2 cites·14 claims
- 2677US12046508B2Method of dielectric material fill and treatmentAPPLIED MATERIALS INC·Filed 2023·Granted Jul 23, 2024·0 cites·20 claims
- 2776US10692759B2Methods for manufacturing an interconnect structure for semiconductor devicesAPPLIED MATERIALS INC·Filed 2018·Granted Jun 23, 2020·2 cites·20 claims
- 2876US9299605B2Methods for forming passivation protection for an interconnection structureAPPLIED MATERIALS INC·Filed 2014·Granted Mar 29, 2016·3 cites·20 claims
- 2974US10685849B1Damage free metal conductor formationAPPLIED MATERIALS INC·Filed 2019·Granted Jun 16, 2020·1 cites·20 claims
- 3072US2024213088A1Subtractive metals and subtractive metal semiconductor structuresAPPLIED MATERIALS INC·Filed 2024·Application pending·0 cites
- 3171US9299577B2Methods for etching a dielectric barrier layer in a dual damascene structureAPPLIED MATERIALS INC·Filed 2014·Granted Mar 29, 2016·2 cites·18 claims
- 3267US11967527B2Fully aligned subtractive processes and electronic devices therefromAPPLIED MATERIALS INC·Filed 2022·Granted Apr 23, 2024·0 cites·8 claims
- 3367US11615984B2Method of dielectric material fill and treatmentAPPLIED MATERIALS INC·Filed 2020·Granted Mar 28, 2023·0 cites·20 claims
- 3466US11923244B2Subtractive metals and subtractive metal semiconductor structuresAPPLIED MATERIALS INC·Filed 2021·Granted Mar 5, 2024·0 cites·20 claims
- 3566US11776806B2Multi-step pre-clean for selective metal gap fillAPPLIED MATERIALS INC·Filed 2022·Granted Oct 3, 2023·0 cites·17 claims
- 3666US2023045689A1Method of forming interconnect for semiconductor deviceAPPLIED MATERIALS INC·Filed 2022·Application pending·0 cites
- 3765US11908696B2Methods and devices for subtractive self-alignmentAPPLIED MATERIALS INC·Filed 2022·Granted Feb 20, 2024·0 cites·10 claims
- 3865US10651043B2Process integration method to tune resistivity of nickel silicideAPPLIED MATERIALS INC·Filed 2019·Granted May 12, 2020·0 cites·20 claims
- 3965US9514953B2Methods for barrier layer removalAPPLIED MATERIALS INC·Filed 2014·Granted Dec 6, 2016·1 cites·20 claims
- 4064US12002705B2Methods and apparatus for forming backside power railsAPPLIED MATERIALS INC·Filed 2022·Granted Jun 4, 2024·0 cites·20 claims
- 4164US11289342B2Damage free metal conductor formationAPPLIED MATERIALS INC·Filed 2020·Granted Mar 29, 2022·0 cites·20 claims
- 4264US10438849B2Microwave anneal to improve CVD metal gap-fill and throughputAPPLIED MATERIALS INC·Filed 2016·Granted Oct 8, 2019·1 cites·22 claims
- 4363US12062545B2Fluorine-free tungsten ALD for dielectric selectivity improvementAPPLIED MATERIALS INC·Filed 2021·Granted Aug 13, 2024·0 cites·13 claims
- 4463US11705366B2Methods for controllable metal and barrier-liner recessMICROMATERIALS LLC·Filed 2021·Granted Jul 18, 2023·0 cites·5 claims
- 4563US9793108B2Interconnect integration for sidewall pore seal and via cleanlinessAPPLIED MATERIALS INC·Filed 2015·Granted Oct 17, 2017·1 cites·19 claims
- 4663US2022359289A1Fully self-aligned viaMICROMATERIALS LLC·Filed 2022·Application pending·0 cites
- 4762US11257677B2Methods and devices for subtractive self-alignmentAPPLIED MATERIALS INC·Filed 2020·Granted Feb 22, 2022·0 cites·11 claims
- 4862US2025157851A1Method and Apparatus for Forming Backside Power RailsAPPLIED MATERIALS INC·Filed 2023·Application pending·0 cites
- 4961US9257330B2Ultra-thin structure to protect copper and method of preparationAPPLIED MATERIALS INC·Filed 2014·Granted Feb 9, 2016·1 cites·20 claims
- 5060US11037825B2Selective removal process to create high aspect ratio fully self-aligned viaMICROMATERIALS LLC·Filed 2020·Granted Jun 15, 2021·0 cites·10 claims
Showing the top 50 of 80 patent records by PatentIndex Score.
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →