Inventor · disambiguated record
Hee Yong Shim
Also filed as: SHIM HEE YONG
12 granted patents·9 citations·filing 2012–2020
82Inventor score
Top patents by PatentIndex Score
12 records- 0174US9278505B2Thermosetting resin composition and prepreg and metal clad laminate using the sameSHIM HEE-YONG·Filed 2012·Granted Mar 8, 2016·5 cites·8 claims
- 0271US11597837B2Thermosetting resin composition for semiconductor package, prepreg and metal clad laminate using the sameLG CHEMICAL LTD·Filed 2020·Granted Mar 7, 2023·1 cites·13 claims
- 0370US10294341B2Thermosetting resin composition for semiconductor package and prepreg using the sameLG CHEMICAL LTD·Filed 2016·Granted May 21, 2019·2 cites·12 claims
- 0465US11091630B2Resin composition for semiconductor package, prepreg, and metal clad laminate using the sameLG CHEMICAL LTD·Filed 2018·Granted Aug 17, 2021·1 cites·14 claims
- 0562US10913849B2Resin composition for semiconductor package, and prepreg and metal clad laminate using the sameLG CHEMICAL LTD·Filed 2018·Granted Feb 9, 2021·0 cites·13 claims
- 0651US11274218B2Thermosetting resin composition for coating metal thin film and metal laminate using the sameLG CHEMICAL LTD·Filed 2018·Granted Mar 15, 2022·0 cites·11 claims
- 0750US12129338B2Thermosetting resin composition for semiconductor package, prepreg and metal clad laminate using the sameLG CHEMICAL LTD·Filed 2019·Granted Oct 29, 2024·0 cites·10 claims
- 0850US12091510B2Thermosetting resin composite and metal clad laminate using the sameLG CHEMICAL LTD·Filed 2019·Granted Sep 17, 2024·0 cites·7 claims
- 0949US11535750B2Thermosetting resin composition for semiconductor package and prepreg and metal clad laminate using the sameLG CHEMICAL LTD·Filed 2014·Granted Dec 27, 2022·0 cites·8 claims
- 1045US11459449B2Thermosetting resin composition for coating metal thin film and metal laminate using the sameLG CHEMICAL LTD·Filed 2018·Granted Oct 4, 2022·0 cites·15 claims
- 1145US11193015B2Thermosetting resin composition for semiconductor package and prepreg using the sameLG CHEMICAL LTD·Filed 2019·Granted Dec 7, 2021·0 cites·12 claims
- 1238US11214677B2Resin composition for semiconductor package, prepreg and metal clad laminate using the sameLG CHEMICAL LTD·Filed 2018·Granted Jan 4, 2022·0 cites·11 claims
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Identity basis: PatentsView inventor disambiguation (2025Q4-odp release). How scoring works →